Report to AE ManagerIndividual ContributorWorking Mode: Fully Remote Business Travel is request (Taiwan Region) Requests Experience in Packaging House, e.g. ASE, SPIL, PTI, Amkor, Chipmos...etc.Key Responsibilities:**Design and execute experiments to support the sales team in delivering technical solutions to semiconductor clients.**Provide technical expertise in materials characterization, process applications, and reliability testing.**Diagnose and resolve technical challenges related to materials or component performance.**Collaborate closely with RD, product management, and marketing teams to develop customer-centric solutions.**Prepare and present technical reports and presentations in both English and Mandarin.**Conduct sample preparation and analytical testing (e.g., SEM/EDS, FTIR, TGA), including method development.**Maintain detailed documentation of testing procedures and ensure full traceability of data.What This Role Offers:** Deep exposure to semiconductor packaging and hands-on experience with die-attach processes.** Broad understanding of technologies in IC packaging and advanced packaging applications. ** Autonomy to innovate and develop customized technical solutions utilizing in-house lab resources.** Leadership development opportunities through collaborative team projects.** Potential for customer-facing responsibilities as an Application Engineer, facilitating direct client communication and technical support.Requirement:** Master’s degree in Materials Science, Chemistry, Chemical Engineering, or related field** At least 3 years of work experience in semiconductor, materials testing, component reliability, or related fields as Process Engineer, Product Engineer, Application Engineer, Process Integration Engineer.** Strong analytical mindset and hands-on experience in materials characterization techniques
No requirement for relevant working experience
No management responsibility