Nov 2019 - Present
- Led development of 250+ new products, including design, specifications, manufacturing processes and yield improvement, contributing to 14% revenue growth in 2024.
- Engineered 12-inch wafer-level optical glass products for advanced packaging applications, achieving 94-99% yield rates in initial mass production after certification by tier-1 IC design companies.
- Improved 12-inch wafer cleaning equipment, increasing defect removal rate from 80% to 99% while reducing process water consumption by 73%.
- Modified 8-inch optical coating equipment to accommodate 12-inch products while maintaining film thickness uniformity of 2nm, requiring only 45% of the investment compared to new equipment.
- Established Advanced Product Quality Planning (APQP) processes, including FMEA/CP/MSA/SPC/PPAP, leading to successful IATF 16949 certification in 2024.
- Led yield improvement projects, evaluating and implementing 12-inch AOI defect detection systems, reducing defect density from 0.7 to 0.02 ea/mm² and improving product yield to 98%.
- Designed and manufactured light-shielding optical components incorporated into consumer electronics mobile products launched in 2021.
- Built and managed engineering team, interviewing and training 70% of new engineers while overseeing project schedules and work allocation.
- Assessed equipment and established 12-inch glass wafer production line, utilizing DOE, FEA (thermal/stress), failure/yield analysis and user interviews to improve equipment and manufacturing processes, designing 300+ components and reducing substrate thickness by 85% to 100μm.