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Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. DWTD team is part of TSMC's Intelligent Manufacturing Center (IMC), composed of experienced engineers and developers who are passionate about simplifying complex processes and creating user-friendly solutions. We have extensive experience in processing automation projects and we are well-versed in the background of building workflow automation systems. The team is also include process domain experts and devops experts, who also played a important role in the conception of DWTD. With their combined expertise, the team has developed a low-code system that enables engineers to define clear SOP steps and build workflow automation faster, reducing the time and effort required for requirement confirmation and knowledge transfer between different organizations. The team's objective is not only to offer a low-code interface for establishing workflows but also to provide a user-friendly workflow validation and maintenance service to enable engineers to efficiently manage their workflows with minimal risk.Responsibilities: Product function design and system development/maintenance to realize TSMC's in-house low code platform for necessary digital transformation.Responsible for internal software product development and providing operation consideration design to improve development and manufacturing efficiency.Design and manage the high availability and high-performance systems to achieve non-stop FAB operations.Collaborate with product managers and FAB users to develop high-value requirements and deliver solutions for improvement of user experience on manufacturing, yield, tool and people productivity.

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.We are seeking a highly motivated and talented RD Engineer to join our team in developing advanced IC packaging technologies. This position offers an exciting opportunity to work on cutting-edge solutions, such as CoWoS (Chip-on-Wafer-on-Substrate), Fan-Out Wafer Level Packaging (FOWLP), and 3DIC (Three-Dimensional Integrated Circuits). The ideal candidate will have strong technical expertise and a passion for innovation in semiconductor packaging design and analysis.Join us in shaping the future of advanced IC packaging technologies and contributing to groundbreaking innovations in the semiconductor industry. This role provides a unique opportunity to work in a dynamic environment, solve challenging engineering problems, and make a meaningful impact on next-generation packaging solutions.Responsibilities:1. Conduct risk assessments and provide mitigation plans for IC packages through simulation and experiment, interpreting experimental data and simulation to provide insights into material selection and design improvements.2. Practice FEM and DOE in problem solving and path finding particularly on packaging. Conduct mechanical or thermal simulations using finite element analysis (FEA) techniques to evaluate and optimize packaging performance, and analyze stress, deformation, and heat dissipation characteristics to ensure reliability and efficiency of packaging designs.3. Continuously improve simulation methodology, refine material modeling, and enhance script automation capabilities.

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.Advanced Packaging's mission is to provide the best heterogeneous integration technology (HIT) that realizes system expansion and performance improvement, and to influence the development of the industrial ecosystem by achieving innovation together with our partners as the leading advanced packaging solution provider.Responsibilities:Act as first line guardian of TSMC world class chip manufacturing process. Ensure the stable quality of wafers output by monitoring and adjusting process parameters to enhance machine efficiency.1. Develop and maintain baselines, including setting up recipes.(1) Improve the stability and accuracy of metrology recipes to enhance yield and reliability qualifications.(2) Responsible for transferring metrology solutions to volume manufacturing.2. Employ cutting-edge technology to 3DIC metrology, including SoIC, CoWoS, InFO, and Panel.(1) Leverage your analytical abilities to improve metrology performance, guaranteeing high yield and device efficiency.(2) Identify challenges, formulate methodologies, propose solutions, and new metrology evaluation plans.

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.Advanced Packaging's mission is to provide the best heterogeneous integration technology (HIT) that realizes system expansion and performance improvement, and to influence the development of the industrial ecosystem by achieving innovation together with our partners as the leading advanced packaging solution provider.Responsibilities:1. Advanced panel level packaging development for CoPoS technology.2. Exploratory panel level packaging process/material/tool development for new applications.3. Process stability/manufacturability improvement for yield and reliability qualification.4. Responsible for transferring the process/material/tool for mass production.

About the Internship 乾坤科技推出 2026 海外暑期實習計畫，邀請對電子零組件研發與產品開發有興趣的學生加入工程團隊。 在為期兩個月的暑期實習中，你將與資深工程師合作，參與實際研發新產品轉量產專案，深入了解電子零組件產品開發流程，並將學術研究應用於實際工程問題。 ________________________________________ What You Will Do 1. 協助新產品開發與工程實驗測試 2. 參與產品驗證與測試 3. 進行實驗數據收集、分析與整理 4. 了解電子零組件產品開發流程與工程應用 ________________________________________ What We Are Looking For 1.大四或碩士在學學生 2.材料相關工程科系 3.熟悉 Office 文書軟體 4.具備良好的邏輯思考與問題分析能力 5.主動積極並具備團隊合作精神 6.具備跨文化能力、樂於挑戰自己 ________________________________________ Internship Information Program Duration 2026 年 7 月 – 2026 年 8 月（2 個月） Location 乾坤科技海外製造據點 Monthly Salary NTD 35,000 – 45,000 Internship Benefits 提供來回機票、免費膳宿（主管套房或家庭式宿舍）、海外出差補助 ________________________________________ What You Will Gain • 參與實際產品開發 • 與資深工程團隊共同合作 • 深入了解電子零組件產品開發流程 • 表現優秀者未來有機會優先加入乾坤科技

