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Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.Advanced Packaging's mission is to provide the best heterogeneous integration technology (HIT) that realizes system expansion and performance improvement, and to influence the development of the industrial ecosystem by achieving innovation together with our partners as the leading advanced packaging solution provider.Responsibilities:1. Advanced panel level packaging development for CoPoS technology.2. Exploratory panel level packaging process/material/tool development for new applications.3. Process stability/manufacturability improvement for yield and reliability qualification.4. Responsible for transferring the process/material/tool for mass production.

Note: This is a mirrored copy of the posting from AMD's Career Page. For the official and most up-to-date listing, please refer to AMD's Career Page.---WHAT YOU DO AT AMD CHANGES EVERYTHINGAt AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. THE ROLE:As a key member of our Yield improvement team, the successful candidate will be primarily responsible for product yield enhancement across various foundry nodes. You will own silicon bring‑up, yield learning, and manufacturability optimization from first silicon through volume ramp. You will partner closely with design, product engineering, and foundry teams to lead NPI and yield ramps, delivering performance, quality and production readiness.THE PERSON:We are looking for a pragmatic, technically strong team player, with a continuous‑improvement mindset, hands‑on problem solving skills, and the flexibility to handle evolving priorities. Ideal for candidates with 10 years’ experience who can run investigations, implement corrective actions, and drive measurable yield gains independentlyKEY RESPONSIBILITIES: - Own silicon bring‑up, analyze silicon data, and close learnings into production flows. - Lead root‑cause analysis and implement corrective actions for yield issues. - Drive continuous yield improvement using SPC, DOE, and DPMO reduction techniques. - Manage day‑to‑day foundry and supplier interactions, coordinate with internal design, test, and product teams. - Build and maintain yield dashboards, metrics, and stakeholder reports; communicate status and risks clearly. - Prioritize multiple, sometimes ambiguous, technical tasks and deliver practical, data‑driven solutions.REQUIRED SKILLS EXPERIENCE: - BS or MS in Electrical Engineering, Materials Science, Chemical Engineering, or related field. - Experienced in semiconductor process/yield engineering with hands‑on yield analysis and Root Cause Analysis experience. - Strong understanding of semiconductor manufacturing flow and device - Strong data analysis skills (statistics, SPC, DOE) and familiarity with yield tools databases - Demonstrated ability to work cross‑functionally and manage supplier/foundry interactions. - Continuous‑improvement mindset; proven track record of implementing process and quality improvements. - Effective communicator - Experience with advanced process nodes (GAA, FinFET)LOCATION:Hsinchu, Taiwan#LI-SH1#LI-HYBRID Benefits offered are described: AMD benefits at a glance.AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.This posting is for an existing vacancy.

1.協同客戶進行先進製程開發與支援。2.新裝置製程導入及新技術開發。3.維持現有POR(Process Of Record)優勢及擴大市佔率。4.理解客戶製程issue需求的本質，進行構思、 實驗、評價及分析等，提供解決方案。

1.協同客戶進行先進製程開發與支援。2.新裝置製程導入及新技術開發。3.維持現有POR(Process Of Record)優勢及擴大市佔率。4.理解客戶製程issue需求的本質，進行構思、 實驗、評價及分析等，提供解決方案。

1.Monitor in-line process parameters, address abnormalities, and make disposition decisions on lots to ensure smooth production flow.2.Assist in productivity and yield improvement projects through data analysis and process experiments.3.Support the establishment and maintenance of key process parameters for semiconductor tools.4.Evaluate new materials, tools, and methods to enhance manufacturing quality and efficiency.

