TSMC 台積電

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. As a Demand Analyst/Manager specializing in PC/Server within the Business Operations Division, you will play a key role in assessing PC/Server IC demand at TSMC. Your responsibilities include analyzing market dynamics and trends across the PC and server supply chain by utilizing effective business intelligence tools, as well as quantifying their impact on the company through numerical demand modeling. Your insights will support corporate forecasting, capacity allocation, and fab rationalization strategies, ensuring alignment with TSMC's operational goals.

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.As a platform engineer, you will focus on designing, implementing, and maintaining scalable features and services on the platform to support the productionization of applications that supportthe company’s RD/Fab/Business/IT/Security functions to improve the productivity and work quality. Responsibilities: Your responsibilities include:1. Automation and Scripting(1) Develop and maintain automation scripts for configuration, monitoring, and management using tools such as Ansible and Python.(2) Transform repeatable tasks into automation tools to streamline operations and maximize efficiency.(3) Implement Infrastructure as Code (IaC) to automate resource provisioning and CI/CD workflows. 2. Application Development (1) Develop scalable cloud-native microservice architectures for IT applications.(2) Develop state-of-the-art applications and refactor existing ones to improve performance and maintainability.(3) Apply software design principles, such as 12-factor app, to ensure sustainability and quality.(4) Write and implement tests (unit/feature/integration) to guarantee software integrity. 3. Monitoring and Troubleshooting (1) Implement monitoring solutions to proactively identify and resolve network and application issues.(2) Conduct root cause analyses and apply corrective actions to troubleshoot technicalchallenges, including Linux-related systems and logs (e.g., Go code/log analysis).(3) Lead evaluation and adoption of new IT technologies for continuous improvement. 4. (Optional) Network Design and Management (1) Operate and manage network infrastructure, including LAN, WLAN, Firewall, and Proxy.(2) Design, implement, and manage scalable network architecture aligned with business goals and industry best practices. Additional information for the job: Job Location: Hsinchu Site, Taichung Site, Tainan Site, Taipei Office (Experienced Only)On-call needs: On-call 1 week every 3 months The complete interview process includes: 1. Manager interview2. Hackerrank test3. On-site personality and English test (which could be replaced if you have script of an official English test)4. HR interview5. Second manager interview (Optional assessment)6. Technical review (Optional assessment)

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.We are seeking a highly motivated and talented RD Engineer to join our team in developing advanced IC packaging technologies. This position offers an exciting opportunity to work on cutting-edge solutions, such as CoWoS (Chip-on-Wafer-on-Substrate), Fan-Out Wafer Level Packaging (FOWLP), and 3DIC (Three-Dimensional Integrated Circuits). The ideal candidate will have strong technical expertise and a passion for innovation in semiconductor packaging design and analysis.Join us in shaping the future of advanced IC packaging technologies and contributing to groundbreaking innovations in the semiconductor industry. This role provides a unique opportunity to work in a dynamic environment, solve challenging engineering problems, and make a meaningful impact on next-generation packaging solutions.Responsibilities:1. Conduct risk assessments and provide mitigation plans for IC packages through simulation and experiment, interpreting experimental data and simulation to provide insights into material selection and design improvements.2. Practice FEM and DOE in problem solving and path finding particularly on packaging. Conduct mechanical or thermal simulations using finite element analysis (FEA) techniques to evaluate and optimize packaging performance, and analyze stress, deformation, and heat dissipation characteristics to ensure reliability and efficiency of packaging designs.3. Continuously improve simulation methodology, refine material modeling, and enhance script automation capabilities.

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.We are seeking a talented and experienced Supply Chain Business Analyst / Project Manager to join our team. This role focuses on driving digital transformation within TSMC 3DFabric supply chain management, encompassing outside-in solution provision, integrated optimized planning, business process re-engineering, infrastructure (PLM/ PDM), and end-to-end logistics integration.Responsibilities: 1. Lead or facilitate digital transformation initiatives for 3DFabric business processes and system integration.2. Collaborate with external solution providers and internal stakeholders to enable and optimize business operations.3. Jointly design and develop infrastructure, integrating it with enterprise applications.4. Manage projects to provide business process re-engineering (BPR) and end-to-end solutions to enable 3DFabric businesses.

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.Advanced Packaging's mission is to provide the best heterogeneous integration technology (HIT) that realizes system expansion and performance improvement, and to influence the development of the industrial ecosystem by achieving innovation together with our partners as the leading advanced packaging solution provider.Responsibilities:1. Advanced panel level packaging development for CoPoS technology.2. Exploratory panel level packaging process/material/tool development for new applications.3. Process stability/manufacturability improvement for yield and reliability qualification.4. Responsible for transferring the process/material/tool for mass production.

