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【點我了解更多圖靈計畫相關資訊】 專案命名 Turing Plan - 以AI之父 Alan Mathison Turing 為名，矢志尋找最頂尖的人工智慧技術菁英。本計畫共二年，保障年薪百萬，並以AI模型、相關應用系統等技術為核心，歡迎想一展AI技術的人才來比試～ 【工作內容】 負責所執行專案需求分析，針對系統特徵進行架構規劃與設計，並撰寫核心模組規格文件自動化流程規劃與開發，並優化專案程式碼開發AI模型落地所需之前、後端應用系統開發內部CI/CD pipeline 以測試、部署AI應用，並協助內部系統及伺服器日常維運與故障排除依據業務需求，協助應用部署上線及安全性更新等相關維運與PM溝通專案上線時程，協助解決技術問題並針對技術風險提出建議 【工作地點】 台北或台南擇一，請至圖靈網站下載履歷表中並進行勾選，面試地點將與工作地點相同 【履歷投遞】 加快審核方式：下載圖靈計畫制式履歷表，寄送至 永豐金控人力資源處信箱職缺申請Tips：履歷隨到隨審，初審通過即安排面談，截至計畫人數招滿為止。本計畫另有「AI科學家」職位，歡迎探索更多職涯的可能性：https://www.cakeresume.com/companies/bank-sinopac/jobs/7de15a 【Turing Plan 團隊介紹】 擁有自由彈性、工作生活平衡的研發環境；大量的開放討論氛圍，可隨時互動溝通。 每週一天，可發展個人想專研的技術與創新，不僅場域像科技公司，思維也一樣開放。 強調實驗室文化工作氛圍，注重工作生活平衡支持分享共好，每週一次Meeting，交流最新論文或技術鼓勵持續學習，每週20% 時間進行Side Project 或自我提升團隊內部扁平，討論風氣興盛，無階級之分多元辦公方案，提升時間運用彈性

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.Advanced Quality System Development (AQSD) is part of TSMC's Intelligent Manufacturing Center (IMC), responsible for three main directions: Use statistical methods and conditional monitoring to inspect fab control charts, providing early warning of abnormal product yields; offer a fab defense system settings comparison platform to check that machines meet the internal control anomaly conditions set by the engineering department.Develop online fab analysis platforms through Big Data, Machine Learning, and Deep Learning techniques for online yield/defect analysis to ensure the quality of wafers produced in the fab.Develop systems and provide logical operations to control and implement escape mechanisms for material batch changes, measurement stages, and inspection stages, ensuring quality and optimizing product sampling rules. Responsibilities: Apply machine learning/optimization algorithm to build up models for optimizing semiconductor production.Develop analysis and optimization methods to enhance product quality, increase tool productivity and improve people productivity.Design, develop and test prediction models with real applications in manufacturing.Build a flexible framework to speed up the development process of AI models, with a focus on Large Language Models (LLMs) serving.Turn exciting AI prototypes/ideas into products, leveraging LLMs and other advanced AI technologies.Develop next-generation AI backend systems related to large-scale real-time data access, collection, analytics and monitoring.Establish and maintain MLops processes and tools, including model deployment, monitoring, and automation.Continuously improve the quality of AI production systems, particularly those utilizing LLMs.