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Product Engineer
Logo of 乾坤科技股份有限公司_台達電子集團.
我們正在尋找產品研發工程師,合併FAE工程師 專業範圍涉及 1. 合金材料 (材料相關) 2. 熱模擬 與 機械模擬 (機械相關) 3. 產品應用 (電子電力相關) 主要產品為各式電阻與其高階應用的電流感測元件,為以下工作內容 1. 產品應用調查與市場調查 2. 產品規格制定與產品設計 3. 特性測試 4. 客戶應用溝通與對應 需要具整合能力的人加入,從基礎到深入的了解客戶需求、產品設計工程、製程工程 由熟悉的領域加以深入,不熟悉的領域進一步加強
応相談
1年以上の経験必須
管理業務なし
Logo of 乾坤科技股份有限公司_台達電子集團.
我們正在尋找產品研發工程師,合併FAE工程師 專業範圍涉及 1. 合金材料 (材料相關) 2. 熱模擬 與 機械模擬 (機械相關) 3. 產品應用 (電子電力相關) 主要產品為各式電阻與其高階應用的電流感測元件,為以下工作內容 1. 產品應用調查與市場調查 2. 產品規格制定與產品設計 3. 特性測試 4. 客戶應用溝通與對應 需要具整合能力的人加入,從基礎到深入的了解客戶需求、產品設計工程、製程工程 由熟悉的領域加以深入,不熟悉的領域進一步加強
応相談
1年以上の経験必須
管理業務なし
Logo of 乾坤科技股份有限公司_台達電子集團.
主要職責:1. 鋰電池產品專案開發與整合。2. 客戶需求對應與問題解決。3. 市場調查,專利分析與佈局。4. 電池產品設計模擬仿真。工作技能:1. 具鋰離子電池產品及材料相關分析開發經驗佳。2. 態度積極正向行動能力強。3. 具良好溝通協調能力。
応相談
3年以上の経験必須
管理業務なし
Logo of 精材科技股份有限公司.
1.製程問題解決與分析2.良率改善3.專案改善規劃、執行(cost down, productivity)
WLCSP
Advanced Packaging
Logo of Chipbond Technology 頎邦科技股份有限公司.
1. Product Engineer【Day Shift】• Proficient in operating and debugging inspection equipment in QC area• Understanding of basic Bumping/Backend processes; ability to identify defect types• ADC team must have precise defect classification capability• Handle abnormal lots and write SOPs; documentation owners must understand FMEA and Control Plan• Strong communication skills for cross-functional coordination; lead optimization/automation (CIM) projects【Shift Work】• Operate inspection equipment and maintain program functionality; learn setup processes• Confirm, investigate, and process defective materials• Support data collection and issue investigation for customer and engineering projects• Execute supervisor-assigned tasks and achieve department KPIs2. BE Engineer• Coordinate with production control for pilot lots, returns, and engineering wafers final out• Confirm customer work orders• Prepare special process checklists for BE1 and BE2• Maintain process station flows• Create and modify MES process parameters• Final out test area products• Drive improvement projects and system enhancements• On-call during holidays (for issue resolution and urgent final outs)3. Bump Engineer• Support pilot lots, returns, and engineering wafer final outs with production control• Confirm customer work orders• Maintain product specifications, forms, and create EDC entries• Modify and maintain process station/machine group settings• Update process parameters and product specs• Configure backup masks and stencils• Manage mask hold/scrap and product data• Support manager-assigned tasks• On-call during holidays (for urgent issues or final outs)• Configure system Q-time and rework control cards• Set up mass production configurations for new products4. FA Engineer• Analyze customer complaint issues• Analyze process improvement results• Analyze experimental data for new process introduction• Manage FA case scheduling• Operate FA lab equipment and perform basic troubleshooting• Arrange outsourced FA services and coordinate billing• Purchase and manage lab consumables (e.g., polishing materials, liquid nitrogen, sputter targets)• Maintain lab equipment and environment• Maintain related WI documents and forms• Assist with customer audits• Support manager-assigned tasks5. Photomask Layout Engineer• Perform photomask design and outsourcing• Design and outsource backup/revised masks• Maintain system settings for masks and stencils• Create photomask process cards• Create and route process cards for stencils• Manage mask/stencil PR and procurement• Generate 2D map layouts• Process mask/stencil hold/scrap and initiate approval workflows• Draw POD diagrams6. Packaging Design Engineer• Evaluate customer specifications (CRN/CDR), conduct discussions and compile data for customer confirmation• Communicate and resolve packaging-related issues• Handle system anomalies (contact and data confirmation)• Maintain packaging BOM and material info• Create and revise packaging WI documents and review related files• Maintain FMEA and Control Plan• Evaluate and test new packaging materials/second sources• Create VQA records for new packaging materials• Maintain packaging system and consolidate PK Verify results for various customers• Optimize packaging system workflows• Support customer audits related to packaging issues• Manage shipments without ERP records or with special labeling requirements• On-call during holidays for anomaly resolution
応相談
経験年数不問
管理業務なし
Logo of Chipbond Technology 頎邦科技股份有限公司.
1.新產品開發導入2.客訴處理3.客戶稽核應對4.客戶特殊需求support【薪資說明】◎依學經歷、科系、經驗相關性、特殊需求證照及專長等條件核敘個人薪資。
応相談
経験年数不問
管理業務なし
Logo of Chipbond Technology 頎邦科技股份有限公司.
1. 對應客戶(新產品進度)之工程窗口2. 協助客戶稽核及會議追蹤事項3. 新產品的導入及進度控管4. 客戶產品異常分析安排, 報告review 與整合5. 客戶特殊需求討論6. 新產品設計審查7. 工程資料整合窗口其他說明:邏輯思考、溝通協調與工程能力有新產品開發,客戶應對, 工程討論/整合,客訴處理經驗者佳具半導體、封裝或面板廠經驗佳/無經驗可※薪資說明:◎依學經歷、科系、經驗相關性、特殊需求證照及專長等條件核敘個人薪資。
応相談
経験年数不問
管理業務なし
Logo of Chipbond Technology 頎邦科技股份有限公司.
【職務說明】1.產品維護及管理 2.測試效率提升3.產品異常分析4.國內外客戶稽核(Con-call、實體、帶線)5.單位稽核文件撰寫修改、系統品質建立提升6.對外異常報告撰寫7.內部作業稽核改善【薪資說明】◎依學經歷、科系、經驗相關性、特殊需求證照及專長等條件核敘個人薪資。
応相談
経験年数不問
管理業務なし
Logo of Chipbond Technology 頎邦科技股份有限公司.
【職務說明】1.執行客戶工程品借機支援作業。2.執行異常產品Datalog蒐集作業。3.執行與排除線上異常相關問題。4.夜間及假日工程支援作業需求。5.處理其他工程事項交辦。6.配合4/2或3/3日夜輪值(日夜班三個月輪調).。【薪資說明】◎依學經歷、科系、經驗相關性、特殊需求證照及專長等條件核敘個人薪資。◎輪班津貼/班制津貼另計。
35K ~ 60K TWD / 月
経験年数不問
管理業務なし
Logo of Chipbond Technology 頎邦科技股份有限公司.
1.新產品導入工程作業2.客戶與工程支援3.產品參數維護及管理4.產品異常分析及改善5.量產流程訂定及改善6.工程資料整合7.專案執行8.國外客戶對應窗口◎ 配合工作廠區輪調,初期在竹科 研發廠,後轉至湖口 光復廠◎依學經歷、科系、經驗相關性、特殊需求證照及專長等條件核敘個人薪資。
応相談
経験年数不問
管理業務なし

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