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1. 生產設備維修、點檢，維持設備正常運轉 2. 生產異常之設備狀態,數據收集分析及改善，提昇機台能力 3. 設備改機調機、一般保養 4. 新設備/新 tool 評估, 採購規範撰寫及驗收 5. 設備保

如欲投遞履歷,請上Amkor官網 https://careers.amkor.com.tw/ Job responsibilities for this position includes physical design/layout in FC and Wirebond substrate based technology, package selection, and design rule implementation. This involves optimizing system co-design of IC and Package, IC floor-planning, ball array optimization to meet signal & power integrity, assembly, and thermal constraints.

執行Bumping設備基礎保養、RFC修機，維持生產設備穩定。 1. 基礎保養、換部品、化學品 2. MP-Alarm 處置- RFC修機

執行Bumping設備進階保養、non RFC修機、repeat設備導入、NPI部品更換與展機微調，以維持生產穩定。 1. 設備進階保養、校正 2. None RFC修機 3. 庫存監控、盤點 4. NPI-部品更換 5. NPI-展機-機台微調 6. 裝機、機

MAIN PURPOSE OF JOB: - As a key person in process team supporting the project lead working through all the design, implementation and start-up phases of project, have close alignment and collaboration with multiple stakeholders through the project life cycle - The role is to deploy & develop the filling & packing line from either technical center or supplier to meet the project requirements in terms of quality, scope, timing and cost. - Deliver expertise to project in area of filling & packing o

This role will lead the Package Design Project with R&D team members and deliver advanced and innovative packaging resolutions to clients. (Flip-Chip) 1.Package RFQ and structure & BOM selection. 2.Direct material evaluation and survey. 3.FA and Reverse Engineering. 4.Package design rule maintain & update. 5.Advance products design / NPI projects development. 6.Research & setup package roadmap / material roadmap.

A. Package design 1. Package RFQ for cost estimation 2. New device package feasibility & technical risk assessment 3. Package structure, BOM design 4. Package design rule setup & update 5. Coordinate DR0 design review meeting 6. PKG structure confirmation after setup B. Package research & development 1. Research & setup package roadmap / material roadmap 2. New package development 3. New material survey & capability development 4. Setup direct material purchase specification

This role will lead the Package Design Project with R&D team members and deliver advanced and innovative packaging resolutions to clients. (Flip-Chip) 1.Package RFQ and structure & BOM selection. 2.Direct material evaluation and survey. 3.FA and Reverse Engineering. 4.Package design rule maintain & update. 5.Advance products design / NPI projects development. 6.Research & setup package roadmap / material roadmap.

．New process/ capability research & development ．New tool/ material evaluation (Photo process) ．Transfer new technology to mass production