1.HBM project HTOL/ELFR reliability hardware /Die carrier build up 2.HBM core die wafer process reliability estimate 3.HBM Thermal/warpage /current simulation 4.TD Level Yield improvement and reliability risk assessment

1.SIP (System In Package) sensor assembly process development 2.Proximity sensor ,Ambient light sensor testing system development 3.SIP sensor final testing system and handler building and NPI engineering activities. 4.SIP Sensor Reliability engineering perform and testing result evaluation 5.SIP Sensor HTOL, THB DUT Board , Burn in Board and load board circuit design and development 6.Tester GRR correlation Major Achievements  Proximity sensor test system build and fixture optimized for ALS, PS, and open air sites  Proximity sensor reliability engineering design and develop for HTOL and THB test item  Patent “ A fixture for light sensor reliability sensor test”

1.開發中COW (Chip on wafer) 電性測試資料分析 2.電性故障分析與良率資料分析 3.開發中測試晶片(UPTC) C3D 與C4D良率提升與失效分析 4.HBM 記憶體晶片故障分析與良率提升 5.可靠度失效分析 6.SWR 工程實驗(針對low yield原因進行SWR 工程實驗) 7.實驗室建立管理(EFA實驗室建立以及tester與probe card的order與管理) Major Achievements  HBM2e Yield achievement above 90%  HBM2e Reliability issue FA support  EFA lab build and management (2 uM3 tester and probe card order and design)

1.專案執行 2.長晶爐設備/圓磨機設備數位化研發 3.老舊零件second source供應商開發 4.停產設備零件尋求供應商開發 5.變壓器降低諧波效應節能與提升功率因數專案 6.無刷馬達改造專案執行 7,電性失效分析(Electronic circuit )與電路查修與維修方向建議 8.協助設備工程測試問題與產品硬體失效處理 Major Achievements  The crystal grower DC motor replace by AC servo motors  Process equipment control system upgrade

1.與RD討論Burn in board電路設計的可行性。 2.使用protel軟體設計PCB版，並將元件焊接至Burn in board 3.示波器，訊號產生器以及current meter等儀器驗證OLT電路與Burn in board 4.ESD測試(含HBM,MM,Latch up等測試) 5.Package level的可靠度測試等 6.實驗室儀器管理人 Motor control IC , DC-DC Converter IC HTOL and ESD reliability project perform and verification

1.90nm/0.11um/0.13um/0.18um OTP/MTP/Flash memory/SRAM/e-fuse/ROM/PWM IC/DMOS/UMOS/MOSFET/HVMOS /LED Driver產品良率提升與故障分析 2.New IP發展與產品驗證 3.產品良率分析(WAT inline-data CP FT data analysis) 4.產品故障分析(EFA+PFA) 5.良率分析EDA Tool correlation (WAT+ inline+lot notes) 6.data-log電性分析與測試issue判斷 7.RMA退貨分析與8D report報告協助撰寫

1.Loadboard repair 2.New Type release and correlation新產品導入 3.Reduce Retest rate and yield improvement降低重測率分析 4.Correlation and RnR 5.Test program modify and test method verification測試程式維護 6.Production Low yield ,O/S ,QA low yield analysis.良率分析 7.Europe busniess line customer services 8.Product reliability(loop test) and stress test