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【Responsibility】 -散熱方案設計與開發：1. 針對客戶的 RFQ (Request for Quotation) / RFP (Request for Proposal) 文件，提供高品質、具競爭力的散熱解決方案。2. 設計穩健的主動式與被動式散熱解決方案，確保符合行業規範，並滿足產品部門及客戶的雙重需求。3. 運用 FloTHERM進行伺服器等級的系統熱模擬分析，評估設計方案的可行性與潛在風險。 -測試、驗證與故障分析：1. 制定並執行完整的系統散熱測試計畫，驗證設計是否符合規格。2. 分析測試數據，撰寫驗證報告，並確認測試結果。3. 針對開發與量產階段中出現的散熱與聲學問題，提供根本原因分析 (Root Cause Analysis) 並提出有效的解決方案。 -供應商合作與專案管理：1.與散熱器、風扇及液冷模組等關鍵供應商密切合作，共同開發元件，並確保設計成品的效能、品質與成本達到專案目標。2.與學術單位合作，追蹤前瞻技術研究項目，並評估其應用於未來產品的可行性。 -跨職能溝通與協作：1. 與產品、機構、硬體等跨職能部門合作，共同定義系統需求、進行產品設計、評估風險與可行性，並持續優化設計。2. 能夠透過簡報清晰地分析與闡述新設計或提案的散熱解決方案，展現其優勢與權衡。 【Qualification】1. 熱流、機械、航太或相關工程領域的學士/碩士學位。2. 具備 3 年以上伺服器的散熱設計與分析經驗，5-10年相關工作經驗。3. 精通伺服器等級的熱模擬分析，並有獨立提供散熱解決方案的能力。4. 熟練操作 CFD 散熱模擬軟體（FloTHERM 尤佳）。5. 具備扎實的熱傳學、流體力學及聲學理論基礎。6. 擁有動手執行系統散熱與聲學測試、架設測試環境與數據分析的能力。7. 卓越的溝通、簡報、團隊合作與問題解決能力。 【加分條件】1. 具備高功率 CPU/GPU/ASIC 散熱方案的設計經驗。2. 具備水冷（Liquid Cooling）系統，特別是直接液冷 (DLC) 的設計經驗者優先。3. 具備噪音（Acoustic）量測、分析與改善的實務經驗。4. 熟悉 Creo, SolidWorks 等 3D CAD 軟體。5. 有與供應商及客戶直接技術對口的經驗。

📋 Job Responsibilities We are seeking senior technical anchors across three core disciplines to join our newly established advanced server infrastructure wing. You will hold high levels of autonomy to architect, design, and validate the thermal and structural future of next-generation AI high-performance computing platforms. 🔹 Liquid cooling System Architecture Development: Own the structural layout, architecture definition, and initial prototyping for next-generation High-Performance Computing (HPC/AI) liquid cooling products and critical server-level thermal components (including CDUs and Manifolds).Cooling Path Planning: Lead complex internal cooling fluid path planning, execute optimized thermal component/radiator selection, and engineer high-efficiency pump configurations.Manufacturing Alignment Collaboration: Review and evaluate key production processes (including welding, stamping, and CNC machining); collaborate deeply with internal mechanical forces to deliver scalable technical solutions to tier-1 global clients and suppliers. 🔹 Thermal Simulation Modeling: Conduct independent, high-precision thermal and fluid dynamics modeling utilizing advanced CFD software suites (such as Fluent, Icepak, FloTHERM, and CFX).Design Optimization: Lead advanced heat dissipation module optimizations, execute meticulous thermal resistance analyses, and conduct rigorous evaluations of materials' thermal characteristics.Cross-Disciplinary Integration: Interface seamlessly with mechanical engineering teams to bridge simulation data with physical prototypes, delivering robust technical solutions to international clients and suppliers. 🔹 Mechanical Structural Design: Apply fundamental mechanical principles (solid mechanics, kinematics, and structural dynamics) to design high-performance server chassis and provide robust structural solutions.Mass Production Induction (NPI): Own the New Product Introduction phase, leading sample validation, prototype testing, and root-cause analysis to resolve engineering defects during trial production.DFM Tooling Review: Conduct deep Design for Manufacturing (DFM) reviews with factory production teams to assess mass-production feasibility; possessing a strong background in stamping mold design and tooling engineering is highly preferred. 🛠 Technologies Core Concepts Used Liquid cooling Track: CDU Manifold Architecture, Fluid Routing Layouts, Pump Configuration, CNC/Stamping/Welding Processes.Thermal Track: CFD Simulation (Fluent, Icepak, FloTHERM, CFX), Thermal Resistance Analysis, Material Thermal Characterization.Mechanical Track: Structural Enclosure Design, Mechanics of Materials, NPI Lifecycle, Prototype Validation, Stamping Mold Tooling (DFM).

1. Responsible to server system thermal simulation, provide cooling solution and co-work with team, including RFQ, NPI stage until mass production.2. Liquid and Air cooling simulation (Flotherm / FlothermXT / 6Signa)3. Liquid cooling system thermal test4. Server system thermal measurement and data analysis.(including verification report)5. Lab equipment use and solder thermocouple6. Co-work with key component manufacturers to develop thermal parts, verify and quality audit.7. Server system acoustic test.8. Optimize server system efficiency and performance.9. Thermal parts validation and approval process(PPAP).10. New technology and patent study.

