TSMC

Module Engineering Managers TSMC is looking for managers in the following modules: CMP, CVD, Diffusion, Epitaxy, Etch (Dry), Etch (Wet), Lithography, Metrology, and PVD. At TSMC Arizona, brilliance can ignite a world of innovation and launch a promising future. The world’s most brilliant innovators entrust us to transform their ideas into world-changing products that impact millions of lives. If you believe in building a future together with us and have the same passion to pursue excellence, you will find your fit here. TSMC Arizona is looking for Module Engineering Manager(s) to join our 4-nanometer fab, located in sunny Phoenix, Arizona. As a Module Engineering Manager, you will demonstrate a strong sense of reliability and enthusiasm and will possess an attitude that embodies our core values – Integrity, Commitment, Innovation and Customer Trust. Chemical Mechanical Polishing (CMP), Senior Engineering Manager Responsibilities include: Module process and equipment fundamental improvementsWork with Process integration, Manufacturing, Yield improvement, and Cross-Module team to sustain high quality wafer production and delivery. CVD Manager (ASM Equipment Manager) Responsibilities include: Elevate engineering and manufacturing excellence in the Chemical Vapor Deposition department. Diffusion Engineering Manager Responsibilities include: Elevate engineering and manufacturing excellence in the Diffusion departmentModule process and equipment fundamental improvementsInnovate and seize opportunities for wafer quality and productivity improvementWork with Process integration, Manufacturing, Yield improvement, and Cross-Module team to sustain high quality wafer production and deliveryProactively identify talent and continuously develop team members with a deliberate road map Dry Etch Equipment Manager Responsibilities include: Work with mother Fab ETC team to fingerprint all ETC tools to ensure seamless technology transfers.New production line set up and maintenance.Equipment troubleshooting.Resource planning, task prioritization, and related cross-function management work to move-in, install and qualify tools. Wet Etch Clean Manager Responsibilities include: Work with the mother Fab WET team to fingerprint all WET processes and/or tools to ensure seamless technology transfers.Plan resources, prioritize tasks, and perform in a cross-function team to move-in, install and qualify tools/processes.Monitor process/equipment performance indices and establish good controls to maintain HMV wafer output.Establish workflow, corrective action and prevention plans for HVM process/equipment issues.Improve productivity through rigorous SOP system control, and process/equipment optimization. Lithography EUV Process Manager Responsibilities include: Ensure that production line is operating 7x24 and meets all quality standardsHire/Manage a team of engineers/techniciansEstablish effective defense mechanisms to ensure EUV/DUV photomask quality, including defectivity and pattern performance.Develop and implement process improvements to increase yield and reduce costs.Collaborate with equipment suppliers to ensure equipment performance meets process requirements. Lithography EUV Hardware Manager - Scanner Responsibilities include: Ensure that the EUV Scanner is operating 7x24 at peak performance and meets all quality and safety standardsHire/Manage a team of engineers/techniciansCollaborate with other departments to ensure that EUV scanner is integrated into the overall manufacturing processManage budgets and resource allocation for EUV scanner teamEstablish clear expectations and encourage continuous improvement to tool vendors Metrology Manager Responsibilities include: Accountable for the execution of the instrumentation/calibrations and metrology services and activities in the siteLeads the execution of Metrology activities in accordance to stipulated production schedule and compliance requirementsAccountable of the Instrumentation/Calibrations group to assure that required process, laboratories, utilities and facilities equipment calibrations are performed in compliance with NIST, cGMP regulations, company policies and procedures and meet Federal and local governmental regulation (e.g. FDA, EQB, OSHA, etc.)Defect/yield match activity to mother fabDuring ramp and manufacturing, own driving defect, yield, and productivity improvements to meet business goals PVD Manager Responsibilities include: Elevate engineering and manufacturing excellence in the Physical Vapor Deposition department Innovate and seize opportunities for wafer quality and productivity improvementWork with Process integration, Manufacturing, Yield improvement, and Cross-Module team to sustain high quality wafer production and delivery Equipment troubleshooting

A job at TSMC Arizona offers an opportunity to work at the most advanced semiconductor fab in the United States. TSMC Arizona’s first fab will operate its leading-edge semiconductor process technology (N4 process), starting production in the first half of 2025. The second fab will utilize its leading-edge N3 and N2 process technology and be operational in 2028. The recently announced third fab will manufacture chips using 2nm or even more advanced process technology, with production starting by the end of the decade. America’s leading technology companies are ready to rely on TSMC Arizona for the next generations of chips that will power the digital future. If you possess the same passion to pursue excellence, you will find your fit here. TSMC Arizona is looking for ambitious engineers to join our advanced technology fab, located in Phoenix, Arizona.. Our roles are designed to fast-track your technical expertise and leadership potential in the semiconductor industry. Job Opportunities: Operations/Fab related Roles Process Integration Engineer (PID) Focus on analyzing Inline and EOL (End-of-Line) electrical data to determine causes for issues, in collaboration with Integration, YED (Yield Excellence Department), and Process/Equipment engineersYield Excellence Engineer (YED) Focus on defect inspection methodology to effectively deduce the root cause of critical issues by collaborating with respective stakeholders and innovate the current techniques to combat defect issues live on the production lineProcess Engineer (PE) Focus on delivering robust and efficient semiconductor manufacturing through data-driven analytics and systematic problem-solving. Optimize processes with experimental design, precision control, and statistical methods. Collaborate with suppliers to address technology gaps and focus on continuous improvement in stability, quality, yield, productivity, and safety.Equipment Engineer (EE) Focus on improving and maintaining tool performance in a cleanroom environment to ensure quality production. Key duties include troubleshooting alarms, installing and qualifying new tools, resolving critical equipment issues, and improving tool uptime. Additionally, the role involves enhancing hardware capabilities, implementing systems to prevent equipment failures, and managing vendor relationships while coordinating with facilities, vendors, and manufacturing teamsIntelligent Manufacturing Engineer (MFG) Focus on ensuring the timely delivery of high-quality wafers by driving productivity and efficiency through advanced technologies such as Smart Scheduling and Precise Dispatching. Responsibilities include system optimization, productivity improvement initiatives, and quality defense enhancements to support daily operations.Intelligent AMHS Robotics Automation Engineer (AMHS) Manage the physical and digital neural network of our fab—ensuring thousands of silicon wafers navigate our cleanroom autonomously and flawlessly. Supervise and collaborate with vendors to install and sustain the AMHS system for TSMC’s ramp-up factories. We also offer a variety of other engineering roles, such as Facilities and Construction related roles. We encourage you to apply; our recruiting team will review your resume and match your background with the best-fitting opportunities *Please note that your job responsibilities are not limited to those mentioned above and may include additional duties as required.