



Role Summary
We are looking for a visionary Datacenter Compute Platform Architect to enable our cutting-edge silicon on the platform. While our SoC architects focus on what goes inside the chip, you will be the owner of the system that surrounds it.
In this role, you will define the end-to-end server platform architecture, ensuring our CPUs operate at peak performance, efficiency, and reliability within cloud infrastructure. You will drive hardware specifications spanning power delivery, thermal management, memory topologies, high-speed I/O routing, and system management. You will work closely with internal silicon teams, firmware engineers, and external OEM/ODM partners and hyperscale customers to bring next-generation compute platforms from concept to mass deployment.
Key Responsibilities
• Platform Architecture Definition: Define the compute system architecture (workstation, 1U/2U, multi-node, OCP form factors) surrounding our Datacenter compute SoC.
• Power & Thermal Management: Architect system-level power delivery networks (PDN/VRM specs) and collaborate on advanced thermal solutions (air and liquid cooling) to meet strict datacenter TDP constraints.
• High-Speed I/O & Memory: Define system-level topologies and routing guidelines for high-speed interfaces, including LP/DDR5/6, PCIe Gen 5/6, and CXL. Ensure Signal Integrity (SI) and Power Integrity (PI) targets are met at the board level.
• Server Management & Security: Define architectures for Baseboard Management Controllers (BMC), OpenBMC integration, hardware Root of Trust (RoT), and system-level security (e.g., SPDM, TPMs).
• Firmware/OS Co-Design: Partner with SoC silicon, BIOS/UEFI, OS, and firmware teams to define ACPI tables, RAS (Reliability, Availability, and Serviceability) flows, and power management states.
• Ecosystem & Partner Enablement: Act as the primary technical interface for Tier-1 ODMs, OEMs, and Cloud Service Providers (CSPs) to ensure successful platform design, validation, and deployment.
• Education: Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field.
• Industry Experience: 10+ years of experience in server system architecture, motherboard design, or datacenter hardware engineering.
• Hardware Expertise: Deep understanding of x86, ARM, or RISC-V server/SoC architectures, AI compute engine, multi-socket topologies, and enterprise-grade hardware design.
• Interfaces & Standards: Expert knowledge of datacenter connectivity standards, including PCIe, CXL, Ethernet, and memory technologies (DDR4/5, LPDDR). Strong background in guiding SI/PI teams and understanding the physical limitations of high-speed PCB design.
• System Management: Solid understanding of server manageability standards (IPMI, Redfish, NC-SI) and BMC architectures. Hands-on experience defining end-to-end RAS (Reliability, Availability, Serviceability) architectures.
• Communication: Proven ability to write detailed platform specifications and present complex system-level trade-offs to both silicon designers and external customers.
• Advanced System Design: Experience with Open Compute Project (OCP) specifications (e.g., OAM, DC-MHS) and modern hyperscaler rack architectures.
• Advanced Packaging/Chiplets: Understanding of how multi-die/chiplet SoC architectures impact system-level power delivery and thermal dissipation.
聯發科技成立於1997年,透過持續投資先進製程與前瞻技術,現已成長為全球領先的IC設計公司,提供涵蓋智慧手持裝置、智慧家庭應用、無線連結技術及物聯網產品等多個領域的系統晶片整合解决方案(SoC),並居市場領先地位。聯發科技一年約出貨15億顆晶片落實在上億台的終端產品在全球各地上市。聯發科技提供高度整合與創新性的晶片設計方案,不僅協助製造商優化供應鏈及縮短新產品開發時間,還利於其在全球成熟及發展中市場建立競爭優勢。
聯發科技致力讓科技產品更普及,因為我們相信科技能夠改善人類的生活、與世界連結,每個人都有潛力利用科技創造無限可能(Everyday Genius)。了解更多訊息,請瀏覽:www.mediatek.com.