技術工程類 - RF通訊工程師【南港】
Job Description
1. Participate in the design and development of Base-Band or RF HW System-in-Package(SiP) modules
2. Use simulation tools such as Cadence, HFSS, Siwave and ADS for design verification and optimization
3. Electrical measurements using power supplies, oscilloscopes, VNAs, and signal generators
4. SiP module schematic design, layout planning and BOM release
5. Collaborate with packaging, layout, and process teams to evaluate the impact of SiP, fan-out, and substrate structures on electrical performance
About us
Who We Are and What We Do
All around us, digital transformation is changing the way PEOPLE live, work, play and communicate. As a leading provider of semiconductor packaging and test services, ASE is playing a significant role in the development of the world’s most innovative electronics. Our technologies have also enabled our customers to create cutting edge products that deliver superior performance, power, speed and connectivity.