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研發-Package Design Engineer-台元辦公室-ATT240059
Job Description
如欲投遞履歷,請上Amkor官網 https://careers.amkor.com.tw/
Job responsibilities for this position includes physical design/layout in FC and Wirebond substrate based technology, package selection, and design rule implementation.
This involves optimizing system co-design of IC and Package, IC floor-planning, ball array optimization to meet signal & power integrity, assembly, and thermal constraints.
About us
◆艾克爾國際 艾克爾國際科技(Amkor Technology)為全球級先進半導體封裝與測試服務提供商。以策略製造夥伴的角色，提供全球超過兩百家居於領導地位的半導體公司與OEM廠，並強調技術的穩健與創新，致力於改善現有產品製程的效能與積極發展新封裝與測試服務。
◆於1968年創立於美國賓州，目前在美國、日本、韓國、菲律賓、上海、馬來西亞、葡萄牙、台灣都有生產據點，全球員工總數約38,000人，並在那斯達克股票公開上市(Nasdaq: AMKR)。
◆艾克爾台灣 艾克爾於2001年合併上寶半導體與台宏半導體，成立艾克爾台灣分公司，2004年併購眾晶科技成立湖口廠，同年入主悠立半導體。台灣地區現有龍潭廠、湖口廠、先進廠與龍科廠。
【龍潭廠】 地址：325 桃園市龍潭區中豐路高平段一號
【湖口廠】 地址：303 新竹縣湖口鄉湖口工業區光復路11號
【先進廠】 地址：303 新竹縣湖口鄉湖口工業區光復北路39號
【龍科廠】 地址：325 桃園市龍潭區龍園一路333號
歡迎加入Amkor 全球半導體封裝測試大廠，請至Amkor人才招募網站 https://careers.amkor.com.tw/ 維護您的履歷表。