工作內容 ▋ 關於德州儀器 德州儀器(TI)是位居類比晶片世界領導地位的半導體設計與製造公司，持續提供創新及頂尖的半導體技術與產品，協助客戶開發最先進的電子產品。除此之外，TI也針對在校學生及初入社會新鮮人設計完整的培訓制度與挑戰性的工作內容，並提供具競爭力的薪資與福利、完善的升遷管、輪調培訓計畫以及活潑與國際化的工作環境。 ▋ TI輪調培訓計畫 TI針對新鮮人提供全面且扎實的系列培訓課程，透過課堂及工作日常的任務，將TI的核心理念傳達給新人。另外，TI亦提供完整的輪調計劃，透過給予新人不同職務內容的學習，使其能在公司有更多成長及發展的機會。 歡迎至TI職涯官網 http://careers.ti.com/taiwan/ 搜尋更多相關內容。 We can't predict what the future holds, but we know Texas Instruments will have a part in shaping it. Are you looking to grow your career in manufacturing processing at one of the leading semiconductor companies in the world? Put your knowledge and background to work at Texas Instruments (TI) as a Manufacturing Process Engineer. ▋Responsibilities include: -Drive tool stability improvement project from both process parameter and equipment mechanism perspective. -Establish SOP and optimize process flow to strengthen production robustness. -Qualify new process parameter and hardware retrofit thru process deep dive or cross function collaboration. -Initiate cost reduction project by sourcing, tooling modification or parts life time extension thru close work with buyers and vendors. -Support production output arrangement include normal production and special working request order. -Work with quality team to define containment action and focus on root cause study for quality event. ▋Why TI? Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics. We’re different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI. Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us. About Texas Instruments. As a global semiconductor company, we design, manufacture, test and sell analog and embedded processing chips to nearly 100,000 customers. Our products enable electronics everywhere and in things you experience every day . from health care, smart homes and connected cars to drones, smart phones and more. Our passion to create a better and more sustainable world by making electronics more affordable through semiconductors drives us to make our technology smaller, more efficient, more reliable and more affordable. #年薪(含紅利)百萬起跳 #此職務不需輪班

Job DescriptionProvide technical solutions and process development support for new business initiatives (e.g. trials and development in collaboration with RD).Establish, implement, and maintain production procedures, ensuring they are kept up to date.Support operator training programs together with the Production Supervisor.Support the QAS department in handling internal and external quality complaints.Drive productivity and quality improvement programs.Monitor daily production activities and follow up on technical issues.Lead and support efficiency improvement initiatives.Conduct process risk analysis with a strong focus on safety.Participate in Six Sigma projects to drive cost savings.Ensure compliance with EHS (Environment, Health Safety) requirements.

Troubleshoot and resolve Test cell yield issues to maintain product quality and throughput.Conduct investigations for quality incidents related to test equipment and support root cause analysis and corrective actions.Monitor key process input variables (KPIVs) using tools such as the KPOV database, Maintenance Logs and the Digital Preventive Maintenance system.Drive and support equipment and process upgrade and continuous improvement projects to enhance performance and efficiency.Act as an upskilling trainer for test equipment/process, providing technical training and guidance to team members.Ensure compliance with ISO standards and documentation practices.Responsible for set up new measurement method which required from RD and test process team.Measurement results (KPOV) analysis in PN.Coaching process engineer/technician to enhance their knowledge of instrument method and capability

