



Role Summary
We are seeking a highly experienced and visionary Datacenter Compute SoC Architect to lead the definition, design, and optimization of our next-generation high-performance computing SoCs. In this critical role, you will be responsible for defining the system-on-chip architecture for scalable datacenter processors, balancing Power, Performance, and Area (PPA) constraints while meeting aggressive cloud-scale workloads.
You will work cross-functionally with CPU/Compute core architects, IP designers, performance modeling teams, and software/firmware engineers to deliver world-class silicon that powers the future of cloud computing and AI infrastructure.
Key Responsibilities
• SoC Architecture Definition: Lead the architectural definition of next-generation datacenter Compute SoCs, including core/instance counts, cache hierarchies, coherent interconnects, and memory subsystems.
• IP Selection & Integration: Define requirements and drive decisions for third-party and internal IPs (e.g., PCIe Gen 5/6, CXL, DDR5/HBM controllers, Network-on-Chip/NoC, and security enclaves).
• PPA Optimization: Conduct rigorous Power, Performance, and Area (PPA) trade-off analysis to ensure the SoC meets strict datacenter efficiency and performance-per-watt targets.
• Advanced Packaging Strategy: Collaborate with packaging teams on multi-die/chiplet-based architectures, die-to-die (D2D) interconnect protocols (e.g., UCIe), and advanced thermal solutions.
• HW/SW Co-Design: Partner closely with firmware, OS, and cloud infrastructure software teams to ensure the hardware architecture optimally supports modern hypervisors, cloud-native workloads, and virtualization technologies.
• Performance Modeling: Work with the performance modeling team to define use cases, guide the creation of C++/SystemC architectural models, and analyze simulation data to identify bottlenecks.
• Technical Leadership: Write detailed architecture specifications and serve as the technical lead during the RTL implementation, verification, and silicon bring-up phases.
• Education: Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field.
• Experience: 10+ years of proven industry experience in SoC, Compute/CPU, or system architecture, with a minimum of 3 years focusing on high-performance server, datacenter, or network processor SoCs.
• Technical Expertise:
- Deep understanding of high-performance CPU architectures (ARM, x86, or RISC-V) or Compute architectures.
- Extensive knowledge of coherent fabrics and interconnects (e.g., ARM AMBA CHI, AXI, proprietary NoCs).
- Strong expertise in memory hierarchy, cache coherency protocols, and main memory technologies (DDR4/5, LPDDR, HBM).
- Solid understanding of high-speed I/O interfaces (PCIe, CXL, Ethernet).
•_x0001_Communication: Exceptional written and verbal communication skills, with the ability to distill complex architectural concepts into clear specifications for cross-functional teams.
聯發科技成立於1997年,透過持續投資先進製程與前瞻技術,現已成長為全球領先的IC設計公司,提供涵蓋智慧手持裝置、智慧家庭應用、無線連結技術及物聯網產品等多個領域的系統晶片整合解决方案(SoC),並居市場領先地位。聯發科技一年約出貨15億顆晶片落實在上億台的終端產品在全球各地上市。聯發科技提供高度整合與創新性的晶片設計方案,不僅協助製造商優化供應鏈及縮短新產品開發時間,還利於其在全球成熟及發展中市場建立競爭優勢。
聯發科技致力讓科技產品更普及,因為我們相信科技能夠改善人類的生活、與世界連結,每個人都有潛力利用科技創造無限可能(Everyday Genius)。了解更多訊息,請瀏覽:www.mediatek.com.