Responsibilities ○Led hardware design from schematic to EVT/DVT, reducing design iterations by approximately 30% through early integration of firmware requirements, proactive resolution of mechanical constraints with ME, and prompt mitigation of validation issues. ○Transformed IC reference designs into production-ready PCB platforms, optimizing signal integrity, power efficiency, and cost through close collaboration with layout and supplier engineers. ○Drove root-cause analysis and implemented design fixes for electrical and mechanical issues pre-NPI, increasing validation efficiency by 10% and ensuring a seamless transition to mass production. Projects Consumer Brand (Tier1 customer) USB 3.2 Gen2 (10Gbps) / Gen2x2 (20Gbps) – Supporting TLC NAND up to 4TB (X9Pro/X10Pro) USB 3.2 Gen2 (10Gbps) / Gen2x2 (20Gbps) – Supporting QLC NAND up to 8TB (X6/X8/X9/X10) ○Cost Optimization – Achieved 99.7% production yield through BoM optimization, DFM-oriented layout refinement, and minimized design iterations. ○High-Speed PCB Layout Optimization – Developed ergonomic, mass-producible PCB stack-up with optimized component placement and balanced high-speed routing for signal integrity. ○Board-Level Implementation – Converted IC reference designs into manufacturable PCB platforms, improving signal integrity and power efficiency. ○Reliability Assurance – Ensured design robustness through cross-functional validation; product achieved 4,000+ Amazon reviews with an average 4.5★ rating. USB 4 Gen3x2 (40Gbps) – Supporting TLC NAND up to 4TB (no bus switch) or 32TB (with bus switch, estimated) ○Cost Optimization – Optimized BoM during prototype development to reduce material cost and streamline validation. ○Design Enhancement – Developed high-speed PCB layouts with mass-producible stack-up, optimized component placement, and routing for superior signal integrity. PCIe Gen5, M.2 2280 – Supporting TLC NAND up to 4TB ○Cost Optimization – Optimized BoM during prototype development to reduce design iteration costs. ○Design Enhancement – Developed PCB layouts with mass-producible stack-up, optimized component placement, and balanced high-speed routing for signal integrity.

Responsibilities ○Led memory module design and validation across SATA/USB/SD interfaces, driving cross-functional initiatives with firmware, reliability, and mechanical teams to achieve optimal speed, power efficiency, and thermal compliance. ○Transformed controller and NAND reference designs into manufacturable modules, optimizing PCB layout, SI/PI performance, and early risk mitigation to support reliable mass production. ○Drove cross-functional qualification and root-cause analysis, resolving design constraints and thermal/stress issues ahead of NPI, boosting development efficiency and production readiness. Projects Designed custom SATA 3.0 (2.5") and M.2 2280 SSD solutions based on SMI controllers Developed custom CFA 6.1, USB 3.0, and SD 3.01 storage solutions using third-party controllers

Responsibilities ○Led the development of custom RDK and test platforms for SSD/USB/SD controller validation, enabling rapid prototype deployment and successful IC verification, while providing critical documentation for controller datasheets and application notes. ○Transformed Xilinx FPGA evaluation boards into robust hardware validation platforms, enabling precise SI/PI and functional testing, and authored PCBA application notes to guide cross-team usage. ○Drove cross-functional problem-solving between firmware and silicon teams, leading to timely resolution of bring-up and design issues and consolidation of test results into controller datasheets to ensure consistent technical alignment and product readiness. Projects AU87100(USB 3.0 Flash Controller) AU7510/AU7511(SATA 3.0 Flash Controller)

Responsibilities ○Led BoM management and updates for IP cameras and high-speed domes, ensuring accurate ERP tracking and smooth NPI preparation. ○Transformed design lists and engineering changes into manufacturable BoMs, supporting efficient validation builds and system testing. ○Drove PCBA assembly and cross-functional reviews, identifying and resolving hardware issues early to ensure timely prototype readiness and accelerate product release. Projects DH720(Indoor)/DH820(Outdoor)