Company Description Bosch first started in Vietnam with a representative office in 1994. Bosch has its main office in Ho Chi Minh City, with branch offices in Hanoi and Da Nang, and a Powertrain Solutions plant in the Dong Nai province to manufacture pushbelt for continuously variable transmissions (CVT) in automobiles. In addition, Bosch operates a software and engineering RD center (Robert Bosch Engineering and Business Solutions Vietnam Co., Ltd). In July 2014, Bosch set up a new Automotive RD Center, located in Ho Chi Minh City. The continuous growth of this Centre is in line with Bosch’s strategy in Vietnam, which aims at becoming a manufacturing and RD hub in the Southeast Asian region. Currently four products are available: connectors, pushbelt, fuel supply, and diagnosis module (tank leakage). Job Description Support the analysis of laws / regulations and standards of countries worldwide, relevant to product development for Bosch mobility products in several technical topic areas.Aid in summarizing technical legal requirements and texts according to defined templates documenting them in a database.Assist continuous improvement in the team, for example, working process, team’s knowledge sharing and documentation, work quality, and harmonization among sub-teams.Bosch mobility products: automotive and non-automotive products, systems, software, and services.The technical legal documents cover, but are not limited to, the following areas: vehicle safety, exhaust treatment, On-Board Diagnostics, cybersecurity, materials, data protection, charging, emissions, fuel consumption, energy consumption, EMC, reliability, vibration, and radar sensors for autonomous driving.

Logitech is the Sweet Spot for people who want their actions to have a positive global impact while having the flexibility to do it in their own way.The role and team: Logitech is the established market leader in video communication solutions for consumers and enterprise users alike. Building on its strong marketing and engineering heritage, Logitech continues to push the boundaries of technology by investing in advanced video processing and AI/ML capabilities. The Video AI/ML Technology Development Team spearheads the creation of cutting-edge AI/ML algorithms and video pipelines for edge peripherals and host devices. Delivering unique human and machine vision solutions to Logitech’s webcam business, the team is at the forefront of technology and product innovation. Based at the EPFL Innovation Park, Lausanne (Switzerland), this team works closely with Software and Hardware development teams in North America and Asia. We are looking for a talented Senior Artificial Intelligence (AI)/Machine Learning (ML) Engineer to join a growing team of Data Engineers, Artificial Intelligence (AI)/Machine Learning(ML) Engineers and Software Developers, responsible for product and technology development in consumer webcams and applications. Following best practices in AI/ML and SW development, you will work in cross-functional teams across software and hardware engineering, program management, product management and design, to efficiently deliver on a product strategy. You will also work closely with Logitech’s Technology Office in developing the technology portfolio for disruptive innovation.  Your Contribution:Be Yourself. Be Open. Stay Hungry and Humble. Collaborate. Challenge. Decide and just Do. Share our passion for Equality and the Environment. These are the behaviors and values you’ll need for success at Logitech. In this role you will:Develop AI/ML algorithms and video pipelines across the entire model lifecycle: from design to training at scale, optimization, porting and deploying them to (embedded and hosted) target platforms. Working with a multidisciplinary team, you will champion best practices to turn cutting-edge research into robust and innovative solutions that define the future of human-machine interaction.Key Qualifications:For consideration, you must bring the following minimum skills and experiences to our team:Min. 5–6 years of relevant professional experience in algorithm development (signal processing and AI/ML) with a focus on live video.Significant industry experience in deploying deep learning models to real-world consumer products.Hands-on experience with latest AI/ML (Deep Learning) techniques and toolchains from architecture to training, evaluation, optimization, and porting to embedded systems (Linux/Android) and clients (MacOS/Windows).Experience training and scaling models on distributed computing clusters (e.g., AWS, GCP, or HPC clusters).Familiarity with data engineering: collection, generation, augmentation, and governance.Experience with Software Development Life Cycle (SDLC) best practices in embedded systems or host clients.Pragmatic, innovative, curious, and autonomous with a strong ability to communicate technical concepts to cross-functional partners.Skills:Design, training, evaluation, and optimization of deep neural networks (CNNs, RNNs, GANs, etc.). Knowledge of Transformers and LLMs is a plus.Proficiency in deep learning frameworks such as PyTorch, TensorFlow, or TinyML, as well as ONNX representations.Knowledge of supervised, unsupervised, and self-supervised learning.General-purpose programming languages, including Python, C/C, and C#.Software development experience on embedded platforms (e.g., ARM) and embedded AI.Education:MSc in Computer Science, Machine Learning, Data Science, or a related field.PhD in a related field is a plus.#LI-SL1 Across Logitech we empower collaboration and foster play. We help teams collaborate/learn from anywhere, without compromising on productivity or continuity so it should be no surprise that most of our jobs are open to work from home from most locations. Our hybrid work model allows some employees to work remotely while others work on-premises. Within this structure, you may have teams or departments split between working remotely and working in-house.Logitech is an amazing place to work because it is full of authentic people who are inclusive by nature as well as by design. Being a global company, we value our diversity and celebrate all our differences. Don’t meet every single requirement? Not a problem. If you feel you are the right candidate for the opportunity, we strongly recommend that you apply. We want to meet you!We offer comprehensive and competitive benefits packages and working environments that are designed to be flexible and help you to care for yourself and your loved ones, now and in the future. We believe that good health means more than getting medical care when you need it. Logitech supports a culture that encourages individuals to achieve good physical, financial, emotional, intellectual and social wellbeing so we all can create, achieve and enjoy more and support our families. We can’t wait to tell you more about them being that there are too many to list here and they vary based on location.All qualified applicants will receive consideration for employment without regard to race, sex, age, color, religion, sexual orientation, gender identity, national origin, protected veteran status, or on the basis of disability.If you require an accommodation to complete any part of the application process, are limited in the ability, are unable to access or use this online application process and need an alternative method for applying, you may contact us toll free at 1-510-713-4866 for assistance and we will get back to you as soon as possible.

