Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.
As a platform engineer, you will focus on designing, implementing, and maintaining scalable features and services on the platform to support the productionization of applications that support the company’s R&D/Fab/Business/IT/Security functions to improve the productivity and work quality.
Responsibilities:
Your responsibilities include:
1. Automation and Scripting
(1) Develop and maintain automation scripts for configuration, monitoring, and management using tools such as Ansible and Python.
(2) Transform repeatable tasks into automation tools to streamline operations and maximize efficiency.
(3) Implement Infrastructure as Code (IaC) to automate resource provisioning and CI/CD workflows.
2. Application Development
(1) Develop scalable cloud-native microservice architectures for IT applications.
(2) Develop state-of-the-art applications and refactor existing ones to improve performance and maintainability.
(3) Apply software design principles, such as 12-factor app, to ensure sustainability and quality.
(4) Write and implement tests (unit/feature/integration) to guarantee software integrity.
3. Monitoring and Troubleshooting
(1) Implement monitoring solutions to proactively identify and resolve network and application issues.
(2) Conduct root cause analyses and apply corrective actions to troubleshoot technical challenges, including Linux-related systems and logs (e.g., Go code/log analysis).
(3) Lead evaluation and adoption of new IT technologies for continuous improvement.
4. (Optional) Network Design and Management
(1) Operate and manage network infrastructure, including LAN, WLAN, Firewall, and Proxy.
(2) Design, implement, and manage scalable network architecture aligned with business goals and industry best practices.
Additional information for the job:
Job Location: Hsinchu Site, Taichung Site, Tainan Site, Taipei Office (Experienced Only)
On-call needs: On-call 1 week every 3 months
The complete interview process includes:
1. Manager interview
2. Hackerrank test
3. On-site personality and English test (which could be replaced if you have script of an official English test)
4. HR interview
5. Second manager interview (Optional assessment)
6. Technical review (Optional assessment)
Required Qualifications:
1. Bachelor's degree or above in Computer Science or related fields (Information Engineering, Information Management, Software Engineering).
2. 5 years of working experience in platform engineering or related fields.
3. Expertise in CI/CD workflows and Infrastructure as Code (IaC).
4. Experience with monitoring tools and practices (e.g., Prometheus, Grafana).
5. Practical knowledge of security compliance strategies and vulnerability management.
6. Strong analytical and problem-solving skills with the ability to work independently under minimal supervision.
Preferred Qualifications:
1. Experience with databases like MongoDB, MariaDB, Cassandra, and MinIO (S3).
2. Knowledge of cloud-native deployment practices, specifically containers and container orchestration platforms.
3. Familiarity with DevOps tools like GitLab, Jira, Harbor, and Nexus.
4. Proven ability to design solutions independently based on high-level product architecture.
Personal Attributes:
1. Self-motivated, detail-oriented, and a critical thinker with high technical aptitude. 2. Collaborative and a strong team player embracing cross-functional communication.
Established in 1987, TSMC is the world's first dedicated semiconductor foundry. As the founder and a leader of the Dedicated IC Foundry segment, TSMC has built its reputation by offering advanced and "More-than-Moore" wafer production processes and unparalleled manufacturing efficiency. From its inception, TSMC has consistently offered the foundry segment's leading technologies and TSMC COMPATIBLE® design services.
TSMC has consistently experienced strong growth by building solid partnerships with its customers, large and small. IC suppliers from around the world trust TSMC with their manufacturing needs, thanks to its unique integration of cutting-edge process technologies, pioneering design services, manufacturing productivity and product quality.
The company's total managed capacity reached above 9 million 12-inch equivalent wafers in 2015. TSMC operates three advanced 12-inch wafer fabs, four eight-inch wafer fabs, one six-inch wafer fab (fab 2) and two backend fabs (advanced backend fab 1 and 2). TSMC also manages two eight-inch fabs at wholly owned subsidiaries: WaferTech in the United States and TSMC China Company Limited. TSMC also obtains eight-inch wafer capacity from other companies in which the Company has an equity interest.
TSMC is listed on the Taiwan Stock Exchange (TWSE) under ticker number 2330, and its American Depositary Shares trade on the New York Stock Exchange (NYSE) under the symbol "TSM".
台積公司是全世界最大的專業積體電路製造服務公司。台積公司在民國七十六年成立於台灣新竹科學工業園區,並開創了專業積體電路製造服務商業模式。
領先的技術、卓越的製造,以及對於研發及產能投資的持續承諾,讓我們能夠在行動裝置、高效能運算、物聯網與車用半導體領域掌握商機。
台積公司的全球總部位於新竹科學園區,在北美、歐洲、日本、中國大陸、南韓、印度等地均設有子公司或辦事處,提供全球客戶即時的業務和技術服務。