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1.執行新製程各項DOE 2.新產品、新製程之設備及相關檢、治具開發 3.新專案可行性評估

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.Advanced Packaging's mission is to provide the best heterogeneous integration technology (HIT) that realizes system expansion and performance improvement, and to influence the development of the industrial ecosystem by achieving innovation together with our partners as the leading advanced packaging solution provider.Responsibilities:Act as first line guardian of TSMC world class chip manufacturing process. Ensure the stable quality of wafers output by monitoring and adjusting process parameters to enhance machine efficiency.1. Develop and maintain baselines, including setting up recipes.(1) Improve the stability and accuracy of metrology recipes to enhance yield and reliability qualifications.(2) Responsible for transferring metrology solutions to volume manufacturing.2. Employ cutting-edge technology to 3DIC metrology, including SoIC, CoWoS, InFO, and Panel.(1) Leverage your analytical abilities to improve metrology performance, guaranteeing high yield and device efficiency.(2) Identify challenges, formulate methodologies, propose solutions, and new metrology evaluation plans.

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.Advanced Packaging's mission is to provide the best heterogeneous integration technology (HIT) that realizes system expansion and performance improvement, and to influence the development of the industrial ecosystem by achieving innovation together with our partners as the leading advanced packaging solution provider.Responsibilities:1. Advanced panel level packaging development for CoPoS technology.2. Exploratory panel level packaging process/material/tool development for new applications.3. Process stability/manufacturability improvement for yield and reliability qualification.4. Responsible for transferring the process/material/tool for mass production.

Why Join Us? When you join AI Team at BOS Semiconductors, you will receive training and hands-on experience to master the following knowledge and skills, which will significantly benefit your career development. In-depth Deep Learning Architecture: Study and gain a deep understanding of AI model architectures like CNNs, RNN, LSTM, and Transformers.Programming Mastery: Learn and master your skills in Python, C/C++, and other essential languages.Cutting-edge Technology: Learn about the latest in NPU architecture and how to optimize deep learning models for maximum performance.Specialized Career Path: Develop into a software engineering expert, specializing in optimizing AI models on NPUs, positioning yourself at the forefront of AI and semiconductor technology. Company Overview: BOS Semiconductors is a fabless startup based in South Korea, established in 2022. The company specializes in designing and developing system-on-chip (SoC) solutions. Their innovations include high-performance, low-power semiconductors, CPUs, graphics cards, and high-speed signal interfaces, all of which are essential for automotive semiconductors. Hyundai Motor Group has invested in BOS Semiconductors, anticipating collaboration towards the semiconductor technologies necessary for future mobility.BHRC (BOS Semiconductors Vietnam), established in Ho Chi Minh City in November 2022, is a key RD center comprising 40% of BOS's total RD workforce, with a primary focus on hardware and software development. The main areas of software include developing embedded software for ADAS chips, AI accelerator chips, and MCUs responsible for functional safety in autonomous vehicles. One significant opportunity for the BHRC software team is to learn about the world's most advanced NPU architecture and design the BUDA and metal-BUDA compilers for this NPU engine.The NPU vendor collaborating with BHRC is Tenstorrent, led by the renowned Jim Keller. He is famous for creating high-performance CPU architectures at Apple, Intel, AMD, and Tesla and now leads Tenstorrent, a startup developing RISC-V-based NPU engines and Transformer-based server chips. BOS's executives, former SoC developers at Samsung, have a special relationship with Jim Keller, having collaborated on several projects, including the ADAS chip for the Tesla Model 3. This relationship has allowed BOS to incorporate the world's most advanced A/I engine as a core IP in its first production chip and to take on the mission of developing the compiler for the most advance NPU architecture. Key Responsibilities: Develop and optimize compiler tools and runtime systems specialized for NPUs, focusing on ResNet50 and other deep learning models.Collaborate with the AI research and development team to understand the architecture of the NPU and develop strategies for optimizing AI models for this hardware.Design, implement, and optimize compiler algorithms and runtime libraries to enable efficient execution of AI models on NPUs.Work closely with the AI engineering team to integrate AI models into our automotive systems and ensure optimal performance on NPU hardware.Analyze and evaluate the performance of AI models on NPUs, identify bottlenecks, and propose solutions for optimization.Work closely with infrastructure, hardware, and do research to design solutions across the ML stack.Write clean, testable, and well-documented code to ensure long-term maintainability.Stay up to date with the latest advancements in compiler technology and AI hardware architecture to continuously improve the performance and efficiency of our AI models.

Assist in the verification of complex digital circuits in collaboration with senior engineers.Review IP/SOC specifications and architecture to understand design features.Contribute to defining and executing the verification plan through testbench development, test generation, failure analysis, and coverage analysis.Engage in RTL and gate-level simulations to ensure design integrity.Support the implementation and enhancement of design verification methodologies and flows.

Generative AIDevelop, maintain, and optimize Agentic AI applications utilizing latest GenAI technologies - LLM, multi-modal, RAG, Function CallingImplement training processes on chosen models, optimizing hyperparameters to improve model accuracy.Ability to analyze GenAI scientific paper to apply on real work use-caseSoftware development designDesign and implement user interfaces to provide seamless and intuitive user experiences.Build and integrate RESTful APIs for robust and scalable application interactions.Write efficient and maintainable code in Python, JavaScript, and HTML.Experience in SQL databases usage and maintenanceWrite efficient and detail oriented automated testSoftware deployment and release managementUse Docker to containerize applications for consistency across development, testing, and production environments.Utilize Git for version control and collaborative development.Install and configure software applications, ensuring proper system integration.Diagnose and troubleshoot hardware, software, and network issues.Collaborate with the software design team to implement and adhere to software design and testing workflows.

Director of Quality Engineering We areseeking a seasoned Director of Quality Engineering to lead our quality management initiatives with the world's foremost cloud service providers. This pivotal role demands an expert who can effectively manage and enhance quality across four critical domains: customer quality (returns, root cause analysis, and corrective actions), supplier quality (audits and yield management), new product development (reliability qualifications and design for reliability), and regulatory compliance (ISO, RoHS, conflict materials, safety, exports, and electromagnetic interference). This position involves periodic international travel, approximately 10%, subject to business requirements.

1. New materials validation and performance improvement2. Evaluate new product operations and processes3. Set up mass production programs4. Monitor and analyze process abnormalities

THE ROLE: AMD is looking for a highly talented engineer to join our Datacenter Solution Engineering team as an overall expert in Server system debug. System Debug Engineer will work closely with our customers who are developing AMD EPYC based systems. Join us!  THE PERSON: This engineer will work with validation and our customers during critical issue escalations and help get issues resolved in time to meet product development or sustaining milestones. Opportunity to learn and support pre-silicon and post-silicon issue debug. KEY RESPONSIBILITIES: Include debugging Server systems with an emphasis on platform level debug.Knowledge and use of standard debuggers, programmers, and emulators.A thorough understanding of Server industry standard busses, such as DDR, PCIe, SATA, and other high-speed I/O protocol is required in addition to detailed knowledge of high-speed digital design and signal integrity.Further requirements include a strong understanding of BIOS, OS, and driver interactions at the system level as well as a proficient understanding of x86 CPU architecture and functionality.Providing root cause analysis and guidance to internal and customer design teams to help close issues.Support project independently and handle all issues to co-work with internal and external team well.A self-starter and able to deal with a high level of ambiguity.