TSMC 台積電

台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。身為全球的企業公民，台積公司的營運範圍遍及亞洲、歐洲及北美，致力成為企業社會責任的行動者。2024年，台積公司提供最廣泛的先進製程、特殊製程及先進封裝等不同製程技術，為500多個客戶生產超過11,000種不同產品。台積公司企業總部位於台灣新竹。進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。 職務說明: 工作內容：1. 針對Pick-and-Place, heat sink, ball mount機台及相關製程的性能表現進行維護和改進。2. 需要確保機台能順暢過貨，並具備將現有的程式擴展到其他機台的能力。3. 具有洞悉硬體優化和程式微調的能力，以改進製程品質，包含下列事項： (1) Recipe實驗設計, 故障排除, 手動作業 (50%) (2) 前製程作業與alarm處理 (30%)(3) 日常機台與部件品質維護 (10%)(4) Recipe 調整與重新設定 (5%)(5) Offline 實驗與數據收集 (5%) 4. 日班總月薪約32,000 元；夜班總月薪約43,000 元；另享有分紅獎金，平均年薪達75 萬元以上。

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. As TSMC is a publicly listed company in Taiwan and the United States, the Shareholder Services SEC Compliance Department is responsible for assisting TSMC with shareholder affairs and complying with securities regulations governing listed companies. Key objectives include ensuring compliance while simultaneously protecting TSMC's interests and enhancing shareholder value.Key tasks and responsibilities include:1. Prepare and file public disclosures pursuant to Taiwan and US regulations governing listing companies.2. Handle shareholders’ questions and manage shareholder affairs, such as shareholder meeting and dividend distribution.3. Response to regulatory changes and communicate externally and internally to ensure compliance.4. Participate in ad hoc projects and collaborate with other teams to drive organizational initiatives.

台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。身為全球的企業公民，台積公司的營運範圍遍及亞洲、歐洲及北美，致力成為企業社會責任的行動者。2024年，台積公司提供最廣泛的先進製程、特殊製程及先進封裝等不同製程技術，為500多個客戶生產超過11,000種不同產品。台積公司企業總部位於台灣新竹。進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。職務說明:1. 處理機況, 線上Running hold/Hold lot 處理, 設備異常問題反應, 機台 Daily/DOWN/PM monitor, Defect 相關處理2. 採四班二輪制：工作兩天，休息兩天3. 須輪班：依部門而異，3~5個月夜班、3~5個月日班4. 班別工作區間(含休息時間)：日班-7:20AM~7:20PM；夜班-7:20PM~翌日7:20AM5. 日班總月薪約 32,000 元；夜班總月薪約 43,000 元；另享有分紅獎金，平均年薪達75萬元以上

台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。身為全球的企業公民，台積公司的營運範圍遍及亞洲、歐洲及北美，致力成為企業社會責任的行動者。2024年，台積公司提供最廣泛的先進製程、特殊製程及先進封裝等不同製程技術，為500多個客戶生產超過11,000種不同產品。台積公司企業總部位於台灣新竹。進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。儲備模組副工程師職位旨在培育工程專業人才。您將接受至多12個月的訓練課程，通過考核後正式擔任模組副工程師。若考核未達要求，公司將提供指導與進行績效改善計畫，幫助您提升技能。如最終未達目標，公司將與您共同商討下一步職涯規劃。職務說明:1. 負責半導體封裝產品線機台設備維修及保養2. 管理及改善機台零件系統、包含廠商與下包商之零件備品管理3. 設計機台保養制具及流程改善以增進機台穩定性4. 依公司需求需配合日、夜/假日班輪值(約每四週輪值一次大夜班，一次輪值六天)，實際安排將依工作需求及培訓進度調整

台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。身為全球的企業公民，台積公司的營運範圍遍及亞洲、歐洲及北美，致力成為企業社會責任的行動者。2024年，台積公司提供最廣泛的先進製程、特殊製程及先進封裝等不同製程技術，為500多個客戶生產超過11,000種不同產品。台積公司企業總部位於台灣新竹。進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢職務說明:水/電/氣/機：1. 負責廠務水處理/電力/氣化/機械系統的規劃、建造、試車與運轉維護，並參與廠房的新建、擴建及改造項目。2. 進行廠務水處理/電力/氣化/機械系統供應品質的風險分析，安全管理及系統改善管理。3. 與設備、製程等部門密切合作，確保廠務系統運行品質穩定。4. 負責系統異常的緊急應變與處置。5. 跨組織溝通協調與問題解決。儀控：1. 負責廠務系統運轉供應品質的風險分析、工程安全與系統改善管理。2. 負責廠務控制系統及資訊系統的運轉和維護(控制及監控設備、資訊安全設備)。3. 負責與跨部門合作推動廠務數位化專案(品質管理、大數據、自動化+AI)。4. 負責與跨部門合作，以統計管理方法確保廠務系統運轉品質與穩定。

