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Develop B2B2C e-Commerce Platform with latest technologies Be a teammate in a highly dynamic and innovative team in Agile/Scrum approach 使用最新技術開發 B2B2C 電子商務平台 使用 Agile/Scrum 方法，希望您加入我們成為充滿活力與創新精神團隊的一員 Job responsibilities: 1. Establish communication and cooperation with the leadership team and various departments, promote and guide developers to carry out developer work, and be responsible for project planning, online maintenance, etc.2. Support the role of technical backbone in the development team, bear the reality of core technology, and solve technical problems in the development process.3. Conduct system analysis and design according to user needs, provide relevant solutions, and write relevant design and development documents.4. Maintenance and optimization of different systems used in different locations, and solved the technical problems encountered by the development team.5. Perform ad-hoc tasks assigned by management. 1.與領導團隊及各部門建立溝通與合作關係，推動並引導開發人員執行開發相關工作，負責專案規劃、上線維運等事項。2.擔任開發團隊中的技術骨幹角色，承擔核心技術的實作工作，並解決開發過程中的技術問題。 3.根據使用者需求進行系統分析與設計，提出相關解決方案，並撰寫設計與開發相關文件。 4.負責不同地點所使用系統的維護與優化，並協助解決開發團隊遇到的技術問題。 5.執行主管交辦任務。

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Role: Building world-class cloud native infrastructure and ramping to high-volume production is key to enabling TSMC to scale worldwide. We are looking for a highly motivated engineer to join our global systems development team to support TSMC fabrication worldwide. The ideal candidate is highly technical with multi-discipline engineering skillset, that can push the limits of complex system design at large scale. Responsibility: 1. Develop state-of-the-art applications 2. Continue to refactor existing applications 3. Write and pass various kinds of tests (unit/feature/integration) to ensure software quality 4. Apply software design principles, such as 12-factor app, to ensure software quality 5. Ensure sustainability and performance of applications by working with SRE to define SLI/SLO and providing metrics for monitoring/alerting 6. Collaborate with peers in design, pair programming and code reviews 7. Willing to learn new IT technology

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. The Facility Computer Integrated Manufacturing Department (FDCIM) is part of the Intelligent Manufacturing Center (IMC) at TSMC. It is primarily responsible for the development and maintenance of the following products: Development and maintenance of manufacturing-related report products for wafer fabs.Development and maintenance of engineering-related report products for wafer fabs.Development and maintenance of digital operation system products for facility management.Development and maintenance of big data application system products for facility management.Development and maintenance of facility management AI and machine learning related algorithm development and application system products. Responsibilities: FDCIM also employs software engineering and modular development techniques, combined with high-performance database application technologies, to develop systematized software with a unified version control system that accommodates different time zones and languages globally.In addition to its regular software product development work, FDCIM is also engaged in the research and development of new technologies, including the application of DevOps, Microservices, MLOps, AIOps, and more. Develop and maintain AI/ML systems and algorithmsCollaborate with cross-functional teams to identify and solve business problems using AI/ML techniquesDesign and implement machine learning models and data pipelinesTest and validate AI models for accuracy, scalability, and efficiencyDeploy AI solutions to production environmentsStay up-to-date with the latest advancements in AI technologies and industry trendsWrite clean and efficient code using HTML, CSS, and JavaScriptOptimize web applications for speed and scalabilityTest and debug web applications across multiple browsers and devicesStay up-to-date with the latest front-end development trends and best practices

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. DWTD team is part of TSMC's Intelligent Manufacturing Center (IMC), composed of experienced engineers and developers who are passionate about simplifying complex processes and creating user-friendly solutions. We have extensive experience in processing automation projects and we are well-versed in the background of building workflow automation systems. The team is also include process domain experts and devops experts, who also played a important role in the conception of DWTD. With their combined expertise, the team has developed a low-code system that enables engineers to define clear SOP steps and build workflow automation faster, reducing the time and effort required for requirement confirmation and knowledge transfer between different organizations. The team's objective is not only to offer a low-code interface for establishing workflows but also to provide a user-friendly workflow validation and maintenance service to enable engineers to efficiently manage their workflows with minimal risk.Responsibilities: Product function design and system development/maintenance to realize TSMC's in-house low code platform for necessary digital transformation.Responsible for internal software product development and providing operation consideration design to improve development and manufacturing efficiency.Design and manage the high availability and high-performance systems to achieve non-stop FAB operations.Collaborate with product managers and FAB users to develop high-value requirements and deliver solutions for improvement of user experience on manufacturing, yield, tool and people productivity.

