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Winbond Electronics Corp. 2026 Taiwan Semiconductor Job Fair – Taiwan Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995, and is headquartered in Central Taiwan Science Park (CTSP), Taichung, Taiwan and operates two 12-inch highly intelligent and automated fabs located in CTSP and South Taiwan Science Park (STSP)’s Kaohsiung Science Park. Winbond stands out as one of the few companies worldwide with proprietary products and technology in both memory and logic integrated circuits. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total integrated circuits solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash, Customized Memory Solution (CMS), and various Logic IC solutions.Our advantages of technological autonomy and prudent capacity strategies enable us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building our brand image. 1.Software Development Engineer System Development Maintenance: Participate in the development, unit testing, and daily maintenance of business application systems to ensure functionality meets defined requirements.Feature Implementation: Develop high-quality, maintainable code based on functional specifications and carry out module development.System Integration Testing: Collaborate with the team on system testing, assist in troubleshooting bugs and system issues, and ensure stable system operations.Documentation Standards Compliance: Follow team coding standards and development processes, and assist in preparing technical documentation and user manuals.Collaboration Optimization: Work closely with team members to resolve technical issues and, under the guidance of senior engineers, assist with basic performance optimization and code refactoring. 2. Backend Engineer System Development: Design and implement systems using DDD and microservices architecture, and write high-quality, maintainable code.Cloud Deployment: Deploy and operate Azure containerized services, and implement event-driven architectures using Azure API Management (APIM) and Event Hub.IaC CI/CD: Build fully automated pipelines using GitHub Actions and Infrastructure as Code (IaC) to version and manage Azure infrastructure.AI Enablement: Drive the integration of AI into the SDLC, and explore cutting-edge technologies such as AI Agents and MCP.Technology Evangelism: Package mature technical solutions into best practices and promote them across development teams and business units.Collaboration Optimization: Collaborate with team members to resolve technical issues, including performance optimization and code refactoring. 3. Frontend Engineer System Development: Design and implement systems using DDD and microservices architecture, and write high-quality, maintainable code.Cloud Deployment: Deploy and operate Azure containerized services, and implement event-driven architectures using Azure API Management (APIM) and Event Hub.IaC CI/CD: Build fully automated pipelines using GitHub Actions and Infrastructure as Code (IaC) to version and manage Azure infrastructure.AI Enablement: Drive the integration of AI into the SDLC, and explore cutting-edge technologies such as AI Agents and MCP.Technology Evangelism: Package mature technical solutions into best practices and promote them across development teams and business units.Collaboration Optimization: Collaborate with team members to resolve technical issues, including performance optimization and code refactoring. 4. DevOps Engineer System Development: Design and implement systems using DDD and microservices architecture, and write high-quality, maintainable code.Cloud Deployment: Deploy and operate Azure containerized services, and implement event-driven architectures using Azure API Management (APIM) and Event Hub.IaC CI/CD: Build fully automated pipelines using GitHub Actions and Infrastructure as Code (IaC) to version and manage Azure infrastructure.AI Enablement: Drive the integration of AI into the SDLC, and explore cutting-edge technologies such as AI Agents and MCP.Technology Evangelism: Package mature technical solutions into best practices and promote them across development teams and business units.Collaboration Optimization: Collaborate with team members to resolve technical issues, including performance optimization and code refactoring.

Google welcomes people with disabilities.Note: By applying to this position you will have an opportunity to share your preferred working location from the following: New Taipei, Banqiao District, New Taipei City, Taiwan; Zhubei, Zhubei City, Hsinchu County, Taiwan.Minimum qualifications: Bachelor's degree in Electrical Engineering, Semiconductor Processing, or a related field, or equivalent practical experience. 4 years of experience in VLSI technologies, product and test engineering, and semiconductor processing. Experience in Integrated Circuit (IC) qualification, data review, production release, system level testing, test time reduction and yield improvement. Experience with Yield and Fail Pareto Analysis using JMP, Exensio, Datapower or O+. Preferred qualifications: 8 years of experience in VLSI technologies, Product and Test Engineering, Semiconductor processing. Experience in Test and Design for test (DFT) techniques, and with structural tests such as Scan/ATPG, JTAG, Memory BIST and sensors such as PVT/temperature/current/droop sensors, etc. Experience with test chip design, development and testing methodologies. Experience with advanced packaging such as 2.5d, 3d, InFo. Familiar with Automatic Test Equipment (ATE) test platforms such as Advantest 93K , Teradyne UltraFlex SOC test system. Knowledge of reliability stress, device qualification and associated processes. About the jobBe part of a diverse team that pushes boundaries, developing custom silicon solutions that power the future of Google's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration. In this role, you will develop and deploy productization solutions while partnering with cross-functional teams to enable manufacturing at fabrication plants and assembly and test sites. You will help integrate System on a chip (SoC) technologies into devices and facilitate Automated Test Equipment (ATE)/System Level Testing (SLT) manufacturing testing of SoC to validate performance and screen out failing devices. You will work with cross-functional teams to ensure optimal test coverage and cost efficiencies in production to ensure quality SoCs. You will work with multiple groups to develop digital and mixed signal tests, automation methodologies, develop/support internal tools for data analysis, yield analysis, silicon debug, reliability qualification, manufacturing ramp and customer returns. You will also be a partner on releasing production test solutions into mass production.Google's mission is to organize the world's information and make it universally accessible and useful. Our team combines the best of Google AI, Software, and Hardware to create radically helpful experiences. We research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. We aim to make people's lives better through technology.Responsibilities Perform SoC Artificial Intelligence (AI)-centric product specifications and Design for testing (DFT) architecture reviews and generate New Product Introduction (NPI) characterization, test, or manufacturing plans. Support test hardware design (e.g., probe card, Load board) requirements, ATE/SLT test program review, and work for test coverage. Perform Die/Package level bring-ups, troubleshoot different failure modes and help resolve issues by collaborating with cross-functional teams. Support Outsourced Assembly and Test (OSAT) bring-up, ATE/SLT manufacturing test programs releases, and meet test cost goals. Manage NPI and Manufacturing Return Materials/Merchandise Authorizations (RMAs) to achieve TurnAround Times (TATs) and provide lot dispositions. Google is proud to be an equal opportunity workplace and is an affirmative action employer. We are committed to equal employment opportunity regardless of race, color, ancestry, religion, sex, national origin, sexual orientation, age, citizenship, marital status, disability, gender identity or Veteran status. We also consider qualified applicants regardless of criminal histories, consistent with legal requirements. See also Google's EEO Policy and EEO is the Law. If you have a disability or special need that requires accommodation, please let us know by completing our Accommodations for Applicants form.