Sep 2018 - Present
【Professional skills】
●3D Drawing | 2D Drawing |
Analysis(RSS / WC / 6 Sigma / Mold Flow / CAE)
●Mockup verification | BOM | Tooling DFM
Tryout (business trip ) | NPI (EVT, MVT, ATS) | Design optimize |
Review FAI, CPK, F/R Report
【Leadership and communication】
●Collaborate with Sales, PM, ID, HW, Thermal, RF, EMI, FAE.
Assist in process optimization for suppliers and assembly
factories.
●Assist in leading the team(4-8 team member) until successful
mass production.
【Achievement】
2024 | At COMPUTEX , 3 projects that I participated in designing
and developing were showcased.
2024 | Patent research and structural innovation.
2024 | In the R&D department, I held an educational training role,
laying the foundation for over 30 junior colleagues.
2023 | Invited to speak at TYCIA, the content was about sharing
the experiences of mechanical engineer and product
design with 50 university students.
2023 | Verify the strength of different composite
processes(melt & bonding) on the same material and
draw specific conclusions.
2022 | Participating in MSI first project involving transparent
appearance material, bringing the ideals of PM and ID to
life, was a memorable experience.
2022 | Optimize assembly time by 15% and save 30% of cost
across different project.
2021 | In the bonding process, designed the thinnest plastic
thickness and successfully mass-produced.
2021 | Selected as a member of the annual flagship laptop
project and completed mass produced.
2020 | Participate in the project of NEC's first use of bonding
process and successfully mass produced.