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. As an AI/ML Engineer, you will be a key member of a versatile team focusing on both algorithm development and platform implementation for TSMC’s RD, Fab, Business, IT, and Security functions to improve productivity and work quality. The role involves developing AI/ML solutions, implementing scalable platforms to support AI productionization, and maintaining the lifecycle of machine learning models. Responsibility:Common Responsibilities1. Collaborate with cross-functional teams of data scientists, ML engineers, and software developers. 2. Drive the complete AI solution development stages from data collection, exploration, and feature engineering to model evaluation and error analysis.3. Perform model lifecycle management to ensure the validity of models in production. 4. Exercise sound judgment in determining if business problems can be addressed through AI/ML and communicate results effectively to domain users. 5. Operate and maintain scalable, highly available AI platforms with continuous measurement and quality improvement to meet SLO/SLAs. Differentiated Responsibilities1. AI/ML Solution Development(1) Develop AI/ML algorithms that optimize manufacturing processes, improving productivity and work quality. (2) Explain AI/ML models to internal customers and conduct error analysis.2. AI Platform Development (1) Design and implement full tech stack solutions, including data-related technologies and AI platforms.(2) Develop tools, automation, and microservices to extend platform capabilities. (3) Manage container-based workloads and process high volumes of data in environments like Kubernetes.Additional information for the job: Job Location: Hsinchu Site, Taipei Office (Experienced only)On-call needs: On-call 1 week every 3 months The complete interview process includes:1. Manager interview2. Hackerrank test3. On-site personality and English test(which could be replaced if you have script of officially English test) 4. HR interview5. Second manager interview (Optional assessment)6. Technical review (Optional assessment)

【職務內容】 1.配合公司部門需求，開發/撰寫適用之系統，以優化相關作業。 2.從前端頁面到後端資料庫建置、管理與後續維護公司內部系統(帳務系統、業務系統...等) 【必備條件】 -熟悉 C#、Javascript、VBA、VB6 -具備網頁設計經驗 -具備TOEIC 600分以上英文能力 【加分條件】 1.熟悉 Microsoft 相關產品 (Windows, Microsoft Office Excel VBA) 2.了解企業之 ERP 流程 3.應屆畢業生具備程式設計相關實習經驗尤佳 【人才特質】 1.邏輯清晰有條理，能快速統整歸納。 2.具備問題分析與解決能力。 3.具備良好的跨部門溝通技巧與態度。 4.樂意持續精進，學習新的語言或技術。(公司定期安排外訓機會)

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. We are seeking outstanding engineers to join TSMC IT infrastructure team to build and operate IT advanced Data Center to support world-class semiconductor foundry.This team is responsible for designing, implementing and optimizing IT infrastructure towards software-defined computing, storage and networking with advanced cloud technologies.The successful candidate should have strong technical skills and dedication for operation excellence. Responsibilities: Your responsibilities include:1. Network/Storage Design and Management:(1) Design, construction, operation, and capacity planning of large-scale NAS storage/object storage. (2) Operate and manage network infrastructure, including LAN, WLAN, Firewall, and Proxy.(3) Design, implement, and manage scalable network architecture aligned with business goals and industry best practices. 2. Automation and Scripting:(1) Develop and maintain automation scripts for network configuration, monitoring, and management using tools like Ansible and Python. (2) Transform repeatable tasks into automation tools to streamline operations and maximize efficiency. 3. Application Development:(1) Develop state-of-the-art applications and refactor existing applications for improved performance and maintainability.(2) Write and implement tests (unit/feature/integration) to guarantee software integrity. 4. Monitoring and Troubleshooting:(1) Implement monitoring solutions to proactively identify and resolve network and application issues. (2) Perform root cause analysis and corrective actions to troubleshoot technical challenges, including Linux-related systems and logs (e.g., Go code/log analysis). (3) Infrastructure operation issues(network/server/storage/security) visualization and countermeasure planning. Additional information for the job:Job Location: Hsinchu Site, Taichung Site, Tainan Site, Taipei Office (Experienced Only)On-call needs: On-call 1 week every 3 months 1. Manager interview2. Hackerrank test3. On-site personality and English test(which could be replaced if you have script of an official English test)4. HR interview5. Second manager interview (Optional assessment)6. Technical review (Optional assessment)