Note: This is a mirrored copy of the posting from AMD's Career Page. For the official and most up-to-date listing, please refer to AMD's Career Page.---WHAT YOU DO AT AMD CHANGES EVERYTHINGAt AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. THE ROLE:We are seeking a senior-level manufacturing technology expert to lead board-level SMT assembly process development for advanced computing platforms. This role is a technology development and process authority position - not production support. The successful candidate will define assembly strategies, influence design decisions, and enable manufacturability for next-generation products that push the limits of conventional SMT capability.You will work at the intersection of package engineering, PCB design, mechanical and thermal integration, reliability, and global manufacturing, setting standards and best practices deployed across multiple manufacturing partners worldwide.This role offers the opportunity to define manufacturing capability for future platforms, influence product architecture, and solve board-assembly problems that do not have textbook answers. Success is measured by enabling designs that others consider too complex to manufacture reliably.THE PERSON: - Works with contract manufacturing teams to establish high-yield SMT assembly processes for mechanically and thermally demanding PCB assemblies. - Enables smooth transition from engineering builds to high-volume manufacturing across global partners. - Creates scalable guidelines and training that raise capability across internal teams and contract manufacturers.KEY RESPONSIBLITIES: - Advanced SMT Process Development: Lead development, optimization, and qualification of end-to-end SMT processes (printing, placement, reflow, and post-reflow stabilization). - Large BGA Assembly, Warpage and Coplanarity Mitigation: Serve as technical owner for assembly of large, mechanically challenging BGA packages and complex board constructions. - Stencil, Paste Deposition, and Defect Reduction: Define stencil design guidelines for mixed-technology assemblies (thickness selection, aperture optimization, via-in-pad approaches, paste volume control). - Placement Strategy and Equipment Capability: Define placement process requirements for challenging components: placement force/speed, nozzle and vacuum strategy, and fixturing concepts. - Reflow Technology and Thermal Profiling: Architect reflow strategies for assemblies with high thermal mass and uneven heat distribution. Define requirements for custom or modified equipment when standard solutions are insufficient. - Thermal Mechanical Solution Robustness and Post-SMT Processes: Define and qualify edge bonding and underfill strategies to improve mechanical shock, vibration, and board-level reliability. - BGA Rework and Repair Strategy - DFM Leadership and Assembly Guidelines: Lead DFM reviews for advanced PCB designs: land patterns, via-in-pad structures, solder mask strategy, component keep-outs, and routing considerations.PREFERRED EXPERIENCE: - Extensive hands-on SMT process development experience for high-complexity PCB assemblies. - Demonstrated ownership of large BGA assembly challenges, including warpage, coplanarity, thermal behavior during reflow, and post-assembly stability. - Proven track record of developing processes that transition successfully from engineering builds to high-volume manufacturing. - Experience working directly with global manufacturing partners and equipment vendors to qualify capability and drive improvements. - Strong background in structured problem solving (DOE, statistics, root-cause analysis) for yield and reliability issues. - Experience or knowledge on Reliability Qualification (Board Level) for high-complexity PCB assemblies for temp cycling, random/sine vibration, mechanical shock and failure analysis.Leadership Communication Skills - Ability to operate as a technical authority without direct people management and influence cross-functional decisions. - Strong written and verbal communication skills, including authoring technical guidelines and presenting complex topics to diverse audiences. - Comfortable challenging assumptions and driving alignment through data and engineering judgment.ACADEMIC CREDENTIALS: - Bachelor’s with at least 10 years or Master’s degree with at least 7 years of experience in manufacture Engineering, Mechanical Engineering, Materials Science, or a related discipline. - #LI-SC1#LI-HYBRID - Benefits offered are described: AMD benefits at a glance.AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.This posting is for an existing vacancy.

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. TSMC DNA summer internship program provides a unique and exciting opportunity for you to gain a significant step towards building your professional career, learn about the semiconductor industry, and expand your professional network. You will have the chance to work alongside with experts from different backgrounds and be part of the team to provide solutions and valuable impacts to human life. We welcome students from all major to apply for our 2026 internship program, so don't hestitate to submit your resume now!During your internship, you will be assigned projects relevant to your individual expertise or based on department requirements. You'll have the opportunity to experience and engage with TSMC team. Interns who perform exceptionally well may have the chance to receive advance offers. TSMC hopes this internship is not just a life experience but also a significant step towards building your professional career.o Develop: Partake a series of advanced and well-designed lectures.o Navigate: Join exciting hand-on projects with our world-class experts.o Advance Offer: Earn the opportunities for an Advance Offer through exceptional performance.About Internship Program:1. Interview Period: December, 2025 ~ May, 20262. Program Period: Summer time with Flexible onboard date3. Internship Location: Taiwan (Hsinchu, Tainan, Taichung, Zhunan, Longtan, Kaohsiung, Chiayi) 2026 TSMC Internship Program1. Research and Development Intern (1) Semiconductor Process RD Intern(2) IC Design Intern(3) Design and Technology Platform (DTP) Intern(4) Specialty Intern(5) Integrated Interconnect Packaging (IIP) Intern(6) Pathfinding for System Integration (PSI) Intern 2. Operations (1) Equipment Engineer (EE) Intern(2) Process Integration Engineer (PIE) Intern(3) Process Engineer (PE) Intern(4) Intelligent Manufacturing Engineer (MFG) Intern(5) Facility Engineer (FAC) Intern(6) Quality Reliability (QR) Intern 3. Corporate Business (1) Information Technology Intern (HackerRank Test is needed)(2) Corporate Planning Intern(3) Finance Intern(4) Legal Intern(5) Human Resources Intern(6) Material Management Intern