Ready for a Tech Adventure in Tokyo? Join Our Internship Program – 4-6 Weeks of Software Engineering Internship Await!
Join HENNGE’s Global Internship Program (GIP): Full Stack Software Engineering Pathway in Tokyo, Japan. This unique 4-6 week internship at our Shibuya headquarters offers you personal and professional growth in an internationally diverse environment.
In HENNGE’s GIP: Full Stack Engineering Pathway, you will acquire practical application development skills using Python, Go, and/or TypeScript. GIP will provide you with hands-on experience using state-of-the-art cloud platforms such as Amazon Web Services, offering a full stack experience for application development.
Our primary working language is English, so no Japanese is required. Interns are expected to join the program at our Shibuya headquarters in Tokyo for 4-6 weeks, Monday to Friday, from 10 AM to 7 PM (JST). While the program is unpaid, we provide comprehensive subsidies, and outstanding participants may be offered full-time employment opportunities.
If you are interested in HENNGE’s GIP: Front-end Engineering Pathway instead, please check it out here:https://www.cake.me/companies/hennge/jobs/gip-frontend
Internship Details
Build end-to-end solutions using Python, Go, and/or TypeScript.Explore full stack development, cloud computing, and distributed systems.Internship Flow:Weeks 1-3: Full Stack TrainingWeek 4: DevOps TrainingWeeks 5-6 (conditional): Special Assignment - a unique project for each intern and specific to their batch.
Benefits
Round-trip airfares from and back to your country of residencePre-arrival support and visa guidanceMedical insurance* and a phone with mobile data will be provided during your internship in Tokyo, Japan**Up to 150,000 JPY of monthly subsidy to cover accommodation, meals, transportation, and networking activitiesSubsidized company events on top of monthly subsidy (Monthly Technical Sessions, Board Game Night, Get-to-know-you Lunches, and many others!) to get to know teams across divisionsAccess to online learning platform during the internship period
* Medical insurance will only be provided to interns who do not reside in Japan** This internship is an unpaid training program with a subsidy provided to all interns
Internship scheduleBatch 2 (2026): Mar 16 - Apr 17 (5 weeks) - Full stack Engineering Pathway (the application will be closed on November 18)Batch 3 (2026): Jun 1 - Jul 10 (6 weeks) - Full stack Engineering PathwayBatch 4 (2026): Aug 3 - Sep 11 (6 weeks) - Full stack Engineering Pathway
No requirement for relevant working experience
No management responsibility