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Role: We are seeking outstanding engineers to join TSMC IT infrastructure team to build and orchestrate cloud services to support world-class semiconductor foundry. This team is responsible to design, implement and optimize IT infrastructure toward software-defined computing, storage and networking with cloud technologies. The successful candidate should have strong technical skills and dedication for operation excellence. Responsibilities: 1. Assist the cloud architect to refactoring or migrate the legacy systems as cloud native services. 2. Participate in architecture planning and build cloud environment with cloud architects, project technical support, enterprise solutions based on Azure, AWS or GCP 3. Effective use of professional domain knowledge to assist in maintenance and troubleshooting 4. Cloud services technical support

Ready for a Tech Adventure in Tokyo? Join Our Internship Program – 4-6 Weeks of Software Engineering Internship Await! Join HENNGE’s Global Internship Program (GIP): Full Stack Software Engineering Pathway in Tokyo, Japan. This unique 4-6 week internship at our Shibuya headquarters offers you personal and professional growth in an internationally diverse environment. In HENNGE’s GIP: Full Stack Engineering Pathway, you will acquire practical application development skills using Python, Go, and/or TypeScript. GIP will provide you with hands-on experience using state-of-the-art cloud platforms such as Amazon Web Services, offering a full stack experience for application development. Our primary working language is English, so no Japanese is required. Interns are expected to join the program at our Shibuya headquarters in Tokyo for 4-6 weeks, Monday to Friday, from 10 AM to 7 PM (JST). While the program is unpaid, we provide comprehensive subsidies, and outstanding participants may be offered full-time employment opportunities. If you are interested in HENNGE’s GIP: Front-end Engineering Pathway instead, please check it out here:https://www.cake.me/companies/hennge/jobs/gip-frontend Internship Details Build end-to-end solutions using Python, Go, and/or TypeScript.Explore full stack development, cloud computing, and distributed systems.Internship Flow:Weeks 1-3: Full Stack TrainingWeek 4: DevOps TrainingWeeks 5-6 (conditional): Special Assignment - a unique project for each intern and specific to their batch. Benefits Round-trip airfares from and back to your country of residencePre-arrival support and visa guidanceMedical insurance* and a phone with mobile data will be provided during your internship in Tokyo, Japan**Up to 150,000 JPY of monthly subsidy to cover accommodation, meals, transportation, and networking activitiesSubsidized company events on top of monthly subsidy (Monthly Technical Sessions, Board Game Night, Get-to-know-you Lunches, and many others!) to get to know teams across divisionsAccess to online learning platform during the internship period * Medical insurance will only be provided to interns who do not reside in Japan** This internship is an unpaid training program with a subsidy provided to all interns Internship scheduleBatch 3 (2026): Jun 1 - Jul 10 (6 weeks) - Full stack Engineering PathwayBatch 4 (2026): Aug 3 - Sep 11 (6 weeks) - Full stack Engineering Pathway

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.As a platform engineer, you will focus on designing, implementing, and maintaining scalable features and services on the platform to support the productionization of applications that supportthe company’s RD/Fab/Business/IT/Security functions to improve the productivity and work quality. Responsibilities: Your responsibilities include:1. Automation and Scripting(1) Develop and maintain automation scripts for configuration, monitoring, and management using tools such as Ansible and Python.(2) Transform repeatable tasks into automation tools to streamline operations and maximize efficiency.(3) Implement Infrastructure as Code (IaC) to automate resource provisioning and CI/CD workflows. 2. Application Development (1) Develop scalable cloud-native microservice architectures for IT applications.(2) Develop state-of-the-art applications and refactor existing ones to improve performance and maintainability.(3) Apply software design principles, such as 12-factor app, to ensure sustainability and quality.(4) Write and implement tests (unit/feature/integration) to guarantee software integrity. 3. Monitoring and Troubleshooting (1) Implement monitoring solutions to proactively identify and resolve network and application issues.(2) Conduct root cause analyses and apply corrective actions to troubleshoot technicalchallenges, including Linux-related systems and logs (e.g., Go code/log analysis).(3) Lead evaluation and adoption of new IT technologies for continuous improvement. 4. (Optional) Network Design and Management (1) Operate and manage network infrastructure, including LAN, WLAN, Firewall, and Proxy.(2) Design, implement, and manage scalable network architecture aligned with business goals and industry best practices. Additional information for the job: Job Location: Hsinchu Site, Taichung Site, Tainan Site, Taipei Office (Experienced Only)On-call needs: On-call 1 week every 3 months The complete interview process includes: 1. Manager interview2. Hackerrank test3. On-site personality and English test (which could be replaced if you have script of an official English test)4. HR interview5. Second manager interview (Optional assessment)6. Technical review (Optional assessment)