1. Responsible to server system thermal simulation, provide cooling solution and coworkwith team, including RFQ, NPI stage until massproduction.2. Liquid and Air cooling simulation (Flotherm / FlothermXT / 6SigmaET)3. Liquid cooling system thermal test4. Server system thermal measurement and data analysis.(including verification report)5. Lab equipment use and slode thermocouple6. Coworkwith key component manufacturers to develop thermal parts, verify and quality audit.7. Server system acoustic test.8. Optimize server system efficiency and performance.9. Thermal parts validation and approval process(PPAP).10. New technology and patent study.11. L11 Rack assessment experience

1. Responsible to server system thermal simulation, provide cooling solution and cowork with team, including RFQ, NPI stage until massproduction.2. Liquid and Air cooling simulation (Flotherm / FlothermXT / 6SigmaET)3. Liquid cooling system thermal test4. Server system thermal measurement and data analysis.(including verification report)5. Lab equipment use and slode thermocouple6. Cowork with key component manufacturers to develop thermal parts, verify and quality audit.7. Server system acoustic test.8. Optimize server system efficiency and performance.9. Thermal parts validation and approval process(PPAP).10. New technology and patent study.11. L11 Rack assessment experience

1. Responsible to server system thermal simulation, provide cooling solution and co-work with team, including RFQ, NPI stage until massproduction.2. Liquid and Air cooling simulation (Flotherm / FlothermXT)3. Liquid cooling system thermal design and test.4. Server system thermal measurement and data analysis.(including verification report)5. Lab equipment use and soldering thermocouple6. Co-work with key component manufacturers to develop thermal parts, verify and quality audit.7. Server system acoustic test.8. Optimize server system efficiency and performance.9. Thermal parts validation and approval process(PPAP).10. New technology and patent study.11. L11 Rack assessment experience12. 配合專案計畫會有台北以及桃園工廠實驗室往返需求

Req ID: 123785Remote Position: NoRegion: AsiaCountry: ThailandState/Province: ChonburiCity: Laem ChabangSummaryAs a Senior Subject Matter Expert (SME) in Thermal Engineering, you will take a technical authority role in leading thermal-related technical decisions, cross-team collaboration, and problem-solving throughout the entire product development and mass production management process. You will also be responsible for inheriting and innovating thermal engineering expertise to ensure that product thermal management designs meet top industry standards and support mass production. #LI-TP1Detailed DescriptionPerforms tasks such as, but not limited to, the following:• Lead thermal engineering evaluations for new products, design decisions, and risk mitigation.• Guide thermal management in DFx, PCB layout, and heat dissipation design (compliance with ASHRAE, NEBS).• Collaborate with cross-functional teams (design, manufacturing, quality, reliability) to solve thermal issues.• Drive root cause analysis with CFD simulations; manage failure analysis at manufacturing sites.• Lead verification plans for certification programs; review reliability test results.• Develop thermal testing standards; guide team in using thermal testing tools (thermocouples, IR cameras, wind tunnels).• Support thermal certification of second-source components; review heat dissipation compatibility.• Participate in factory readiness and production line thermal setup.• Coordinate cross-project resources (equipment, manpower) to avoid conflicts.• Conduct training, build knowledge base, and share best practices on thermal debugging.• Research next-gen cooling technologies (liquid cooling, AI workload thermal management) and evaluate feasibility.Knowledge/Skills/Competencies• Proficiency in heat transfer principles (conduction, convection, radiation) and fluid dynamics.• Skilled in using CFD tools such as ANSYS Icepak and FloTHERM, as well as CAD software such as SolidWorks.• In-depth understanding of data center cooling technologies (air cooling/liquid cooling solutions), thermal impact of server PCBs, and heat dissipation challenges of AI/HPC hardware. Ability to interpret and revise industry standards.• Strong leadership, strategic thinking, cross-team communication, and knowledge transfer skills.• Excellent command in English communicationsTypical Experience• 10+ years of experience in thermal engineering in data centers, HPC, or cloud computing fields.• Experience in leading thermal management projects for server racks, CDUs, and edge computing devices; successful cases in solving extremely complex thermal issues (such as heat dissipation for high-density GPU clusters).Typical Education•ABachelor'sDegree inElectronicEngineering,ElectromechanicalEngineering,MechanicalEngineering, or related fields, or an equivalent combination of education and experience.•Advanced studies in business/operations/technology are recommended.NotesThis job description is not intended to be an exhaustive list of all duties and responsibilities of the position. Employees are held accountable for all duties of the job. Job duties and the % of time identified for any function are subject to change at any time.Celestica is an equal opportunity employer. All qualified applicants will receive consideration for employment and will not be discriminated against on any protected status (including race, religion, national origin, gender, sexual orientation, age, marital status, veteran or disability status or other characteristics protected by law).At Celestica we are committed to fostering an inclusive, accessible environment, where all employees and customers feel valued, respected and supported. Special arrangements can be made for candidates who need it throughout the hiring process. Please indicate your needs and we will work with you to meet them.COMPANY OVERVIEW:Celestica (NYSE, TSX: CLS) enables the world’s best brands. Through our recognized customer-centric approach, we partner with leading companies in Aerospace and Defense, Communications, Enterprise, HealthTech, Industrial, Capital Equipment and Energy to deliver solutions for their most complex challenges. As a leader in design, manufacturing, hardware platform and supply chain solutions, Celestica brings global expertise and insight at every stage of product development – from drawing board to full-scale production and after-market services for products from advanced medical devices, to highly engineered aviation systems, to next-generation hardware platform solutions for the Cloud.Headquartered in Toronto, with talented teams spanning 40+ locations in 13 countries across the Americas, Europe and Asia, we imagine, develop and deliver a better future with our customers.Celestica would like to thank all applicants, however, only qualified applicants will be contacted.Celestica does not accept unsolicited resumes from recruitment agencies or fee based recruitment services.