Cake 找工作

▋ 2025暑期實習計畫介紹 在德州儀器Texas Instruments實習的期間，將有專屬學長姐帶領您，體驗快速變動的跨國際工作環境，獲得充足的專業訓練、貼近實務工作的專案實務經驗，並能享用公司各式線上資源

MAIN PURPOSE OF JOB: - As a key person in process team supporting the project lead working through all the design, implementation and start-up phases of project, have close alignment and collaboration with multiple stakeholders through the project life cycle - The role is to deploy & develop the filling & packing line from either technical center or supplier to meet the project requirements in terms of quality, scope, timing and cost. - Deliver expertise to project in area of filling & packing o

As a GQ (Global Quality) Package Reliability Engineer at Micron Technology Inc., we are primarily responsible for package quality and reliability for Micron’s product lines working end to end for DRAM and HBM, provide inputs and approve phase gates, HVM monitoring and dispositions. This responsibility includes coordinating package qualification efforts for new products and when new designs, materials, or processes are introduced and providing recommendations on product release based on reliabili

A. Package design 1. Package RFQ for cost estimation 2. New device package feasibility & technical risk assessment 3. Package structure, BOM design 4. Package design rule setup & update 5. Coordinate DR0 design review meeting 6. PKG structure confirmation after setup B. Package research & development 1. Research & setup package roadmap / material roadmap 2. New package development 3. New material survey & capability development 4. Setup direct material purchase specification

1.具封裝產品開發經驗，熟悉半導體封裝製程 2.具系統級封裝經驗為佳 3.具扇形封裝經驗後段經驗- SMT 製程、 Molding 製程、 SiP 製程相關站點 【薪資說明】 ◎依學經歷、科系、經驗相關性、特殊需求證照

如欲投遞履歷,請上Amkor官網 https://careers.amkor.com.tw/ Job responsibilities for this position includes physical design/layout in FC and Wirebond substrate based technology, package selection, and design rule implementation. This involves optimizing system co-design of IC and Package, IC floor-planning, ball array optimization to meet signal & power integrity, assembly, and thermal constraints.

如欲投遞履歷,請上Amkor官網 https://careers.amkor.com.tw/ Job responsibilities for this position includes physical design/layout in FC and Wirebond substrate based technology, package selection, and design rule implementation. This involves optimizing system co-design of IC and Package, IC floor-planning, ball array optimization to meet signal & power integrity, assembly, and thermal constraints.

Job Description - Work on OEE Improvement project for Wire bond process. Support Equipment engineer in MC Performance/Qualification, Work/Time Study, Capacity analysis & planning, Layout planning & execution - Gain technical knowledge on the identified tool and work with engineers, operators, and technicians. - Process Optimization: Support Process engineer in performing DOE, Wire bond Validation, Wire bond Assessment, Data Collection, Analysis and Report Compilation. Qualifications - Education

A. Package design 1. Package RFQ for cost estimation 2. New device package feasibility & technical risk assessment 3. Package structure, BOM design 4. Package design rule setup & update 5. Coordinate DR0 design review meeting 6. PKG structure confirmation after setup B. Package research & development 1. Research & setup package roadmap / material roadmap 2. New package development 3. New material survey & capability development 4. Setup direct material purchase specification

This role will lead the Package Design Project with R&D team members and deliver advanced and innovative packaging resolutions to clients. (Flip-Chip) 1.Package RFQ and structure & BOM selection. 2.Direct material evaluation and survey. 3.FA and Reverse Engineering. 4.Package design rule maintain & update. 5.Advance products design / NPI projects development. 6.Research & setup package roadmap / material roadmap.