王以豪 Wang Yi Hao

Assistant Manager  •  IAC  Inventec Appliances Corporation

FEB, 2008 - Present.

About 16 years on Mechanical design & FEA.

2020 - 2024

• Wearable device project: smart fitness tracker (fitbit)    
  • 2020 - 2022, Gen1 tracker
    • Design internal staking / metal patrs / custom ME-EE componet
      1. Cross function coordinated with EE, RF.
      2. Review DFM and system level TA.
      3. Define appearance quality specification.
      4. Regulate critical measurement method to IQC.
      5. Define assemble SOP.
      6. Bring up assemble stations. - heat staking, FPC pre-blend, carrier clamping force, LAA active.
      7. Analyze defect product during manufacturing - leakage, ADH non-active
  • 2022 - 2024, Gen2  tracker
    • In charge of REL FA & EFFA mechcanical defect.
      1. Plan FA SOP - Speed up to finish on time.
      2. Management failure symptom and data analysis.
      3. Expanding analysis resource - cooperate with outsourcing to implement CT, FTIR.
      4. Arrange DOE plan for CA validation.

2018 - 2019

• Wearable device project: smart ring (Motiv)
  • Focus on various UV curing line setup.
    • Survey equipment - dispensing valve and needle.
    • Evaluate UV curing equipment type and review fixture design. 
    • Adjust curing parameter for UPH.
    • Estimate expendable mold life cycle during potting glue.
    • Arrange fixture fit check process and function check process.
    • Define critical specification - potting glue, overflow area, bubbles location and size.
  • Evaluate different housing material by FEA.

2018

• Support TWS (Apple) MP line qualification
  • Supervising housing bonding station.
    • Ensure yield rate.
    • Training failure analysis method.

2015 - 2017

• IOT project: smart home device (nest)
  • Design a frame for PIR sensor and Fresnel lens.
  • Review housing DFM - focus on polishing process, drilling process.
  • Promote UPH.
    • Improve assemble fixture.
    • Review semi-automatic masking tape sticker fixture.
      1. Adjust the alignment of rolling workpiece for yield improvement.
      2. Modify material design to speed up manual pick and place. 

2014 - 2015

• Handheld device project: POS (Verifone) 
  • Based on existing device, keep most common parts to design 2 derivative models. (3G version & BT/WiFi version)

2008 - 2013

5 years / Validate design by FEA tool: Structure analysis, Drop analysis, and Tolerance analysis.

• Use tolerance analysis tool to clarify assembly gap issue and step issue.
• Simulated model stress distribution to evaluate structure strength. Example: bending conditions to evaluate snap strength.