Celestica

Designs complex printed circuit boards from schematic netlist to production of manufacturing data, typically ranging from 6-56 layers count with a high density per square inch factor including BGA and uBGA packages. Participates as needed, in product design including board planning and design, schematic reviews, DFx reviews, High-speed layout guidelines, validation and introduction to manufacturing. The candidate must also be very comfortable working with team members at other sites and time zones, and working with customers. Be willing to travel if needed. Capable to lead a complex project PCB design.Capable top-down the PCB design from Planning to detail PCB design.Capable maintain PCB design guide and guide the Jr. Engineers;Capable supervises other designers and helps to troubleshoot and solve CAD software problems.Estimates effort spending accurately by PCB by project.Maintains PCB design integrity through updates and records of changes.Directs workload appropriately. Meets with team leaders, clients and designers to develop and improve designs and processes.Be the prime customer interface to ensure customer requirements are implemented and any potential issues resolved and customer satisfaction is met.May lead a work group or project team consisting of one or more support staff and/or tech/professional staff with some coaching from own supervisor, or may provide advice and guidance in area of specialty.The designer must be able to initiate and lead activities to improve the design process and increase the efficiency of the design tools.Evaluates, recommends and tests CAD software and other programs necessary for PC design.Seeks out new approaches for building internal and external relationships; maintains contacts with existing relationships.

Develop SI and PI design for server/storage/communication products. Major works are to serve as the signal integrity analyst and designer provides the support to internal team, suppliers, and customers to deliver the new products. Job Responsibilities: • PCB material choosing and stack-up definition. • 3D passive channel modeling, perform SerDes channel extraction using electromagnetic tools. • Perform signal integrity pre-layout and post-layout analysis in RD phase. • Perform static timing and signal integrity analysis of parallel (common clock, source-synchronous) interfaces. • Design and analysis of multi-gigabit serial links, including lab verification and tuning. • Perform power integrity analysis on power delivery network. • Generate and verify PCB layout rules, manage constraints for PCB layout. • Work directly with ASIC and PCB design teams to evaluate design tradeoffs and optimize design performance / risk / cost / manufacturability. • Cooperate with RD team and signal test engineers on debugging, failure analysis and fixing issues discovered during test. • Be familiar with SAS, PCIe, DDR3/4, 25G/56G Ethernet specification is a plus.

The successful candidate will be a self-starter who likes to take responsibility and works best with little supervision. Likes to perform a variety of tasks and have the ability to handle multiple priorities and has previously performed in a similar position. This is a 'hands-on' role requiring a strong technical background and product development experience. Duties:Identify technical issues, troubleshoot and resolve them by coordinating with RD, Manufacturing and Field teams.Participate in customer technical meetings and prepare training programs for internal subordinates.Hardware validation of Networking, Storage, Server products against customer's infield issues, requirements and Mfg. issues during NPI or RMA.System validation including DVT (Design Validation Trial), SPIT (Signal, Power, Integrity Timing) environmental regulatory approval.Qualify alternative components for compatibility, cost effectiveness and benchmarking.Support Manufacturing Engineering and Test Engineers on trouble shooting and resolving technical issues and root cause analysis.Work with software teams to identify root cause of system failure.Ability to install software such as Linux based Operating Systems, ONIE, BIOS, BMC, SES.Proficient in using various test and measurement equipment including but not limited to Oscilloscope, Impedance analyzer, Power meter, Signal analyzer, Spectrum.

Celestica is looking for experienced system Verification SME (Subject Matter Expert) to help define and guide Celestica next generation rack level platforms qualification which integrates like switch, Server, GPU, Cable backplane and power distributions, etc. The right candidate will play a key role to make sure our product has high quality to meet our key customers in the carrier and hyper scale area. The ideal candidate is a system design background with rack level products experience in the areas of terabit switch, high performance computing, and AI/ML area. Guide and provide guideline on Celestica system verification test case and test coverage： includes element function test, hardware integration test, system integration verification and system validation. The major response is to make sure system coverage is good enough to meet product verification and market requirement. Lead rack level products test architecture, and make test strategy solution for customers.Play as contact windows of customer validation team. Bridge customers, design team and rack integration vendor as well.Streamline test procedures from project planning phase, to development to final releases.Improve test efficiency through deploying modern test tools and test automationsKeep improving test coverage by guiding the team to design/develop new casesOptimized Test Process balancing cost, coverage and test time with the design team.Quantitative management to lead the team continuous improvement.Drive the cross verification and automation teams with Test Lead/TestArchitecture/Automation/Test Execution.Candidates should be able to accommodate up to 10% travel to US and Asia.

Lead development of production test strategies based on product design specification.Lead the development of test plans and requirements for customer products including both hardware and software elements.Lead the procurement, qualification, and installation support for manufacturing across the factory.Be accountable for the test process optimization with a focus on productivity improvements to cycle time and yield across a factory serving multiple customersProvide project leadership, including management of (and communication with) team members, suppliers for comprehensive test deployments including structural, functional, system, stress and final test applications at the factory levelSupport sales process by providing support to the quoting process.Work with design to enhance solution with feedback from product testability, test coverage, diagnosability, reparability, firmware/diagnostics and user experience.Keep up to date with relevant industry knowledge and regulationsLead and drive complex problems related to product yield or test performance.Industry recognized expert in a specific test domainProvide company-wide test strategy support including training, capital investment, aged equipment rotation, supplier relationship management and industry equipment evaluation for the purpose of capital planning.Set yearly plans and goals for his department, give direction on expected performance, provide regular performance evaluations and ongoing feedback. Accountable for all department objectives and achieving agreed targets for key performance indicators.

Responsible for understanding the customer’s technical roadmap, product design architecture and applicationsUnderstand manufacturing requirements and identify capability deficiency in PCBdesign, soldering processes and thermal management.Evaluate potential manufacturing impact from the design concept of each product.Negotiate trade-offs for DFX issues with customers, suppliers of PCB, components and manufacturing for delivering a cost-effective solution with proven reliability.Investigate all manufacturing processes related technical issues and provide technical solutions for products in the full life cycle.Manage multiple projects simultaneously and meet tight deadlines.

1.測試產品規格，並執行除錯及法規認證。 2.編寫程式、除錯、追蹤與修改程式碼以改善軟體執行效率。 3.設計通訊演算法，並進行擬真與實現。 4.評估相關零件模組規格。 5.執行系統分割或功能方塊劃分，並評估所需之系統資源。

1.測試產品規格，並執行除錯及法規認證。 2.編寫程式、除錯、追蹤與修改程式碼以改善軟體執行效率。 3.設計通訊演算法，並進行擬真與實現。 4.評估相關零件模組規格。 5.執行系統分割或功能方塊劃分，並評估所需之系統資源。

In this position, you will be responsible for switch/router product architect and lead complex product design. Your responsibilities will include but not be limited to: Co-work with front end team and program team to response customer technical requirement, lead technical discussion with customer or front end team;Define system architect, trade off product requirement, performance, cost, and risk, etc.Following technology trend and contribute to product roadmap definition.Lead complex product design like chassis level modular switch/route from technical point of view.Consultant and lead complex issue debug and troubleshooting;