2016年8月 - 現在
Yield and Electrical test improvement
Improve the process window with 0% yield loss from speci c processes for nger-print product.
Make resistance in customer acceptance spec from NO wafer to ALL wafers to meet fab- out rules. This
project won 3rd place in the 2019 intracompany engineering report competition.
Electrical data collection
Hold Fab Statistical Process Control SPC meeting to monitor stability of key products.
Collect device modeling data to nd process improvement points for transferred products.
Customer and Cross-department communication
Possess experience with American customer transferring products from another foundry.
Co-work with other departments engineering, simulation, research and development teams, etc for
engineering issue solving.
Goal-oriented, aim for customer requirements and satisfaction