12月 2020 - 現在
Nangang District, Taipei City, Taiwan
• Responsibilities :
1. Manage Mechanical/Acoustic/Audio related affairs of projects for ODM operations.
2. Coordinate with audio vendors to ensure optimal audio performance of products, resulting in improved sound quality and enhanced user experience.
3. Arrange DOEs with ODM for project mechanical/acoustics performance optimization.
4. Collaborate with cross-functional teams to resolve mechanical, acoustic, and audio issues, achieving resolution for projects within deadline and improving product reliability.
5. Utilize ANSYS Sound software to discriminate issue attributions. Manipulated the state-of-the-art spiral mics arrays method (AI acoustic camera) for root-cause finding.
6. Review Speaker performance related design and mic structure design with ODM. Provide optimal orientation for best conferencing experience and hearing sensation.
7. Review Mechanical defects, deformation, dimension control capabilities(CpK) & CMF accomplishment for each development stage.
8. Conduct feasibility studies in early stage for future development and roadmap mapping.
• Achievement :
1. Led HP TDC ME team members in conducting a comprehensive analysis of product structural modal behavior and keyboard usage response, translating findings into actionable insights to inform product planning.
2. Accomplish mechanical/acoustics/audio development of 6+ Elitebook 8/X series NB and 3+ workstation NB for RTP (production).
3. Produce acoustic sensation analysis & issue orientation for new test standard creation.
4. Introduce AI acoustic visualization capabilities to enhance process and cost reduction.
5. Submit 4 patents annually, get 2 awards (US11599190, US11747899) & 1 patent pending.
6. Earn 2022 HP mechanical innovation campaign winner.
7. Served as a presenter at CADMAN Inc. and ANSYS Inc. tech forums and acted as an umpire for technical paper competitions, demonstrating subject matter expertise and industry leadership.
8. Delivered lectures at CADMAN Inc. Annual Tech Forum (2022/2023/2024) and ANSYS Inc. Innovation Forum (2021/2022), sharing expertise in acoustics and mechanical debugging to industry professionals. Presenting ME innovation in HP Tech Forum with high glorification.