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Hsinchu City, Taiwan
Entry level
Logo of AUO Corporation 友達光電股份有限公司.
1.PLM相關流程系統分析、設計與開發.(eg.產品生產應用相關,如: SAP PLM, SAP ERP..等) 2.使用 C# , MVC, Java Script, JQuery 開發網頁前端及後端MS SQL/Oracle DB開發 3. SAP ABAP程式開發, 與國外同事進行溝通與規劃.
Negotiable
2 years of experience required
No management responsibility
Logo of TSMC 台積電.
Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Provide comprehensive delivery plan / demand vs supply analysis / logistic services to customer.Coordinate internal planning team through front-end wafer to far-backend package to meet customer's delivery target of each configuration.Manage logistic service and schedule monitoring related projects.
TGC Europe
40K+ TWD / month
No requirement for relevant working experience
No management responsibility
Logo of TSMC 台積電.
Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. The Facility Computer Integrated Manufacturing Department (FDCIM) is part of the Intelligent Manufacturing Center (IMC) at TSMC. It is primarily responsible for the development and maintenance of the following products: Development and maintenance of manufacturing-related report products for wafer fabs.Development and maintenance of engineering-related report products for wafer fabs.Development and maintenance of digital operation system products for facility management.Development and maintenance of big data application system products for facility management.Development and maintenance of facility management AI and machine learning related algorithm development and application system products. Responsibilities: FDCIM also employs software engineering and modular development techniques, combined with high-performance database application technologies, to develop systematized software with a unified version control system that accommodates different time zones and languages globally.In addition to its regular software product development work, FDCIM is also engaged in the research and development of new technologies, including the application of DevOps, Microservices, MLOps, AIOps, and more. Develop and maintain AI/ML systems and algorithmsCollaborate with cross-functional teams to identify and solve business problems using AI/ML techniquesDesign and implement machine learning models and data pipelinesTest and validate AI models for accuracy, scalability, and efficiencyDeploy AI solutions to production environmentsStay up-to-date with the latest advancements in AI technologies and industry trendsWrite clean and efficient code using HTML, CSS, and JavaScriptOptimize web applications for speed and scalabilityTest and debug web applications across multiple browsers and devicesStay up-to-date with the latest front-end development trends and best practices
Logo of 名豐電子股份有限公司.
1. 繪製遊戲相關需求,角色、背景、UI、Symbol、Icon 、Logo、彈窗 等等相關素材。2. 熟悉不同風格的遊戲畫面,並依需求設計、規劃與製作。3. 熟悉Midjourney、Stable Diffusion,或其他AI生成相關經驗。4. 與美術、企劃及前端工程師互相配合和溝通。5. 遊戲出圖文件更新與維護**面試請提供線上作品集或相關資訊**
30K ~ 40K TWD / month
1 years of experience required
No management responsibility
Logo of Chipbond Technology 頎邦科技股份有限公司.
1.需求分析:現場需求管理及分析,並提出解決方案。 2.系統開發:參與從需求分析到系統開發、測試、版控等開發流程。 3.網頁開發:使用C#及前端技術進行網頁程式開發,熟悉HTML、CSS、JavaScript及前端框架 (Angular)。 4.報表開發:根據業務需求設計和開發各類報表 (管理報表、Dashboard)並維運。 5.數據處理:熟悉Oracle及MongoDB數據庫,能夠進行數據設計和查詢優化。 【面試資訊】 ◎本職缺為新竹區/湖口區職缺聯招, "工作地點"將依實際用人需求分配(固定工作地) 新竹上班地點-新竹市展業一路10號 湖口上班地點-新竹縣湖口鄉光復路12號 【薪資核敘】 ◎依學經歷、科系、經驗相關性、特殊需求證照及專長等條件核敘個人薪資 ◎如有輪班津貼/班制津貼則另計
Negotiable
No requirement for relevant working experience
No management responsibility
Logo of Chipbond Technology 頎邦科技股份有限公司.
【維護及開發MES排程相關系統】 1.需求設計與協同開發 2.MES排程系統 維護 3.週邊系統開發及維護 4.Web前端開發及維護 【薪資說明】 ◎依學經歷、科系、經驗相關性、特殊需求證照及專長等條件核敘個人薪資。
Negotiable
No requirement for relevant working experience
No management responsibility
Logo of Chipbond Technology 頎邦科技股份有限公司.
一、製造資訊整合軟體工程師【設計與開發自動化與MES整合相關平台】1.因應企業需求開發MES產品與模組化平台。2.因應企業需求開發周邊整合平台介面。3.協助介面模組化需求提供整合之解決方案。4.新技術研究、導入與穩定運作建立解決方案與技術規範。說明:1. 熟悉C#.Net/ASP.NET CORE等開發框架2. 熟悉資料庫開發(SQL Server)3. 提供前端 WebApi 系統介面並能考量相關安全性與效能優化4. 熟悉 Git 版本控管基本操作5. 具備MES系統專案或模組需求設計與協同開發經驗優先6. 具有自動化SECS/GEM 整合經驗優先7. 具半導體產業製造相關經驗者優先二、WEB全端工程師1. Web 新專案開發及上線專案維運2. 新技術研究與導入
Negotiable
3 years of experience required
No management responsibility

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