This role will lead the Package Design Project with R&D team members and deliver advanced and innovative packaging resolutions to clients. (Flip-Chip)
1.Package RFQ and structure & BOM selection.
2.Direct material evaluation and survey.
3.FA and Reverse Engineering.
4.Package design rule maintain & update.
5.Advance products design / NPI projects development.
6.Research & setup package roadmap / material roadmap.
力成科技成立於1997年,為全球第一大記憶體封裝測試廠,提供客戶半導體封測全方位先進封裝服務。企業總部位於臺灣新竹,服務範圍涵蓋晶圓凸塊、針測、IC封裝、測試、預燒至成品以及固態硬碟封裝的全球出貨。力成科技所封裝、測試的產品廣泛應用於手機、電腦、Micro SD 記憶卡、 SSD固態硬碟等3C產品與各式儲存裝置,並將技術應用在物聯網(IoT)、先進駕駛輔助系統(ADAS)、人工智慧(AI)、高速雲端計算應用(HPC)中。