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【Hour Loop 飛輪電商】在2013年成立，並於2022年初在美國那斯達克上市。作為亞馬遜 (Amazon) 第三方賣家，我們的工作不只廠商開發，還包括商品上架、價格制定，以及物流與庫存管理，通通一手包辦。 在百萬競爭對手中，我們透過獨特的營運模式，成功實現十年來的持續成長，並脫穎而出，在2022年底躍升為亞馬遜 (Amazon) 前十名的賣家！ 我們提供彈性且暢通的職涯管道，不綁年資，端看績效表現，從「獨立貢獻者」到「管理職」適性發展！如果你喜歡打磨自身專業能力，鑽研獨立的工作項目，便適合獨立貢獻者的角色；若你有準確遠見，善於溝通和帶領團隊，你可能就是未來的帶人主管！ Job Description 1. Analyze market sales data and seasonality to discover potential products. 2. Assist senior business managers in developing purchasing strategies to maintain inventory levels. 3. Track the sales performance of products. 4. Calculate the potential profits of products to provide the best purchase advice. 5. Maintain product profit margins through pricing strategies. 6. Improve workflows by collaborating with teams to design scalable, efficient solutions through data analysis and automation 7. Use data-analysis tools (e.g., SQL, Python, R Language) to identify root causes and validate ideas Requirements Improve workflows by collaborating with teams to design scalable, efficient solutions through data analysis and automation Use data-analysis tools (e.g., SQL, Python, R Language) to identify root causes and validate ideas Strong problem-solving skills

As a GQ (Global Quality) Package Reliability Engineer at Micron Technology Inc., we are primarily responsible for package quality and reliability for Micron’s product lines working end to end for DRAM and HBM, provide inputs and approve phase gates, HVM monitoring and dispositions. This responsibility includes coordinating package qualification efforts for new products and when new designs, materials, or processes are introduced and providing recommendations on product release based on reliability test results. You will also be encouraged to devise reliability test plans to assess risk associated with excursions, conversions, and reliability and qualification issues. You will coordinate root cause and corrective action efforts within the GQ department for package related qualification and GCP failures and prepare reports for discussion and escalation. You will also engage in phase gate review starting from design to production release and ensure CTQ compliance and inline validation. Successful candidate for this position will have: Detailed knowledge of semiconductor component package assembly processes and challenges in particularly HBM and 3DS packages. Understanding of mechanical and material interaction effects on reliability of IC components and/or Printed Circuit Assemblies (PCB) assemblies Good understanding of the effects thermo-mechanical, thermal, mechanical, and hygroscopic swelling stresses on package reliability A proven understanding of industry standard reliability test methods, acceleration models used for life predictions, and sampling statistics preferred. Must be self-motivated, able to work independently, and detail oriented. Strong analytical problem-solving skills, excellent multi-tasking skills and the ability to interact easily with other groups. Good written and interpersonal skills, digital literacy are vital. proven understanding of the software systems employed in backend manufacturing and analytics is a plus like MAM, MES, JMP, Tableau etc.