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.Advanced Packaging's mission is to provide the best heterogeneous integration technology (HIT) that realizes system expansion and performance improvement, and to influence the development of the industrial ecosystem by achieving innovation together with our partners as the leading advanced packaging solution provider.Responsibilities:Act as first line guardian of TSMC world class chip manufacturing process. Ensure the stable quality of wafers output by monitoring and adjusting process parameters to enhance machine efficiency.1. Develop and maintain baselines, including setting up recipes.(1) Improve the stability and accuracy of metrology recipes to enhance yield and reliability qualifications.(2) Responsible for transferring metrology solutions to volume manufacturing.2. Employ cutting-edge technology to 3DIC metrology, including SoIC, CoWoS, InFO, and Panel.(1) Leverage your analytical abilities to improve metrology performance, guaranteeing high yield and device efficiency.(2) Identify challenges, formulate methodologies, propose solutions, and new metrology evaluation plans.

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.Seeking an experienced Privacy Data (PII) Protection Specialist with over 8 years of experience to develop, implement, and maintain privacy data policies in compliance with regulations and best practices. The specialist will collaborate with legal team, IT development team, and HR business owners to develop privacy data-related systems.Responsibilities:1. Provide guidance and support to internal teams on data privacy matters, including data handling practices, consent management, and data breach response.2. Conduct Privacy Impact Assessments (PIAs), data protection impact assessments to identify and mitigate privacy risks associated with new projects and initiatives.3. Serve as the primary point of contact for data privacy inquiries from internal teams, customers, regulators, and other external stakeholders.4. Collaborate with cross-functional teams, including Legal, HR, Information Security, and business owners, to integrate privacy considerations within systems.5. Manage and maintain up-to-date records of data processing activities.6. Support Information Security, Technology Risk Management, or Business Continuity Management, or other related assignments, need to take the PM role of internal projects and take the PM role in internal projects.

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.We are seeking an experienced and dedicated Logistics and Shipping Specialist to oversee and optimize our shipping and logistics processes for special customers. The ideal candidate will possess in-depth knowledge of export regulations, exceptional communication skills, and the ability to manage multiple projects and data analysis initiatives. This role is crucial for ensuring smooth customs clearance, efficient logistics operations, and the continuous enhancement of IT solutions for data analysis.Responsibilities:1. Shipping and Logistics Management:(1) Oversee and manage the entire shipping and logistics process for special customers, ensuring timely and cost-effective delivery of goods.(2) Coordinate with internal teams and external partners to streamline operations and resolve any logistical issues.2. Export Expertise:(1) Provide expert guidance on export regulations and procedures to facilitate smooth customs clearance.(2) Regularly update and enhance the flight matrix to improve shipping efficiency and reduce transit times.3. Project and Hub Management:(1) Lead and manage logistics service-related projects and hub operations to ensure optimal performance and compliance with company standards.(2) Implement best practices in logistics management and continuously seek opportunities for process improvements.4. IT Solutions and Data Analysis:(1) Collaborate with the IT department to develop and enhance IT solutions for comprehensive data analysis.(2) Utilize data insights to drive strategic decisions and improve logistics performance.

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. The Intelligent Process Control Systems Department (IPCS) in TSMC's Intelligent Manufacturing Center (IMC) assists fabs in analyzing process issues. By employing techniques such as experimental design, statistical analysis, optimization algorithms, and machine learning, the department establishes R2R (Run-to-Run) process control models. Subsequently, in collaboration with the system development team, an automated control platform is established and rolled out across various fab zones. This integration aims to enhance staff efficiency and improve overall product quality. Responsibilities: By employing methods such as control system development, algorithm design, and control performance diagnostics, we provide advanced control systems for the semiconductor industry.We use machine learning and optimization algorithms to build models that deliver solutions meeting the needs of the fab zones.We establish automated platforms that utilize techniques such as machine learning and AI for automatic parameter optimization, which reduces staff workload and enhances quality.In collaboration with the system development team, we systematically implement and roll out innovative methods or improvements across various fab zones to boost staff efficiency and product quality.

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Intelligent Scheduling Development Department (ISDD) in TSMC's Intelligent Manufacturing Center (IMC) is responsible for the dispatch and scheduling of various TSMC fabs. It considers multiple constraints such as processes, machines, products, and waiting times, and employs three main methods: Automated rules (Rule based)Optimization through mathematical planning models (Model)Optimization with metaheuristic algorithms (Metaheuristic) The system determines the sequence of products that machines will produce in the future. Colleagues continuously refine the computational engine to improve solving performance and scheduling quality. They also utilize self-developed scheduling systems to help fabs adapt to various scenarios to achieve fab goals and tasks. Moreover, they constantly enhance fab production efficiency and increase wafer output by identifying and capitalizing on opportunities for improvement.Responsibilities: Develop and maintain Scheduling / Dispatching and Manufacturing Report System.Communicate with users to define requirements, design, implement, and deploy systems, and continuously improve them using software engineering methodology.Design system architecture of cross department projects.Lead system design review.Survey and introduce new IT solutions.