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Logo of Malaysia Youth.
• Develop and maintain highly reliable and scalable services and applications • Create automation that works on Windows, macOS and Linux servers • Build APIs and UIs that are simple and powerful • Understand product requirements, engage with team members and customers to define solutions, and estimate the scope of work required • Collaborate with, mentor, and influence members within your team and across other teams in OCBC • Deliver solutions that can keep up with a rapidly evolving product in a timely fashion Qualifications • Solid Java development experience. • Experience with at least one other programming language (C#, Kotlin, Golang). • Knowledge in Microservices, Functions, Event-driven/reactive programming or other Cloud Native architectures • Experience designing, building, and maintaining RESTful APIs • Experience with Cloud Native Platforms including Kubernetes, Open Shift, Docker Enterprise, or Cloud Foundry in the public cloud • Experience with JavaScript and one or more front-end frameworks such as React or AngularJS • Mobile app development experience is preferred • Expertise in building highly available production services, including deployment automation, infrastructure-as-code, monitoring, and scaling • Good understanding of containers, build systems, and infrastructure automation • Experience with DevOps and Agile engineering practices
1 ~ 3 MYR / month
No requirement for relevant working experience
No management responsibility
Logo of Chipbond Technology 頎邦科技股份有限公司.
1. 自動化工程師(EAP, FA) 【EAP】 a.EAP SECS/GEM 機台自動化程式開發 b.CIM系統設計、開發與維護 c.工程資料的收集與整理、分析 d.有機台自動化/SECS相關經驗、 C# 程式開發經驗尤佳 【FA】 a.可程式控制器(PLC)、人機介面(HMI)、Intouch圖控等程式寫編輯 b.PLC相關自動控制應用功能新增修改 c.具5年以上相關實務專案經驗,並可獨立作業 d.熟電路圖規劃及繪製。 e.具自動控制系統專案規劃相關經驗2. 前端工程師(Web) a.網頁前端開發 b.Reporting System開發與維護 c.數據庫設計、開發與維護 d.有Web開發相關經驗、 Angular開發經驗尤佳3. AI應用工程師 a.人工智慧影像深度學習及類神經網路模型開發及改善 b.晶圓表面Defect檢測 開發/改善專案 c.設計及改善Defect物件偵測演算法 d.設計及改善影像特徵搜尋引擎 e.影像處理相關演算法開發 f.AI模組的調校及維運
Negotiable
No requirement for relevant working experience
No management responsibility
Logo of Chipbond Technology 頎邦科技股份有限公司.
1. B2B_數據整合工程師 a.企業內部資料與客戶之間的 B2B 整合 b.管理/維護 webMethods ,確保客戶數據傳遞的準確性、安全性與合規性2. B2B_系統開發工程師 a.開發基於 .NET 及 Angular 的客戶報表系統3. ERP_整合應用開發工程師 a.開發基於 .NET 的企業資訊整合系統4. SAP_工程師(Basis, FI/CO, MM, PP, SD/IEB) a.Basis_負責 SAP HANA 伺服器的配置、維護與效能優化,確保系統的穩定性與可用性,並符合當地資安及法規要求 b.FI/CO_負責 SAP FI/CO(財務/成本) 模組的設計與維運,確保符合馬來西亞的財務與稅務法規。 c.MM_負責 SAP MM (物料管理) 模組的設計與維運,確保採購、庫存與供應鏈運作順暢,並整合 IEB/FI/CO/PP 等模組,確保物料管理符合公司需求與當地法規 d.PP_負責 SAP PP (生產計劃) 模組的設計與維運,確保工廠的供應鏈與生產計劃符合馬來西亞製造業標準 e.SD/IEB_負責 SAP SD/IEB (銷售/進出口) 模組的設計與維運,確保客戶訂單處理與進出口作業符合當地法規
Negotiable
No requirement for relevant working experience
No management responsibility

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