Cake Job Search

1. 配合晶圓技術發展，研發先進封裝 Bump, Flip Chip, SiP, FO, TSV, 2.5D 及 3D-IC 封裝技術解決方案。2. 規畫執行客戶 Bumping, Flip Chip, SiP, FO, TSV, 2.5D 及 3D-IC 專案計畫。3. 負責封裝失效模式之分析及解決對策。4. 研發與蒐集先進封裝技術及提供客戶最佳封裝解決方案。

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.We are seeking a highly motivated and talented RD Engineer to join our team in developing advanced IC packaging technologies. This position offers an exciting opportunity to work on cutting-edge solutions, such as CoWoS (Chip-on-Wafer-on-Substrate), Fan-Out Wafer Level Packaging (FOWLP), and 3DIC (Three-Dimensional Integrated Circuits). The ideal candidate will have strong technical expertise and a passion for innovation in semiconductor packaging design and analysis.Join us in shaping the future of advanced IC packaging technologies and contributing to groundbreaking innovations in the semiconductor industry. This role provides a unique opportunity to work in a dynamic environment, solve challenging engineering problems, and make a meaningful impact on next-generation packaging solutions.Responsibilities:1. Conduct risk assessments and provide mitigation plans for IC packages through simulation and experiment, interpreting experimental data and simulation to provide insights into material selection and design improvements.2. Practice FEM and DOE in problem solving and path finding particularly on packaging. Conduct mechanical or thermal simulations using finite element analysis (FEA) techniques to evaluate and optimize packaging performance, and analyze stress, deformation, and heat dissipation characteristics to ensure reliability and efficiency of packaging designs.3. Continuously improve simulation methodology, refine material modeling, and enhance script automation capabilities.

1. 進行流力、熱流、熱傳的建模分析，或結構應力、應變、疲勞的建模分析2. 電性模擬、量測、優化及相關需求對應3. 熟悉模擬軟體Flotherm/ ANSYS4. 產品前期模擬評估

1. SI/PI 模擬分析及參數優化2. S-parameter與 RLCG 莘取3. PDK資料維護，確保封裝設計符合系統需求4. 新技術前期的模擬評估及設計規劃

1. New process/ capability research development2. New tool/ material evaluation3. Transfer new technology to mass production

1.新製程/新材料/新機台評估及量產2.品質良率改善 3.製程流程簡化/產能提升/材料人力減少等cost down專案4.特殊工程品handle 5.相關生產的製程系統改善6.FEMEA管理與維護 7.製程相關機台及生產參數維護與改善班制：作三休三or作四休二※薪資說明：◎依學經歷、科系、經驗相關性、特殊需求證照及專長等條件核敘個人薪資。◎輪班津貼/班制津貼另計。

【工作內容】1.新製程/新材料/新機台評估及量產2.品質良率改善 3.製程流程簡化/產能提升/材料人力減少等cost down專案4.特殊工程品handle 5.相關生產的製程系統改善6.FEMEA管理與維護 7.製程相關機台及生產參數維護與改善 8.主管交辦事項※ 無經驗可，提供完整在職訓練【工作班制】．班別：作三休三 OR 作四休二 ．時間：日班07:20-19:20／夜班19:20-07:20（實際工時10小時，休息2小時）．輪調：每3個月日夜輪調一次【工作地區】湖口光復廠：新竹縣湖口鄉光復路12號【薪資說明】．依學經歷、科系、經驗相關性、特殊需求證照及專長等條件核敘個人薪資。．輪班人員之輪班津貼班制津貼另計

MAIN PURPOSE OF JOB: - As a key person in process team supporting the project lead working through all the design, implementation and start-up phases of project, have close alignment and collaboration with multiple stakeholders through the project life cycle - The role is to deploy & develop the filling & packing line from either technical center or supplier to meet the project requirements in terms of quality, scope, timing and cost. - Deliver expertise to project in area of filling & packing operation ensuring full compliances, health and safety, product safety and environment are never compromised A DAY IN THE LIFE OF A PROJECT F&P ENGINEER 1. Filling/Packing System Design: - Support Project lead in defining the project scope, goals and deliverables that support business goals in freeze dry filling area. - Work with process user/technical center and design consultant to finalize the required system design (including URS, P&ID and TPM characteristics). - Closely work with draftsman in developing the installation designs (BIM). - Ensure system design fulfill process operation requirement per Nestlé standard. - Create and review specifications of Freeze dry processing and components. - Assure all specifications are feasible to source by connecting to suppliers and manufacturing operations. 2. Project Management: - Support Project lead to create detailed project timelines, budgets, and resource allocation plans. - Identify potential issues and implement corrective actions as necessary. - Be responsible for the overall site filling & packing installation works and monitor the progress. - Manage the day-to-day operations aspects of the project - filling & packing works and support the E&A installation. - Close coordinate with construction streams and startup streams, ensure all the installation designs are fitting to the integrating BIM design and operational requirement, deliver the first-time right installation.3. Lead and manage: - Coordinate with external installation team to ensure a safe and smooth installation execution; resolve any conflict between owner-contractors and among contractors. - Mobilize resources (internal & external) - Execute on freeze dry filling/packing installation and commissioning timely by making sure product and testing quality level is appropriate. 4. Safety and Health: - Implement site HSE protocols to ensure installation work is done is a safe manner and observe all company/governmental regulations. - Promote development of environmental-friendly and sustainable solutions.