Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.
As a Principal Operations Research Engineer within the AI4BI division of TSMC’s Corporate Planning Organization (CPO), you will serve as a technical lead, spearheading efforts in optimization and automation to revolutionize CPO business processes. Your work will span from automation and data analytics to business intelligence.
Responsibilities:
1. Digital Transformation and Solution Optimization: Identify and capitalize on opportunities for digital transformation in CPO business processes, such as capacity planning, business forecasting, and operational optimization. Frame and solve a broad spectrum of problems, such as demand-supply matching, scheduling, and operational efficiency, using advanced optimization algorithms.
2. Research and Strategy Development: Lead in researching, developing strategies, and creating roadmaps that incorporate new AI/ML, business intelligence, and intelligent automation technologies. Foster collaborations with universities and industry partners to advance the AI4BI agenda, while also spearheading the creation of patent applications and contributing to technical publications, thereby enhancing TSMC’s reputation in AI/ML innovation.
3. Leadership and Collaboration: Lead the AI/ML team and collaborate with cross-functional teams to drive or co-drive the initial ideation, development, and deployment of innovative solutions. Mentor and guide a team of AI/ML scientists and data engineers, fostering a collaborative and high-performance culture.
4. Project and Stakeholder Management: Interact and engage with IT/business stakeholders, user executives, technical leads, and partners to manage project scope, priorities, deliverables, risks/issues, and timelines. Effectively communicate to ensure alignment and success, ultimately delivering successful implementations of AI application
Experience Requirements:
1. Practical Experience: Demonstrated experience in developing and deploying large-scale optimization solutions is essential.
2. Technical Expertise: Proficiency in optimization techniques, including but not limited to graphs, linear programming, mixed-integer programming, non-linear optimization, and convex optimization.
3. Application Knowledge: Extensive experience in optimization applications such as supply chain management and process optimization.
4. Preferred Work Experience: 5-10 years.
Qualification:
1. Educational Qualifications: PhD or Master's degree in Computer Science, Electrical Engineering, Information Management, Industrial Engineering, Operations Research, Mathematics, or a related technical field, or equivalent practical experience.
2. Digital Transformation Insight: Strong understanding and/or experience in digital transformation, including business process transformation, integration, and automation, is preferred.
3. Industry Knowledge: Extensive domain knowledge in semiconductor manufacturing or general manufacturing is considered a significant advantage.
4. AI Application Awareness: Well-versed in the latest AI-based applications and technologies.
5. Technical Skills: Proficiency in Python programming and experience with common AI/ML frameworks (e.g., TensorFlow and PyTorch) is essential.
6. Core Competencies: Exceptional organizational, analytical, and influencing abilities.
7. Demonstrated enthusiasm for initiatives and a results-driven mindset.
Languages:
Fluent in Mandarin and English.
Diversity, Equity and Inclusion (DE&I) reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to DE&I allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. To strive to create a workplace that is equitable and accessible to all employees, we also provide reasonable accommodations for qualified individuals with disabilities. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
Established in 1987, TSMC is the world's first dedicated semiconductor foundry. As the founder and a leader of the Dedicated IC Foundry segment, TSMC has built its reputation by offering advanced and "More-than-Moore" wafer production processes and unparalleled manufacturing efficiency. From its inception, TSMC has consistently offered the foundry segment's leading technologies and TSMC COMPATIBLE® design services.
TSMC has consistently experienced strong growth by building solid partnerships with its customers, large and small. IC suppliers from around the world trust TSMC with their manufacturing needs, thanks to its unique integration of cutting-edge process technologies, pioneering design services, manufacturing productivity and product quality.
The company's total managed capacity reached above 9 million 12-inch equivalent wafers in 2015. TSMC operates three advanced 12-inch wafer fabs, four eight-inch wafer fabs, one six-inch wafer fab (fab 2) and two backend fabs (advanced backend fab 1 and 2). TSMC also manages two eight-inch fabs at wholly owned subsidiaries: WaferTech in the United States and TSMC China Company Limited. TSMC also obtains eight-inch wafer capacity from other companies in which the Company has an equity interest.
TSMC is listed on the Taiwan Stock Exchange (TWSE) under ticker number 2330, and its American Depositary Shares trade on the New York Stock Exchange (NYSE) under the symbol "TSM".
台積公司是全世界最大的專業積體電路製造服務公司。台積公司在民國七十六年成立於台灣新竹科學工業園區,並開創了專業積體電路製造服務商業模式。
領先的技術、卓越的製造,以及對於研發及產能投資的持續承諾,讓我們能夠在行動裝置、高效能運算、物聯網與車用半導體領域掌握商機。
台積公司的全球總部位於新竹科學園區,在北美、歐洲、日本、中國大陸、南韓、印度等地均設有子公司或辦事處,提供全球客戶即時的業務和技術服務。