Led design and development of eMMC/eMCP/ePOP products (including 32+16 ePOP with total thickness 0.8 mm and 0.65 mm). Coordinated with IC suppliers and firmware developers, introduced 2DID CODE marking for ePOP series, managed FW validation in in-house lab, handled customer FA cases, supported PMs, oversaw pre-production (ES, QAT, PP lots) and post-production defect analysis. Completed Dale Carnegie training and BCP/BIA/Risk Assessment.

Designed power solutions (Flyback, Buck, Boost, Buck-boost) and PCB layouts; resolved EMI & EMC issues; communicated with clients on design and troubleshooting; maintained technical documentation (BOM, ATE setups, manufacturing process files); performed production-line failure analysis, repairs, and root-cause corrective actions; developed power solutions for battery-powered devices, household appliances, consumer electronics, and automotive systems.

Performed on-site maintenance and repair of office equipment for corporate clients; diagnosed and resolved technical issues; handled product delivery and consumables promotion; processed payment transactions; acted as technical liaison between clients and internal teams to ensure service quality and timely issue resolution.