Technical Manager, Dielectric

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Job updated 18 days ago
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Job Description

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.

Job Responsibilities

1. Technical Leadership: Serve as the technical expert, creating a knowledge hub for rapid problem-solving and resource optimization.

2. Advanced Node Development: Develop and transfer novel dielectric process technologies for advanced-node devices into mass production.

3. Dielectric Technology Advancement: Guide vendors to develop cutting-edge dielectric CVD/ALD tools with chemicals to meet process and schedule requirements.

4. Talent Development: Mentor young talent and recruit global professionals to strengthen team capabilities.

5. Emerging Technologies: Apply semiconductor expertise, simulation, and AI to accelerate solution delivery.

Requirements

  1. PhD in Chemistry, Chemical Engineering, Physics, Materials Science, Electrical Engineering, or related fields, with expertise in semiconductor processes, technology simulation, or AI-assisted problem-solving.
  2. 4–10+ years in industry or academia, specializing in dielectric CVD/ALD deposition, plasma technology, or chemical development.
  3. Strong dedication and internal drive to thin film deposition R&D for advanced technologies.
  4. Uphold TSMC’s core values of integrity, commitment, innovation, customer trust (ICIC).
  5. Exceptional communication and cross-functional collaboration skills, with the ability to influence and drive consensus across teams.

Preferred Qualifications:

  1. Preferred experience in semiconductor-related hardware design and development.
  2. Demonstrated success in implementing new layers for advanced semiconductor process nodes (7nm and beyond).
  3. Familiar with integration challenges and issues in FinFET and GAA technologies.

Interview process

TSMC Core ValuesAt TSMC, we invite talented individuals who share our vision and values to contribute to our continued success. Our core values are the foundation of our culture, guiding every decision and action. We seek applicants who deeply resonate with these principles and embody them in their work:

  • Integrity: Tell the truth. We do not brag. We do not make commitments lightly. Once we make a commitment, we devote ourselves completely to meeting that commitment.
  • Commitment: Employees are dedicated to the company, view the company’s success as their own and work diligently to make their best contributions. As commitment is mutual, the Company strives to serve the best interests of its employees.
  • Innovation: Innovation is the wellspring of the Company's growth. It means more than new ideas; it means putting ideas into practice.
  • Customer Trust: We strive to build deep and enduring relationships with our customers, who trust and rely on us to be part of their success over the long term.

(For more details on TSMC’s Core Values, please visit:https://www.tsmc.com/english/aboutTSMC/values)


Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.

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4 years of experience required
Negotiable
Managing staff numbers: not specified
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About us

Established in 1987 by Dr. Morris Chang, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2025, the Company manufactured 12,682 different products using 305 distinct technologies for 534 different customers for various applications covering a variety of end markets including high performance computing (HPC), smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics (DCE). Annual capacity of the manufacturing facilities managed by TSMC and its subsidiaries exceeded 17 million 12-inch equivalent wafers in 2025. TSMC operates six 12-inch wafer GIGAFAB® fabs, four 8-inch wafer fabs, and one 6-inch wafer fab – all in Taiwan – as well as two 12-inch wafer fabs at two wholly owned subsidiaries – TSMC Nanjing Company Limited and TSMC Arizona Corporation, one 12-inch wafer fab at a TSMC’s majority-owned manufacturing subsidiary – Japan Advanced Semiconductor Manufacturing, Inc. (JASM), and two 8-inch wafer fabs at two wholly owned subsidiaries – TSMC Washington and TSMC China Company Limited. The Company began construction on a specialty technology fab in Dresden, Germany, in 2024. This facility will manufacture TSMC’s 28/22 nanometer planar CMOS and 16/12 nanometer FinFET process technologies.

Outside of Taiwan, TSMC provides customer support, account management and engineering services through its offices in North America, Europe, Japan, China, and South Korea.