SR. HBM EQUIPMENT ENGINEER

Oversees the installation, modification, upgrade and maintenance of manufacturing equipment. Maintains current records on equipment manufacturers’ technical notices, upgrades and safety issues. Studies equipment performance and reliability. Establishes programs and solutions for increasing uptime and for equipment problems that affect the manufacturing process. Provides technical support to the manufacturing equipment repair and process engineering organizations. Defines and writes preventative maintenance schedules.
• Familiar with one of the process as below and has 3 years of equipment experience at least

Flip chip / CoWos
Wafer inspect / Wafer Molding
Grinding/PSRG/Thinning
Mount/Pillar Reflow/Debond
Steal dicing/ laser groove/NCF lamination
• TOEIC 600 or above that available communicate with PDE/GQ global division.

• Identify, diagnose and resolve assembly equipment related problems
• Coordinate and execute process, equipment and material evaluation / optimization initiatives and implement changes at process step
• Lead / participate in continuous utilization improvement and cost reduction activities
• Validate and fan out baseline qualified, including new process, tools and/or materials for new product introduction
• Support FDC/RMS/APC/SPC
• Support site to site portability
• Manage / audit material suppliers to achieve quality, cost and risk management objectives
• Support internal and external audits

Job Description
• Familiar with one of the process as below and has 3 years of equipment experience at least

Flip chip / CoWos
Wafer inspect / Wafer Molding
Grinding/PSRG/Thinning
Mount/Pillar Reflow/Debond
Steal dicing/ laser groove/NCF lamination
• TOEIC 600 or above that available communicate with PDE/GQ global division.