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【Responsibility】 -散熱方案設計與開發：1. 針對客戶的 RFQ (Request for Quotation) / RFP (Request for Proposal) 文件，提供高品質、具競爭力的散熱解決方案。2. 設計穩健的主動式與被動式散熱解決方案，確保符合行業規範，並滿足產品部門及客戶的雙重需求。3. 運用 FloTHERM進行伺服器等級的系統熱模擬分析，評估設計方案的可行性與潛在風險。 -測試、驗證與故障分析：1. 制定並執行完整的系統散熱測試計畫，驗證設計是否符合規格。2. 分析測試數據，撰寫驗證報告，並確認測試結果。3.

1. Experience as Mechanical Engineer developing electronic products, and have experience in server field is preferred.2. Responsible for server product design, including ME parts design and PCBA placement.3. Responsible for participating server product verification and debug.4. F

1. Experience as Mechanical Engineer developing electronic products, and have experience in server field is preferred.2. Responsible for server product design, including ME parts design and PCBA placement.3. Responsible for join server product verification and debug.4. Familiar w

1. Experience as ME leader in server field.2. Responsible for server product design, including ME chassis design, Rack Design, PCBA design and system placement.3. Responsible for join server product verification and debug.4. Need to onsitevendor side to confirm product production

1. Experience as Mechanical Engineer developing electronic products, and have experience in server field is preferred.2. Responsible for server product design, including ME parts design and PCBA placement.3. Responsible for join server product verification and debug.4. Familiar w

1. Experience as Mechanical Engineer developing electronic products, and have experience in server field is preferred.2. Responsible for server product design, including ME parts design and PCBA placement.3. Responsible for join server product verification and debug.4. Familiar w

1. Experience as Mechanical Engineer developing electronic products, and have experience in server field is preferred.2. Responsible for server product design, including ME parts design and PCBA placement.3. Responsible for join server product verification and debug.4. Familiar w

1. To define the L11 system layout and its manufacturing process, including mechanical, power, networking and packing.2. To support the design and build of datacenter and manufacturing infrastructure, including power, liquid cooling and air condition3. Communication with other te

1.帶領團隊完成AI server水冷散熱設計，包含L10與L11，向處級主管與BU呈報。2.對客戶完成RFP討論，對內跨部門溝通，帶領團隊(預計四名)完成設計與驗證；3.對外與供應商提出設計規格與製程/品質管控。4.除專案外，同時針對server散熱技術(coldplate, CDU, coolant等)做持續開發與性能改善，並增加模擬之準確性

新產品開發,機構設計,模具檢討及量產導入1.設計提案2.機構結構設計開發3.生產組裝及模具檢討(DFX)4.問題解析及對策提案5. 機構Team管理