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Ken Chen
Thermal Engineer
I’m a thermal engineer with 12+ years of hands-on experience in heat transfer, CFD simulation, and IC package/system-level thermal design. My background spans across leading companies such as Alchip, Wistron, Foxconn, and Delta, where I’ve worked on thermal solutions for APs, switches, servers, and advanced IC packaging (2.5D/3DIC, CoWoS).
I specialize in:
-System & package-level thermal architecture
-CFD modeling (Flotherm, ANSYS, 6SigmaET, Celsius)
-Cross-functional collaboration (ME, EE, PM, ID, Layout)
-Thermal validation and optimization from EVT to MP
I enjoy solving complex thermal challenges and delivering practical solutions that balance performance and manufacturability. I’m always open to connecting with other engineers, technologists, and innovators in the semiconductor and electronics industry.
Alchip Technologies
National Taipei University of Technology
新北市, 台灣
Taiwan
Featured Resume
Uploaded on Apr 27th 2025
Uploaded on Apr 27th 2025
Professional Background
- Current StatusEmployed
- ProfessionPackaging Engineer
- FieldsSemiconductor
- Work Experience10-15 years (10-15 years relevant)
- ManagementI've had experience in managing 1-5 people
- Skills
- LanguagesEnglish・IntermediateChinese・Native or Bilingual
- Highest Level of EducationMaster
Job Search Preferences
- Current StatusReady to interview
- Desired Job TypeFull-time・Interested in working remotely
- Desired Positions熱傳工程師(Thermal Engineer)
- Desired Work LocationsTaipei City, Taiwan
- FreelancePart-time freelancer
Work Experience
Staff Package Thermal Engineer
New Taipei, Taiwan
-Define thermal/mechanical specs for 2.5D/3D IC packages (BGA, CoWoS, SOIC, SOC) with cross-functional teams.
-Optimize thermal performance via CFD modeling (Cadence Celsius, ANSYS Icepak, Flotherm) for next-gen IC designs.
-Conduct thermal hotspot analysis and design custom heatsinks, boosting efficiency for clients in China and North America.
-Analyze thermal/mechanical behavior of flip-chip packages and substrates for robust, reliable designs.
-Key Achievements:
-Reduced junction temperatures by 15% in 3D IC packages through advanced thermal modeling.
-Ensured on-time delivery of thermal specs, enhancing global client collaboration.
Thermal Engineer
New Taipei, Taiwan
-Led thermal design for 1U/2U/4U server cooling systems, including heatsink design, fan selection, air shroud optimization, and airflow management for Dell.
-Performed thermal simulations using Flotherm and built mock-up systems for concept validation, ensuring compliance with stringent thermal requirements.
-Managed thermal and airflow validation for real server systems, coordinating with electrical, mechanical, and software teams to resolve issues.
-Key Achievements:
-Optimized server cooling designs, achieving a 20% improvement in airflow efficiency for 2U systems.
-Acted as thermal project manager, conducting regular client meetings to align on project milestones and deliverables.
Thermal Engineer
New Taipei, Taiwan
-Conducted early-stage thermal simulations for WiFi access points and switch routers, supporting Cisco’s indoor (80%) and outdoor (20%) product lines.
-Reviewed thermal modules, fan designs, and protection settings across EVT, DVT, PVT, and MP stages, resolving thermal issues through cross-functional collaboration.
-Coordinated with vendors and clients to ensure smooth project execution, managing placement and stacking for 30 AP systems and 3 switch systems.
-Key Achievements:
-Reduced thermal bottlenecks in WiFi AP systems by 10% through iterative CFD analysis and design optimization.
-Enhanced client satisfaction by delivering thermal solutions on time, strengthening Foxconn’s partnership with Cisco.
Mechanical Engineer
New Taipei, Taiwan
-Designed axial fans and blowers for applications in refrigerators, vacuum cleaners, industrial systems, and projectors.
-Conducted airflow simulations using ANSYS Fluent to optimize fan performance, reducing turbulence and improving efficiency.
-Managed structural evaluations, material selection, and packaging design, ensuring product reliability and manufacturability.
-Key Achievements:
-Improved fan efficiency by 12% through airflow optimization, contributing to Delta’s competitive edge in industrial applications.
-Collaborated with manufacturing teams to achieve seamless mass production, meeting tight project deadlines.
Education
航太與系統工程學系