技術工程類-產品工程師Product Engineer(記憶體封裝)

Job updated 2 months ago

Job Description

【Customer Engineering Account Management】
(1)Meet and exceed customer’s expectation of advanced package engineering in terms of quality, cost and delivery
(2)Offer industrial leader’s advanced package solutions and services through integration of package and process development

【Project management】
(1)Project phase in schedule arrangement and follow up
(2)SWR arrangement ,schedule follow up, negotiation…etc.
(3)PKD/PMD creation (PLM)
(4)Reliability arrangement

【Team Work】
(1)To optimize resource allocation
(2)Enhance teamwork in 360° including customer, supplier and our colleagues
(3)Develop self and others

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About us

力成科技成立於1997年,為全球第一大記憶體封裝測試廠,提供客戶半導體封測全方位先進封裝服務。企業總部位於臺灣新竹,服務範圍涵蓋晶圓凸塊、針測、IC封裝、測試、預燒至成品以及固態硬碟封裝的全球出貨。力成科技所封裝、測試的產品廣泛應用於手機、電腦、Micro SD 記憶卡、 SSD固態硬碟等3C產品與各式儲存裝置,並將技術應用在物聯網(IoT)、先進駕駛輔助系統(ADAS)、人工智慧(AI)、高速雲端計算應用(HPC)中。