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Packaging Engineer
Internship
Logo of Malaysia Youth.
Job Description - Work on OEE Improvement project for Wire bond process. Support Equipment engineer in MC Performance/Qualification, Work/Time Study, Capacity analysis & planning, Layout planning & execution - Gain technical knowledge on the identified tool and work with engineers, operators, and technicians. - Process Optimization: Support Process engineer in performing DOE, Wire bond Validation, Wire bond Assessment, Data Collection, Analysis and Report Compilation. Qualifications - Education
No requirement for relevant working experience
No management responsibility

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