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Logo of Chipbond Technology 頎邦科技股份有限公司.
【Equipment Engineering】1. Electroplating/Etching Equipment Engineer (Including Laboratory)【Day Shift】• Develop and maintain electroplating/etching equipment• Troubleshoot and repair equipment issues• Analyze root causes and implement corrective actions【Shift Work】• Handle electroplating equipment abnormalities• Handle etching equipment abnormalities• Draft preliminary reports on equipment issues2. Bumping Photo Equipment PM Engineer【Day Shift】• Perform routine equipment maintenance and testing• Manage and inventory machine parts【Shift Work】• Equipment maintenance and process conversion• Daily equipment inspections and parts inventory3. Bumping Photo Equipment Engineer【Day Shift】• Draft WI/SOP/OCAP documents• Troubleshoot and optimize equipment issues• Evaluate new equipment• Improve equipment uptime and product rework rate• Execute cost-down projects【Shift Work】• Troubleshoot equipment breakdowns• Draft preliminary equipment failure reports• Perform routine equipment maintenance and testing【Process Engineering】1. Sputtering / Photo Process Engineer【Day Shift】• Develop and implement new products and processes into mass production• Monitor and maintain process stability• Troubleshoot and improve process abnormalities• Improve product yield• Evaluate new materials and equipment• Plan experiments and analyze data• Collaborate with cross-functional project teams【Shift Work】• Handle abnormal products from production line• Develop exposure and measurement programs• Maintain and calibrate equipment• Support engineering experiments2. Electroplating Etching Process Engineer【Day Shift】• Develop and maintain electroplating/etching processes• Monitor equipment abnormalities• Participate in new product and equipment development• Conduct root cause analysis and implement countermeasures【Shift Work】• Handle electroplating process abnormalities• Handle etching process abnormalities• Work according to production shift requirements3. Laboratory Engineer• Sample, analyze, add, and monitor plating solutions; operate analytical instruments• Compare and analyze chemicals and send samples for third-party analysis• Replace or prepare new plating baths• Day and shift rotation required based on production needs---------------------------------------------------------------------------------【設備工程】1. 電鍍/蝕刻設備工程師(含化驗室)【常日】a.電鍍/蝕刻設備開發及維護b.電鍍/蝕刻設備異常維修c.異常原因分析及對策【輪班】a.電鍍設備異常處理b.蝕刻設備異常處理c.設備異常初步調查報告撰寫d.日班輪調做三休三,08:30~20:302. 凸塊黃光設備PM工程師【常日】a.機台例行性保養與測機作業b.機台Parts清點與管理【輪班】a.機台保養、製程轉換b.日常機台點檢、料件盤點c.日班輪調做三休三,08:30~20:303. 凸塊黃光設備工程師【常日】a.1. WI / SOP / OCAP 撰寫b.設備異常排除 / 機台異常改善優化c.新機台評估作業d.機台Uptime改善 / 產品重工改善e.Cost down專案【輪班】a.機台當機異常排除b.設備異常初步調查報告撰寫c.機台例行性保養與測機作業d.12小時制日夜班輪調【製程工程】1. 濺鍍黃光製程工程師【常日】a.新產品、新製程開發與導入量產b.製程穩定性監控與維護c.製程異常排除與改善d.產品良率改善e.新材料、新機台評估f.實驗規劃與資料分析g.跨部門專案合作【輪班】a.處理生產線異常產品b.建立曝光量測程式c.機台測機維護與調整d.協助執行工程實驗2. 電鍍蝕刻工程師【常日】a.電鍍/蝕刻製程開發及維護b.電鍍/蝕刻設備異常monitorc.新產品及設備開發d.異常原因分析及對策【輪班】a.電鍍製程異常處理b.蝕刻製程異常處理c.產線輪班需求3. 化驗室工程師a.電鍍藥液取樣/分析/添加/監控、分析機台操作b.藥水比對分析、委託分析c.換藥/新建電鍍鍍液d.產線日班輪班需求
Negotiable
1 years of experience required
No management responsibility

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