台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。身為全球的企業公民，台積公司的營運範圍遍及亞洲、歐洲及北美，致力成為企業社會責任的行動者。2024年，台積公司提供最廣泛的先進製程、特殊製程及先進封裝等不同製程技術，為500多個客戶生產超過11,000種不同產品。台積公司企業總部位於台灣新竹。進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。台積電電子束作業處的主要業務是製作「光罩」，光罩是製作晶圓的關鍵，也是讓半導體產品得以誕生的重要推手。在光罩單位，我們深知人才培育是成功的基石，為此我們提供一套完善且系統化的訓練制度，由經驗豐富、具備耐心與卓越本職學能的專責訓練員，手把手引導新進同仁熟悉精密的光罩機台操作，提供統一且合理的學習時程，確保每位新人扎實掌握關鍵技能後，再讓新人獨立作業。即使過去沒有相關背景經驗，加入光罩團隊後，透過訓練與學習，未來也能成為一名專業技術員！職務說明1. 於無塵室內工作，需穿著整套無塵服裝2. 負責光罩製造機台操作、檢驗光罩品質、異常狀況回報3. 採四班二輪制：工作兩天，休息兩天4. 須輪班：配合廠區跟單位調度輪調，每5個月進行一次日夜輪調5. 班別工作區間(含休息時間)：日班-7:20AM~7:20PM；夜班-7:20PM~翌日7:20AM6. 日班總月薪約32,000元；夜班總月薪約 43,000元；另享有分紅獎金，平均年薪達75萬元以上

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.Building world-class cloud-native infrastructure and scaling to high-volume production are crucial for enabling TSMC's global growth. We are seeking a highly motivated engineer to join our global service team in supporting TSMC fabrication facilities worldwide. The ideal candidate is disciplined, customer-focused, possesses excellent language skills, demonstrates strong problem-solving abilities, has great attention to detail, is an effective communicator, thrives in a fast-paced environment, and is adaptable to evolving challenges. Responsibilities: 1. Develop a thorough understanding of IT products to effectively resolve issues faced by TSMC employees when using IT systems and services.2. Identify and diagnose IT system or service abnormalities, working collaboratively with system sponsors to troubleshoot and resolve system failures.3. Deliver professional and customer-oriented support to enhance user satisfaction with IT systems and services, while providing constructive feedback to IT product owners to drive continuous system quality improvements.4. Collaborate with the team to ensure efficient resolution of incidents and maintain seamless operations.

台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。身為全球的企業公民，台積公司的營運範圍遍及亞洲、歐洲及北美，致力成為企業社會責任的行動者。2024年，台積公司提供最廣泛的先進製程、特殊製程及先進封裝等不同製程技術，為500多個客戶生產超過11,000種不同產品。台積公司企業總部位於台灣新竹。進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。說明:1. 營建工地安全稽核與管理工作2. 工地稽核缺失之統計分析與追蹤3. 協助處理工地安全相關的突發事件調查4. 監督工地安全規範的落實5. 環安衛相關巡檢與稽核業務6. 環安衛相關訓練及緊急應變器材管理業務

台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。身為全球的企業公民，台積公司的營運範圍遍及亞洲、歐洲及北美，致力成為企業社會責任的行動者。2024年，台積公司提供最廣泛的先進製程、特殊製程及先進封裝等不同製程技術，為500多個客戶生產超過11,000種不同產品。台積公司企業總部位於台灣新竹。進一步資訊請至台積公司網站https://www.tsmc.com.tw查詢。儲備製程副工程師職位旨在培育工程專業人才。您將接受至多12個月的訓練課程，通過考核後正式擔任製程副工程師。若考核未達要求，公司將提供指導與進行績效改善計畫，幫助您提升技能。如最終未達目標，公司將與您共同商討下一步職涯規劃。職務說明: 1. 具備積極學習動力，並擁有紮實技術背景與能力，能維持邏輯晶片產品的製程技術。 2. 具備高度團隊合作能力，包含與元件、整合、良率提升、曝光、蝕刻、薄膜領域之間的溝通協調。 3. 負責日常操作的維護工作，包括與設備工程師合作進行機台設備故障排除與復歸，並指導技術人員操作。 4. 依公司需求配合假日排班輪值，實際安排將依工作需求及培訓進度調整。

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. TSMC DNA summer internship program provides a unique and exciting opportunity for you to gain a significant step towards building your professional career, learn about the semiconductor industry, and expand your professional network. You will have the chance to work alongside with experts from different backgrounds and be part of the team to provide solutions and valuable impacts to human life. We welcome students from all major to apply for our 2026 internship program, so don't hestitate to submit your resume now!During your internship, you will be assigned projects relevant to your individual expertise or based on department requirements. You'll have the opportunity to experience and engage with TSMC team. Interns who perform exceptionally well may have the chance to receive advance offers. TSMC hopes this internship is not just a life experience but also a significant step towards building your professional career.o Develop: Partake a series of advanced and well-designed lectures.o Navigate: Join exciting hand-on projects with our world-class experts.o Advance Offer: Earn the opportunities for an Advance Offer through exceptional performance.About Internship Program:1. Interview Period: December, 2025 ~ May, 20262. Program Period: Summer time with Flexible onboard date3. Internship Location: Taiwan (Hsinchu, Tainan, Taichung, Zhunan, Longtan, Kaohsiung, Chiayi) 2026 TSMC Internship Program1. Research and Development Intern (1) Semiconductor Process RD Intern(2) IC Design Intern(3) Design and Technology Platform (DTP) Intern(4) Specialty Intern(5) Integrated Interconnect Packaging (IIP) Intern(6) Pathfinding for System Integration (PSI) Intern 2. Operations (1) Equipment Engineer (EE) Intern(2) Process Integration Engineer (PIE) Intern(3) Process Engineer (PE) Intern(4) Intelligent Manufacturing Engineer (MFG) Intern(5) Facility Engineer (FAC) Intern(6) Quality Reliability (QR) Intern 3. Corporate Business (1) Information Technology Intern (HackerRank Test is needed)(2) Corporate Planning Intern(3) Finance Intern(4) Legal Intern(5) Human Resources Intern(6) Material Management Intern