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gary shih
副理 @ 台灣美光晶圓科技股份有限公司
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gary shih

副理 @ 台灣美光晶圓科技股份有限公司
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台灣美光晶圓科技股份有限公司
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國立中正大學

專業背景

  • 目前狀態
    就職中
  • 專業
    製程工程師
    製程主管
  • 產業
    半導體
  • 工作年資
    15 年以上 (小於 1 年相關工作經驗)
  • 管理經歷
    我有管理 15 人以上的經驗
  • 技能
    PowerPoint
    Word
    Excel
    Microsoft Office
  • 語言能力
    English
    進階
  • 最高學歷
    碩士

求職偏好

  • 預期工作模式
    全職
    對遠端工作有興趣
  • 希望獲得的職位
  • 期望的工作地點
    台灣台北市
    台灣桃園市
    台灣新竹市
    台灣新北市
  • 接案服務
    不提供接案服務

工作經驗

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副理

2006年12月 - 現在
Responsible for providing guidance to work unit and advising supervisors on related issues. Ensure timely, accurately and quality execution of tactical plans, and effectively utilize work unit resources to achieve end results. Achievements: •Consistently achieved (or surpassed) the production capacity Max Out (5%~10% capacity increased) and mature yield goal (Yield reach 90% above) with reduced engineer workload (1100hrs/week), and achieved department's cost-saving goal of 10% for three consecutive years which resulted over US$12M raw material cost saving in total. •Provided the solution and defined BKM (Best Known Method) recipes for yield enhance to 90% above by defect improvement on various technologies (25nm to 12nm) - Nitride/Poly/Oxide/Anneal process of Furnace equipment (TEL/Kokusai) and ALD Oxide process of single-wafer equipment (ASM XP8/LAM Striker). •Led the team to successfully convert the manufacturing systems from Inotera to Micron. The complex project took more than half year to learn and set up the new manufacturing system, one month for functional test and two weeks for system conversion. •Despite of the inability of face-to-face communication and inconvenient working environment caused by COVID19 manpower diversion (AB team), team’s engagement score improved by 15 points during 2021 and 2022. •By introducing an effective training management and certification method, implemented new hires training system of PEE (Process Equipment Engineering) division, completed 120 new hires training (20% headcount increase due to new technology conversion) in one year. •Developed and implemented an effective NPW (Non-Product Wafer) change PCRB (process change review board) platform for quality maintenance, avoiding the production yield impact due to the change of NPW. •Designed and implemented a process for internal audit of PEE (Process Equipment Engineering) division to improve quality mindset of engineers and hence reduced the quality loss from average 2~3 cases to 1 case per year due to human deviation.
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專案經理、製程工程師

2005年2月 - 2016年12月
11 年 11 個月
Responsible for complex and high technical oriented project management, providing problem-solving ideas and defining new standards for others to follow. Achievements: •Led a team to deep dive new ideas for capacity max out on diffusion department and ultimately achieved a 10% capacity increase and rapid mass production after the conversion of new technology. •Introduced single-wafer ALD process equipment (ASM XP8) into the factory. By process step simplification, and process stability by R2R function, made improvements of maximizing production capacity by 5% and raw material cost reduction by US$0.2M per year. •When a major quality related process problem occurs, played the role to quickly set-up a task force to minimize the impact of the event, identify the root cause and provide corresponding solutions and prevention measures.

學歷

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科學碩士(MS)
物理
2001 - 2003
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理學士(BS)
物理
1997 - 2001
社團活動
慈暉社

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