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MAIN PURPOSE OF JOB: - As a key person in process team supporting the project lead working through all the design, implementation and start-up phases of project, have close alignment and collaboration with multiple stakeholders through the project life cycle - The role is to deploy & develop the filling & packing line from either technical center or supplier to meet the project requirements in terms of quality, scope, timing and cost. - Deliver expertise to project in area of filling & packing o

▋ 2025暑期實習計畫介紹 在德州儀器Texas Instruments實習的期間，將有專屬學長姐帶領您，體驗快速變動的跨國際工作環境，獲得充足的專業訓練、貼近實務工作的專案實務經驗，並能享用公司各式線上資源

As a GQ (Global Quality) Package Reliability Engineer at Micron Technology Inc., we are primarily responsible for package quality and reliability for Micron’s product lines working end to end for DRAM and HBM, provide inputs and approve phase gates, HVM monitoring and dispositions. This responsibility includes coordinating package qualification efforts for new products and when new designs, materials, or processes are introduced and providing recommendations on product release based on reliabili

A. Package design 1. Package RFQ for cost estimation 2. New device package feasibility & technical risk assessment 3. Package structure, BOM design 4. Package design rule setup & update 5. Coordinate DR0 design review meeting 6. PKG structure confirmation after setup B. Package research & development 1. Research & setup package roadmap / material roadmap 2. New package development 3. New material survey & capability development 4. Setup direct material purchase specification

This role will lead the Package Design Project with R&D team members and deliver advanced and innovative packaging resolutions to clients. (Flip-Chip) 1.Package RFQ and structure & BOM selection. 2.Direct material evaluation and survey. 3.FA and Reverse Engineering. 4.Package design rule maintain & update. 5.Advance products design / NPI projects development. 6.Research & setup package roadmap / material roadmap.

This role will lead the Package Design Project with R&D team members and deliver advanced and innovative packaging resolutions to clients. (Flip-Chip) 1.Package RFQ and structure & BOM selection. 2.Direct material evaluation and survey. 3.FA and Reverse Engineering. 4.Package design rule maintain & update. 5.Advance products design / NPI projects development. 6.Research & setup package roadmap / material roadmap.

A. Package design 1. Package RFQ for cost estimation 2. New device package feasibility & technical risk assessment 3. Package structure, BOM design 4. Package design rule setup & update 5. Coordinate DR0 design review meeting 6. PKG structure confirmation after setup B. Package research & development 1. Research & setup package roadmap / material roadmap 2. New package development 3. New material survey & capability development 4. Setup direct material purchase specification

．New process/ capability research & development ．New tool/ material evaluation (Photo process) ．Transfer new technology to mass production