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1. 具有Windows程式開發經驗尤佳 2. 按需求針對研發工程師提出的檢測算法，於現場測試並確定效果及分析問題 3. 在機台段協助機台程式除錯 4. 能準確分析現場發生異常問題的原因，並提出初步建議 5. 能配合國內出差、須進無塵室工作、可接受加班

工作內容 作為一名 CIM/SECS/GEM 專案研發高級工程師，您將在半導體設備自動化與智慧製造的關鍵領域中扮演核心角色。您不僅需要具備卓越的技術實力，更要展現獨立思考與解決問題的能力。您的主要職責包括：● CIM 系統設計與開發： 負責半導體設備 CIM 相關軟體模組的需求分析、架構設計、程式開發、單元測試與整合測試，確保系統高效穩定運行。● SECS/GEM 介面開發與優化： 深度參與 符合SECS/GEM通訊規格的設備開發，並實作與優化 SECS (Semiconductor Equipment Communications Standard) 和 GEM (Generic Equipment Model) 協議，實現設備與廠務 MES/EAP 系統之間的高效通訊與資料交換。● 自動化設備PC Based程式撰寫與測試： 負責自動化設備CIM PC Based程式的撰寫與測試，確保軟體功能符合設計與客戶需求。● 客戶溝通與規格制定： 與客戶討論規格需求並開立規範書，確保軟體開發方向與客戶實際生產需求一致。 ● 專案規劃與執行： 能夠獨立負責或協助主管規劃中小型研發專案，包括時程安排、資源協調與進度追蹤，確保專案順利交付。● 技術問題診斷與排除： 針對複雜的 CIM 軟體問題進行深入分析、定位與解決，並提供技術支援。 ● 程式碼品質與效能優化： 遵循公司開發規範，撰寫高品質、高效率的程式碼，並對現有系統進行效能調校與優化。 ● 技術文件撰寫： 撰寫詳細的技術設計文件、測試報告與使用者手冊。● 跨部門技術協作： 與硬體、製程、自動化、品保及客戶服務團隊緊密合作，共同解決技術挑戰，提升產品整體表現。● 配合專案出差： 需配合專案需求進行國內外差旅。

從事軟體測試、開發相關工作。 1. 機台開發 熟悉Windows平台之程式設計，使用開發工具C#或 VC++利用各種介面卡(motion card, I/O card, Communication card,影像擷取卡,...)控制並監控機台動作機台自動化整合(PLC, HSMS, CIFS, WinSocket...)依客戶需求做功能開發 二、測試開發元件並產出實驗報告 2. 分析機台的異常問題，找出異常原因與解決方法 3. 協同客服人員裝機：能配合國外出差(約4~6個月/年)、需進無塵室工作、可接受加班 4. 團隊合作：與部門內/外之工作伙伴一同創造良好的工作氣氛，相互合作，有效的完成各項任務

依照專案開發需求，提供客製化檢測方案，執行影像處理演算法開發，並完成實機測試。 1. 依照專案需求，評估適合的演算邏輯與流程 2. 依照流程邏輯，完成程式架構、相關參數介面，以及演算法的開發 3. 偕同軟控工程師一同測試完成設備安裝、驗證 4. 執行現場測試，並以實際狀況優化檢測邏輯以及演算法

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. AQSD (Advanced Quality System Development) is part of TSMC's Intelligent Manufacturing Center (IMC), responsible for three main directions: Use statistical methods and conditional monitoring to inspect fab control charts, providing early warning of abnormal product yields; offer a fab defense system settings comparison platform to check that machines meet the internal control anomaly conditions set by the engineering department.Develop online fab analysis platforms through Big Data, Machine Learning, and Deep Learning techniques for online yield/defect analysis to ensure the quality of wafers produced in the fab.Develop systems and provide logical operations to control and implement escape mechanisms for material batch changes, measurement stages, and inspection stages, ensuring quality and optimizing product sampling rules. Responsibilities AQSD Engineer for Quality system development using C#, python, Delphi, Web programming like java script, react/angular/Vue framework, etc.A highly motivated individual with a background and capability to design a system to support quality management and solve Fab problems.Working with a team which may include integration, module, quality team to achieve productivity, efficiency and quality excellence.Analysis and optimize Fab quality management and delivery good solution.Be responsible for sustaining ownership such as system operations.

1.設備相關軟體規格設計與規畫2.設備相關軟體程式設計3.設備相關軟體程式Review與指導4.設備相關軟體設計改善與解析, 修正5.客戶端軟體機能驗證6.軟體機能諮詢回答