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技術工程類-研發工程師Package designer(記憶體封裝)
Job Description
A. Package design
1. Package RFQ for cost estimation
2. New device package feasibility & technical risk assessment
3. Package structure, BOM design
4. Package design rule setup & update
5. Coordinate DR0 design review meeting
6. PKG structure confirmation after setup
B. Package research & development
1. Research & setup package roadmap / material roadmap
2. New package development
3. New material survey & capability development
4. Setup direct material purchase specification
5. Technical benchmark with competitors (Reverse engineering)
About us
力成科技成立於1997年，為全球第一大記憶體封裝測試廠，提供客戶半導體封測全方位先進封裝服務。企業總部位於臺灣新竹，服務範圍涵蓋晶圓凸塊、針測、IC封裝、測試、預燒至成品以及固態硬碟封裝的全球出貨。力成科技所封裝、測試的產品廣泛應用於手機、電腦、Micro SD 記憶卡、 SSD固態硬碟等3C產品與各式儲存裝置，並將技術應用在物聯網(IoT)、先進駕駛輔助系統(ADAS)、人工智慧(AI)、高速雲端計算應用(HPC)中。
