Achievements :
Introduced a new process of glue wiping machine and glue wiping to reduce the abnormal rate of glue overflow from 3% to 0.5%, and improve the yield rate to reduce Rework.
Job descriptions :
1. Equipment Troubleshooting and Maintenance
=> Maintain and improve equipment for underfill and underfill clean machine, and eliminate equipment abnormality; in addition to maintenance and elimination of abnormal equipment such as implantation machine, reflow, cleaning machine, plating machine, and inspection equipment.
2.Underfill clean tool (glue wiping machine) project management and introduction.
=> Cross-departmental communication and cooperation to complete the project and introduced into the production line to effectively solve the overflow anomaly, reduce the defective rate.
3. Write SOPs for the use and maintenance of the wiping machine.
4.Discuss and test underfill clean process recipe with equipment vendors and manufacturing process.