Currently serving as an R&D substitute service engineer, I have gained comprehensive hands-on experience across the entire semiconductor packaging process — from early-stage design, mid-stage process development, to final testing. This opportunity has given me a deep, end-to-end understanding of the semiconductor industry. · Designed NPI cases according to customer requirements, including new product design, risk assessment, and in-house capability evaluation. Served as the primary point of contact with customers to discuss technical requirements and independently completed assigned tasks. · Coordinated with all relevant internal teams to propose overall NPI design solutions, conducted feasibility and risk assessments, and planned the full packaging process flow. · Investigated NPI case abnormalities post-implementation — analyzing material and design issues, proposing DOE plans, and leading internal discussions to reach consensus before conducting experiments. Summarized results and presented findings and next steps in company-wide review meetings. · Continuously researched new packaging technologies as part of my R&D responsibilities. Regularly prepared technical reports on new processes and packaging formats to keep internal teams up-to-date. · Designed advanced packaging solutions, including FCBGA, FCCSP, FOPLP, and CoWoS.