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與潛能的最佳平台。 ▋ 實習期間及實習地點 -實習期間：2025年07月至2025年08月 -實習地點：新北市中和封測廠 ▋ 封裝工程師實習職務說明 Business Summary: SC Packaging organization creates innovative technologies that enable small package sizes, enhanced reliability, and increased performance in areas including power density, isolation, an

Minimum qualifications: Bachelor's degree or equivalent practical experience. 5 years of experience in printed retail packaging manufacturing for consumer electronics industry. Preferred qualifications: 3 years of experience as a Supplier Development Engineer, in Packaging, or similar. Knowledge of retail type electronic device packaging manufacturing quality control. Familiarity with color control and press check. Excellent troubleshooting, statistical process control, failure analysis, and pro

POSITION SUMMARY You will plan new product development projects to be launched on time, with effective cost with no major qualify issues and in compliance with Nestle and local regulations as well as improve existing products. A DAY IN THE LIFE … • Trial for validation of new packaging and changes in specifications. • Support shelf-life, storage handling, laboratory and transport tests for validation of new packaging. • Conduct value analysis; identify and recommend cost reduction and source opt

Ditempatkan di Perusahaan Paper Packaging menawarkan produk ke Toko, Hotel, dan Cafe Berorientasi terhadapt target penjualan

MAIN PURPOSE OF JOB: - As a key person in process team supporting the project lead working through all the design, implementation and start-up phases of project, have close alignment and collaboration with multiple stakeholders through the project life cycle - The role is to deploy & develop the filling & packing line from either technical center or supplier to meet the project requirements in terms of quality, scope, timing and cost. - Deliver expertise to project in area of filling & packing o

Micron, top semiconductor company in the world, is hiring STEM talents in Vietnam. 🇻🇳 Click "Apply Now" to grab a chance for the speed Interview in HCMC & Hanoi! (If you haven't signed in Cake, please sign in first.) The form will be closed once the registration is full! Register now! 📍 About Micron Technology, Inc. As one of the top memory semiconductor company in the world, Micron is an industry leader in innovative memory and

Hello Cake & Ice Cream is looking for an experience creative designer to join the team

We are seeking a highly skilled and motivated Package Product Engineer (PE) to join our innovative team. The successful candidate will play a vital role in enhancing the assembly-related coverage within manufacturing processes to improve Time 0 and Field Defects Per Million (DPM) and reduce inline fallout. This position requires collaboration with cross-functional teams to drive cumulative yield ownership and implement initiatives for overall yield and quality improvement. • Semiconductor Packag

1.具封裝產品開發經驗，熟悉半導體封裝製程 2.具系統級封裝經驗為佳 3.具扇形封裝經驗後段經驗- SMT 製程、 Molding 製程、 SiP 製程相關站點 【薪資說明】 ◎依學經歷、科系、經驗相關性、特殊需求證照

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