【職缺價值 (Selling Points)】 站在技術最前緣：直接參與 AI Server、Hyperscale Server 等高階產品的從無到有 (End-to-end) 開發，接觸最新的 PCIe、DDR、NVMe 與 OCP 規範。國際化舞台：與歐美頂尖科技大廠的工程團隊直接對接，具備高度國際視野與英語溝通環境。具影響力的決策權：在組織中擁有高度技術話語權，從產品架構 (Architecture) 到量產 (Mass Production) 階段，您的決策將影響產品的成敗。 【主要職責】 團隊與資源管理：帶領硬體工程團隊進行 Server Board-level 與 System-level 設計；依據專案需求調配人力資源，並負責團隊績效管理與人才培育。技術決策與審查：主導關鍵技術決策，嚴格審查設計文件（Schematic / Layout / Validation Report），平衡設計品質（Quality）、成本（Cost）與可製造性（DFM）。專案執行與跨部門協作：與 Power、SI/PI、Thermal、Validation 等專業團隊緊密協作，確保專案符合時程與規格；提供工廠端（Manufacture Sites）工程支援，解決量產問題。客戶關係經營：擔任客戶（Client）的關鍵技術窗口，處理技術諮詢與客訴，並主導技術簡報，展示公司的產品架構與創新技術。

隨著AI發展，資訊安全正在面臨全新的機遇與挑戰。我們在尋找熱愛創新、善於解決問題的你！友達光電誠摯邀請對資安紅隊有興趣的您加入我們，與我們共創未來！【工作內容】一、資安自動化開發：1. 使用 AI 協助開發自動化腳本：透過 AI 工具加速腳本撰寫、維護與優化，串接各類內外部平台、威脅情資、弱點掃描工具之API2. 協助紅隊 (Red Team) 開發攻防輔助工具：參與紅隊攻擊模擬任務的工具開發，實作自動化掃描、資訊收集、漏洞驗證等腳本，零距離接觸真實攻防情境，累積實戰經驗3. 維護 CTEM（持續威脅曝露管理）所需的資料工程：協助整合多來源資安資料，建立可支援持續檢測、監控與提供視覺化的平台，直接影響企業資安決策的重要工作！二、數據分析：1. 分析內部關鍵系統日誌、行為模式2. 協助找出可能的異常事件或可疑行為

想提前感受外商半導體材料產業的工作節奏嗎？來我們這裡，跟著團隊一起學、一起試，找到屬於你的方向！台灣默克集團第五屆暑期實習計畫開跑囉! (請投遞申請至指定信箱: [email protected])● 申請截止日期: 2026/03/31● 實習日期: 2026/07/01 - 2026/08/31● HR電話/視訊面試 : 3/16 - 4/17● 主管面試: 4/20-5/15● 錄取通知: 最晚5/31前發出(依照確認時間會提前)● 正式報到: 7/1● 應徵方式: 為加速履歷審核及避免履歷遺漏 ，請勿以104方式投遞履歷，並請將個人履歷表統一寄至招募信箱：[email protected]● 信件主旨請註明:【2026默克暑期實習應徵申請_研發實習生(新竹) RD Intern_(姓名)】 事業群: 電子科技 Electronics (EL) 公司: 美商慧盛先進科技有限公司台灣分公司 工作地點: 新竹縣竹東鎮中興路四段669號2樓● 職稱: 研發實習生(新竹)● 職務說明: 參與實驗室工作及半導體材料研究、協助實驗數據資料管理專案等 -Job Title: RD Intern -Lab Experiment, Research sutdy on Semi Materials, Develop process to faciliate data management.etc.● 條件: 大學在校生(高年級優先)、碩士在校生 系所: 化學、化工、材料科學或相關領域 技能: 有CMP（半導體相關）經驗者優先 具基本統計概念儀器操作數據分析經驗者佳 英文流利者尤佳 -Qualifications: Bachelor's (Seniors preferred) or Master's students -Majors: Chemistry, Chemical Engineering, Materials Science, or related fields. -Have experiences in CMP (semiconductor related) is a plus. -Basic concepts of statistics, understanding of instrument operation, and experience in data analysis. -Jump / Minitab / Coding / AFM operation experiences are plus. -Fluent in English is a plus