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Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.Advanced Packaging's mission is to provide the best heterogeneous integration technology (HIT) that realizes system expansion and performance improvement, and to influence the development of the industrial ecosystem by achieving innovation together with our partners as the leading advanced packaging solution provider.Responsibilities:Act as first line guardian of TSMC world class chip manufacturing process. Ensure the stable quality of wafers output by monitoring and adjusting process parameters to enhance machine efficiency.1. Develop and maintain baselines, including setting up recipes.(1) Improve the stability and accuracy of metrology recipes to enhance yield and reliability qualifications.(2) Responsible for transferring metrology solutions to volume manufacturing.2. Employ cutting-edge technology to 3DIC metrology, including SoIC, CoWoS, InFO, and Panel.(1) Leverage your analytical abilities to improve metrology performance, guaranteeing high yield and device efficiency.(2) Identify challenges, formulate methodologies, propose solutions, and new metrology evaluation plans.

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.Advanced Packaging's mission is to provide the best heterogeneous integration technology (HIT) that realizes system expansion and performance improvement, and to influence the development of the industrial ecosystem by achieving innovation together with our partners as the leading advanced packaging solution provider.Responsibilities:1. Advanced panel level packaging development for CoPoS technology.2. Exploratory panel level packaging process/material/tool development for new applications.3. Process stability/manufacturability improvement for yield and reliability qualification.4. Responsible for transferring the process/material/tool for mass production.

About MixelMixel Vietnam is an innovator of high-performance analog mixed signal semiconductor IPs whose solutions are powering Mobile, Display, Camera, Automotive, VR, AR and AI applications.Our mission is to provide our customers and partners with outstanding mixed-signal, silicon-proven IPs, creating in the process a differentiating technology that sets your products apart. In August 2025, Mixel Group became part of Silvaco Group, strengthening its global presence and expanding advanced mixed-signal semiconductor IP capabilities within Silvaco Group.At Mixel Vietnam, you will find an inspiring environment with a strong focus on technical innovation, people well-being, no layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We value open communication, empathy, mutual trust, and respect. Job Description About the roleAs a Senior Layout Engineer, you will own the technical execution of advanced memory IP layouts, focusing on hands-on design, verification, and optimization. You will drive technical excellence and innovation, supporting the delivery of high-quality layout solutions. Technical Execution Innovation●Own the layout design and verification of critical memory IP blocks, including floorplanning, placement, routing, and signoff.●Troubleshoot and resolve layout issues, driving technical solutions and improvements.●Develop and implement automation scripts to accelerate layout cycles and improve quality.●Conduct technical reviews and benchmarking of layout deliverables.Technical Collaboration●Provide technical input on project planning and risk assessment.●Collaborate with layout leads, CAD, and process teams to optimize layout flows and methodologies.

Lam Researchis hiring STEM talents in Malaysia 🇲🇾 👇 Click the link below or "apply now" to grab a chance for the Career Talk On-Site Interview in KL Penang https://global.cake.me/202605lamresearchform . Application is closing soon! REGISTER NOW toexplore global career opportunity in theleading semiconductor processes and fabrication equipment supplier! . . . 📍 Schedule . 📍 Physical Interview qualifications Fresh graduates:2025 and 2026 graduates with bachelor's degrees or abovePreferred Majors:Mechanical/Mechatronic EngineeringElectrical/ElectronicEngineeringChemical EngineeringOther Semiconductor-Related FieldExperienced talents:Semiconductor equipment engineer and field service engineer related experiencesExpertise in Etch/ Clean/ Thin Film/ Deposition will be a plus *English communication required. Mandarin-speaking or interest in learning Mandarin is a big plus!*Open to frequent business travel. . 📍 Who should attend the career talk speed Interview Engineering talents/students who want to work abroad in TaiwanEngineering talents with the following majors：Mechanical/Mechatronic EngineeringElectrical/Electronics EngineeringChemical EngineeringMaterial ScienceOther semiconductor-related majors . 📍 Hiring positions Field Service Engineer (Etch, Clean, Thin Film) .📍 Work locationTaichung/ Taoyuan/ Miaoli/ Tainan,Taiwan . 📍 About Lam Research A Leading Semiconductor Processes and Fabrication Equipment Supplier At Lam Research, we create equipment that drives technological advancements in the semiconductor industry. Our innovative solutions enable chipmakers to power progress in nearly all aspects of modern life, and it takes each member of our team to make it possible. Across our organization, our employees come to work and change the world. We take on the toughest challenges with precision and accuracy. We push for the next big semiconductor breakthrough. We lead the way in one of the most critical and fast-moving industries on the planet. And we do it together, with deep connections and limitless collaboration.The impact we have on the world is made possible by focusing on our people. We recognize and celebrate our teams’ achievements. We strive to create an inclusive and diverse culture where everyone’s contribution and voice has value. We evaluate and evolve our offerings, so our people receive the support and empowerment to do meaningful things for their lives, careers, and communities. Because at Lam, we believe that when people are the priority, and they’re inspired to unleash the power of innovation for a better world together, anything is possible. . 📍 How to apply Click "apply now" below to register for the Speed Interview on 6 May(Wed.) - 10 May(Sun.) in Malaysia!

Open to All Nationalities 【This position only accepts applications submitted through the official SurveyCake form】 Please submit your resume via the official SurveyCake application form at the following link ：https://www.surveycake.com/s/rLZgv 【 2026 SSSTC Seed Team Internship ｜ Join Our Global Team 】 Curious about what it's like inside a global tech leader? Your career journey begins with that first step of exploration. 🌱 Join the SSSTC Seed Team for a summer of authentic workplace experience. We value every perspective and are looking for both local and international students to join our global team. With mentor guidance and cross-cultural collaboration, let’s discover the possibilities of your future career together! 🚀 ☀ Program Highlights (S.E.E.D.) S - Storage: Master Core SSD Knowledge industry-leading tech. E - Evolution: Expert Career Navigation through senior mentorship. E - Empowerment: Industry Empowerment to explore diverse career paths. D - Diversity: Global Team Exchange immersive cultural collaboration. ☀ Application Info Deadline｜2026/05/22 (Fri) Internship Duration｜2026/07/1 – 08/31 Location｜Taipei Neihu / Hsinchu Jobs Opening｜Firmware / NVMe / TPM / Supply Chain [Job Responsibilities] 1.Evaluate NAND Flash characteristics and integrate them into system-level applications 2.Conduct reliability analysis and failure investigation of NAND Flash components [Job Requirements] 1.Major in Electrical Engineering, Electronics Engineering, Computer Science, Information Management, Industrial Engineering, or related fields 2.Familiar with C, C++, or MATLAB 【About Us】 公司官網: https://www.ssstc.com/tw/ HR官網: https://hr.ssstc.com/ Facebook: https://www.facebook.com/SSSTC.TW/ Instgram: https://instagram.com/ssstc.life Linkedin: https://tw.linkedin.com/company/ssstc YouTube: https://www.youtube.com/@ssstc4456/featured

Các bạn vui lòng nhấn nút "APPLY NOW/ỨNG TUYỂN" để đăng ký tham gia! Ngày hội việc làm chuyên sâu về bán dẫn do Cake phối hợp cùng với Khoa Vật Lý - Vật Lý Kỹ, Thuật trường Đại học Khoa học tự nhiên, ĐHQG-HCM tổ chức, nơi sinh viên có cơ hội gặp gỡ trực tiếp các doanh nghiệp bán dẫn hàng đầu. 📍 Địa điểm:227 Nguyễn Văn Cừ, Phường Chợ Quán, TP. HCM (Trường Đại học Khoa học tự nhiên, ĐHQG-HCM) ⏰ Thời gian:08:00 - 12:00, 23/05/2026👉Xem thêm thông tin ở đây!

1.設備相關軟體規格設計與規畫2.設備相關軟體程式設計3.設備相關軟體程式Review與指導4.設備相關軟體設計改善與解析, 修正5.客戶端軟體機能驗證6.軟體機能諮詢回答

1.RF/mm-wave Device Characterization; Measurement, Data Analysis and Reporting. 2.Device pcell design, test structure creation and tape out. 3.Work with modeling PDK team for design enablement, model validation and pcell improvement. 4.Liaise with vendor, assist lab manager for measurement tool set up, calibration, maintain good measurement quality.

• SIMS/TEM sample preparation, SIMS/FIB/TEM operations. • Material analysis (EDX and EELS analysis) • 6S and ESH maintenance • Equipment maintenance and new technology development.

1.To be responsible for driving a leading edge process/device development and optimization of RFSOI devices in order to meet scaling, performance, reliability, and manufacturability requirements. 2.To conduct device pcell design, test structure creation and tape out. 3.To perform extensive process and device TCAD simulation using various techniques to optimize device performance and ensuring reliability. 4.To perform device characterization and analysis with the aid of DC-IV bench test. 5.To work with modeling PDK team for design enablement, model validation and pcell improvement.